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ILCX07-JF1F18-20.000

4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm

厂商名称:ILSI

厂商官网:http://www.ilsiamerica.com

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4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
Product Features:
Low Cost SMD Package
Low ESR
Compatible with Leadfree Processing
ILCX07 Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
5.0
4
3
3.2
1
2
Frequency
ESR (Equivalent Series Resistance)
8.0 MHz – 9.9 MHz
10.0 MHz – 11.9 MHz
12.0 MHz – 15.9 MHz
16.0 MHz – 19.9 MHz
20.0 MHz – 23.9 MHz
24.0 MHz – 50.0 MHz
rd
40.0 MHz – 150.0 MHz (3 O.T.)
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
8 MHz to 150 MHz
1.3 Max.
1
2
100
Max.
80
Max.
60
Max.
50
Max.
40
Max.
30
Max.
80
Max.
5 pF Max.
30
ppm Standard (see Part Number Guide for more
options)
50
ppm Standard (see Part Number Guide for more
options)
AT Cut
18 pF Standard (see Part Number Guide for more options)
500 uW Max.
4
4
0.9
4
3
1.2
Connection Diagram
3
1
2
Recommended pad layout
2.0
3
1.2
5
ppm Max. / Year Standard
2.2
1
2
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
3.7
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
ILCX07 -
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX07 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
D = -10°C to +105°C*
E = -40°C to +105°C*
18 pF Standard
Or Specify
- 20.000 MHz
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
04/10/12_B
Specifications subject to change without notice
Page 1
4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX07 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
12 +/-.3
8 +/-.2
5.5 +/-.2
13.5 +/-1 or
12 +/-3
60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (yww)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
04/10/12_B
Specifications subject to change without notice
Page 2
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