4 Pad Ceramic Crystal, 3.2mm x 2.5mm
Product Feature:
SMD Package
Small package Foot Print
Supplied in Tape and Reel
Compatible with Leadfree Processing
ILCX13 Series
Applications:
PCMCIA Cards
Storage
PC’s
Wireless Lan
Frequency
ESR (Equivalent Series Resistance)
10.0 MHz – 11.9 MHz
12.0 MHz – 15.6 MHz
16.0 MHz – 19.9 MHz
20.0 MHz – 23.9 MHz
24.0 MHz – 60.0 MHz
60.0 MHz – 150.0 MHz (3
rd
O/T)
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Operating Temperature Range
Storage Temperature Range
10 MHz to 150 MHz
250 Ohms Maximum
100 Ohms Maximum
80 Ohms Maximum
60 Ohms Maximum
40 Ohms Maximum
100 Ohms Maximum
3.5pF Maximum
(See Part Number Guide)
(See Part Number Guide)
AT Cut
8pF to 32pF or Specify
100µW Maximum
3ppm/Year
Maximum
(See Part Number Guide)
-40C to +85C
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
ILCX13 -
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX13 - FB1F18 - 20.000000 MHz
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
D = -10°C to +105°C*
E = -40°C to +105°C*
8pF to 32pF
Or Specify
- 20.000 MHz
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 03/20/18_K
Page 1 of 2
4 Pad Ceramic Crystal, 3.2mm x 2.5mm
Pb Free Solder Reflow Profile:
Ts max to T
L
(Ramp-up Rate)
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
Ramp-up Tate (T
L
to Tp
Time Maintained Above
Temperature (T
L
)
Time (T
L)
Peak Temperature (Tp)
Time within 5ºC to Peak
Temperature (Tp)
Ramp-down Rate
Tune 25ºC to Peak
Temperature
ILCX13 Series
3ºC / second max
150ºC
175ºC
200ºC
60 to180 seconds
3ºC / second max
217ºC
60 to 150 seconds
260ºC max for 10
seconds
20 to 40 seconds
6ºC / second max
8 minutes max
Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per Reel
A
B
C
D
E
F
Environmental Specifications:
3000
8.0 ±0.2
4.0 ±0.2
3.5 ±0.2
12.0 ±3.0
60 / 80
180
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2
MIL-STD-202, Method 215
Marking:
Line 1: I-Date Code (yww)
Line 2: Frequency
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 03/20/18_K
Page 2 of 2
FPGA/CPLD
