4 Pad Ceramic Package, 5 mm x 7 mm
Product Features:
Small SMD Package
AT Cut Perfomance
Compatible with Leadfree Processing
Supplied in Tape and Reel
ILCX04 Series
Applications:
Fibre Channel
Server & Storage
USB
802.11 / Wifi
PC’s
5.0
1
2
7.0
4
3
Frequency
6 MHz to 150 MHz
1.30 Max.
ESR (Equivalent Series Resistance)
6.0 MHz – 7.9 MHz
8.0 MHz – 9.9 MHz
10.0 MHz – 13.9 MHz
14.0 MHz – 19.9 MHz
20.0 MHz – 40.0 MHz
rd
30.0 MHz – 150.0 MHz (3 O.T.)
100
Max.
60
Max.
50
Max.
40
Max.
30
Max.
80
Max.
1
1.2
2
4
2.54
5.08
3
1.0
Connection Diagram
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
7 pF Max.
4
3
30
ppm Standard (see Part Number Guide for options)
50
ppm Standard (see Part Number Guide for options)
AT Cut
18 pF Standard (see Part Number Guide for more options)
100 uW Max.
5
ppm Max. / Year Standard
2.54
1
2
Recommended pad layout
2.2
1.4
6.4
Dimension Units: mm
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
ILCX04 -
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX04 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
D = -10°C to +105°C*
E = -40°C to +105°C*
18 pF Standard
Or Specify
- 20.000 MHz
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load
Capacitance
(pF)
Frequency
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
04/10/12_D
Specifications subject to change without notice
Page 1
4 Pad Ceramic Package, 5 mm x 7 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX04 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Frequency, Date Code
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
04/10/12_D
Specifications subject to change without notice
Page 2
FPGA/CPLD
