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ILCX19-GG9F32-26.000MHZ

Parallel - Fundamental Quartz Crystal,

器件类别:无源元件    晶体/谐振器   

厂商名称:ILSI

厂商官网:http://www.ilsiamerica.com

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
7243046552
包装说明
SMD, 4 PIN
Reach Compliance Code
compliant
其他特性
AT-CUT; TR, 7 INCH
老化
5 PPM/YEAR
晶体/谐振器类型
PARALLEL - FUNDAMENTAL
驱动电平
100 µW
频率稳定性
0.0025%
频率容差
25 ppm
JESD-609代码
e4
负载电容
32 pF
安装特点
SURFACE MOUNT
标称工作频率
26 MHz
最高工作温度
50 °C
最低工作温度
-10 °C
物理尺寸
L2.0XB1.6XH0.55 (mm)/L0.079XB0.063XH0.022 (inch)
串联电阻
60 Ω
表面贴装
YES
端子面层
Gold (Au) - with Nickel (Ni) barrier
文档预览
4 Pad Ceramic Package Quartz Crystal, 2.0mm x 1.6mm
Product Features:
Low Cost SMD Package
Ultra Miniature Package
Compatible with Leadfree Processing
ILCX19 Series
Applications:
Fibre Channel
Server & Storage
Sonet / SDH
802.11 / WiFi
T1/E1, T3/E3
Electrical Specifications
Frequency
Equivalent Series Resistance
16MHz – 23.999999MHz
24MHz – 25.999999MHz
26MHz – 72MHz
Shunt Capacitance (C0)
Frequency Tolerance (at 25°C)
Frequency Stability (over Temperature)
Mode of Operation
Crystal Cut
Load Capacitance
Drive Level
Aging
Operating Temperature Range
Storage Temperature Range
16MHz to 72MHz
150 Ohms Maximum
80 Ohms Maximum
60 Ohms Maximum
3pF Maximum
±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm
±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm
Fundamental
AT Cut
8pF to 32pF or Specify
100µW Maximum
5ppm/Year
Maximum
See Part Number Guide
-40°C to +85°C
Mechanical and Solder Pad Dimensions
Part Number Guide
Sample Part Number: ILCX19 – FB1F18 - 20.000 MHz
Package
Frequency
Tolerance
B = ±50ppm
F = ±30ppm
ILCX19 -
G = ±25ppm
H = ±20ppm
I = ±15ppm
J = ±10ppm*
Frequency
Stability
B = ±50ppm
F = ±30ppm
G = ±25ppm
H = ±20ppm
I = ±15ppm*, **
J = ±10ppm*, **
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode of
Operations
Load Capacitance
Frequency
F = Fundamental
8pF to 32pF or
Specify
20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 03/29/18_E
Page 1 of 2
4 Pad Ceramic Package Quartz Crystal, 2.0mm x 1.6mm
Pb Free Solder Reflow Profile:
Ts max to T
L
(Ramp-up Rate)
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
Ramp-up Tate (T
L
to Tp
Time Maintained Above
Temperature (T
L
)
Time (T
L)
Peak Temperature (Tp)
ILCX19 Series
3ºC / second max
150ºC
175ºC
200ºC
60 to180 seconds
3ºC / second max
217ºC
60 to 150 seconds
260ºC max for 10
seconds
20 to 40 seconds
6ºC / second max
8 minutes max
Units are backward compatible with +240°C reflow processes
Time within 5ºC to Peak
Temperature (Tp)
Ramp-down Rate
Tune 25ºC to Peak Temperature
Package Information:
MSL = 1 (package does not contain plastic, storage life is unlimited under normal room conditions)
Termination = e4 (Au over Ni over W base metallization)
Tape and Reel Information:
PITCH
TAPE WIDTH
REEL DIA
QTY PER REEL
4.00
8.00
180
3,000
Environmental Specifications:
Mechanical Shock
Vibration
Resistance to Soldering Heat
Solderability
Gross Leak
Fine Leak
MIL-STD-202, Method 213
MIL-STD-202, Method 204
MIL-STD-202, Method 210
J-STD-002
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2
Marking:
Line 1: I, Date Code (YWW)
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 03/29/18_E
Page 2 of 2
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