型号
- 型号
- 关键词
| 型号 | INA333AIDRGR | INA333AIDGKRG4 | INA333AIDGKT | INA333AIDGKTG4 | INA333AIDRGT |
|---|---|---|---|---|---|
| 描述 | Low-Power, Zero-Drift, Precision Instrumentation Amplifier 8-SON -40 to 125 | Low-Power, Zero-Drift, Precision Instrumentation Amplifier 8-VSSOP -40 to 125 | INST Amp Single R-R O/P ±2.75V/5.5V 8-Pin VSSOP T/R | Low-Power, Zero-Drift, Precision Instrumentation Amplifier 8-VSSOP -40 to 125 | Low-Power, Zero-Drift, Precision Instrumentation Amplifier 8-SON -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SON | MSOP | MSOP | MSOP | SON |
| 包装说明 | HVSON, SOLCC8,.12,20 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | HVSON, SOLCC8,.12,20 |
| 针数 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 6 weeks | 12 weeks | 6 weeks | 6 weeks | 6 weeks |
| 放大器类型 | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.0002 µA | 0.0002 µA | 0.0002 µA | 0.0002 µA | 0.0002 µA |
| 标称带宽 (3dB) | 0.15 MHz | 0.15 MHz | 0.15 MHz | 0.15 MHz | 0.15 MHz |
| 最小共模抑制比 | 100 dB | 100 dB | 100 dB | 100 dB | 100 dB |
| 最大输入失调电流 (IIO) | 0.0002 µA | 0.0002 µA | 0.0002 µA | 0.0002 µA | 0.0002 µA |
| 最大输入失调电压 | 25 µV | 25 µV | 25 µV | 25 µV | 25 µV |
| JESD-30 代码 | S-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-N8 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | TSSOP | TSSOP | TSSOP | HVSON |
| 封装等效代码 | SOLCC8,.12,20 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | SOLCC8,.12,20 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | TR | TR | TR | TR | TR |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.07 mm | 1.07 mm | 1.07 mm | 0.8 mm |
| 标称压摆率 | 0.05 V/us | 0.05 V/us | 0.05 V/us | 0.05 V/us | 0.05 V/us |
| 最大压摆率 | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
| 供电电压上限 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 最大电压增益 | 1000 | 1000 | 1000 | 1000 | 1000 |
| 最小电压增益 | 1 | 1 | 1 | 1 | 1 |
| 标称电压增益 | 10 | 10 | 10 | 10 | 10 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
模拟与混合信号
模拟电子
WindowsCE
微控制器 MCU
stm32/stm8
PCB设计
