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INMP504ACEZ-R7

MIC MEMS ANALOG OMNI -38DB

器件类别：模块/解决方案   

厂商名称：TDK(株式会社)

厂商官网：http://www.tdk.com

器件标准：

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器件参数
参数名称
属性值
类型
MEMS（硅）
输出类型
模拟
方向
全向
频率范围
100Hz ~ 20kHz
灵敏度
-38dB ±3dB @ 94dB SPL
信噪比
65dB
阻抗
200 Ohms
电压范围
1.6V ~ 3.3V
电流 - 电源
225µA
端口位置
底部
端接
焊盘
大小/尺寸
0.132" 长 x 0.098" 宽（3.35mm x 2.50mm）
高度（最大值）
0.039"（0.98mm）
形状
矩形
文档预览
INMP504
Ultra-Low Noise Microphone with Bottom Port and Analog Output
GENERAL DESCRIPTION
The INMP504* is a high-performance, very low noise, low
power, analog output, bottom-ported omnidirectional MEMS
microphone. The INMP504 consists of a MEMS microphone
element, an impedance converter and an output amplifier.
The INMP504 sensitivity specification makes it an excellent
choice for both near field and far field applications. The
INMP504 is function- and pin-compatible with the INMP404
microphone, providing an easy upgrade path.
The INMP504 has very high SNR and extended wideband
frequency response, resulting in natural sound with high
intelligibility. Low current consumption enables long battery
life for portable applications. The INMP504 complies with the
TIA-920
Telecommunications Telephone Terminal Equipment
Transmission Requirements for Wideband Digital Wireline
Telephones
standard.
The INMP504 is available in an miniature 3.35 mm × 2.5 mm ×
0.88 mm surface-mount package. It is reflow solder
compatible with no sensitivity degradation. The INMP504 is
halide free.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
APPLICATIONS
•
•
•
•
•
•
•
Smartphones and Feature Phones
Tablet Computers
Teleconferencing Systems
Digital Still and Video Cameras
Bluetooth Headsets
Notebook PCs
Security and Surveillance
FEATURES
•
•
•
•
•
•
•
•
•
•
3.35 × 2.50 × 0.88 mm Surface-Mount Package
Very High SNR of 65 dBA
Sensitivity
of −38 dBV
Flat Frequency Response from 100 Hz to 16 kHz
Low Current Consumption: <250 µA
Single-Ended Analog Output
Omnidirectional Response
High PSR of
−
70 dBV
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
INMP504ACEZ-R0*
INMP504ACEZ-R7†
EV_INMP504-FX
TEMP RANGE
−40°C to +85°C
−40°C to +85°C
—
OUTPUT
AMPLIFIER
OUTPUT
* – 13” Tape and Reel
† – 7” Tape and reel to be discontinued. Contact
sales@invensense.com
for
availability.
INMP504
POWER
VDD GND
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-INMP504-00
Revision: 1.1
Rev Date: 05/14/2014
INMP504
TABLE OF CONTENTS
General Description ................................................................................................................................................. 1
Applications ............................................................................................................................................................. 1
Features ................................................................................................................................................................... 1
Functional Block Diagram ........................................................................................................................................ 1
Ordering Information ............................................................................................................................................... 1
Table of Contents ............................................................................................................................................................ 2
Specifications .................................................................................................................................................................. 3
Table 1. Electrical Characteristics ............................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings ....................................................................................................................... 4
ESD Caution ............................................................................................................................................................. 4
Soldering Profile....................................................................................................................................................... 5
Table 3. Recommended Soldering Profile*.............................................................................................................. 5
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions........................................................................................................................... 6
Typical Performance Characteristics............................................................................................................................... 7
Applications Information ................................................................................................................................................ 8
Connecting To Audio Codecs ................................................................................................................................... 8
Supporting Documents ................................................................................................................................................... 9
Evaluation Board User Guide ................................................................................................................................... 9
application notes (product Specific) ........................................................................................................................ 9
Application Notes (general) ..................................................................................................................................... 9
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Handling Instructions .................................................................................................................................................... 11
Pick And Place Equipment ..................................................................................................................................... 11
Reflow Solder ......................................................................................................................................................... 11
Board Wash............................................................................................................................................................ 11
Outline Dimensions ....................................................................................................................................................... 12
Ordering Guide ...................................................................................................................................................... 13
Revision History ..................................................................................................................................................... 13
Compliance Declaration Disclaimer ....................................................................................................................... 14
Document Number: DS-INMP504-00
Revision: 1.1
Page 2 of 14
INMP504
SPECIFICATIONS
(T
A
= −40 to 85°C, V
DD
= 1.6 to 3.3 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Dynamic Range
Frequency Response
Total Harmonic Distortion (THD)
Power-Supply Rejection (PSR)
Maximum Acoustic Input
POWER SUPPLY
Supply Voltage (V
DD
)
Supply Current (I
S
)
CONDITIONS
MIN
TYP
Omni
−38
65
29
91
100
>20
3
−70
120
1.6
V
DD
= 1.8 V
V
DD
= 3.3 V
180
200
200
0.8
90
120 dB SPL input, peak
20 Hz to 20 kHz, A-weighted,
rms
0.35
−103
3.3
200
225
MAX
UNITS
NOTES
TABLE 1. ELECTRICAL CHARACTERISTICS
1 kHz, 94 dB SPL
−41
−35
dBV
dBA
dBA SPL
dB
Hz
kHz
%
dBV
dB SPL
V
µA
µA
Ω
V
µA
V
PEAK
dBV
1
Derived from EIN and
maximum acoustic input
Low frequency
−3
dB point
High frequency
−3
dB point
105 dB SPL
217 Hz, 100 mVp-p square
wave superimposed on VDD
= 1.8 V
Peak
OUTPUT CHARACTERISTICS
Output Impedance (Z
OUT
)
Output DC Offset
Output Current Limit
Maximum Output Voltage
Noise Floor
Note 1:
See Figure 3 and Figure 4.
Document Number: DS-INMP504-00
Revision: 1.1
Page 3 of 14
INMP504
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply Voltage (VDD)
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
Operating Temperature Range
Storage Temperature Range
RATING
−0.3
V to +3.6 V
160 dB
10,000
g
Per MIL-STD-883 Method 2007, Test Condition B
−40°C to +85°C
−55°C
to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Document Number: DS-INMP504-00
Revision: 1.1
Page 4 of 14
INMP504
SOLDERING PROFILE
T
P
RAMP-UP
TEMPERATURE
t
P
CRITICAL ZONE
T
L
TO T
P
T
L
T
SMAX
T
SMIN
t
L
t
S
PREHEAT
RAMP-DOWN
t
25°C
TO PEAK
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Average Ramp Rate (T
L
to T
P
)
Minimum Temperature
(T
SMIN
)
Minimum Temperature
(T
SMIN
)
Time (T
SMIN
to T
SMAX
), t
S
Sn63 /Pb37
1.25°C/sec
max
100°C
150°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
183°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec
max
5 min max
Pb-Free
1.25°C/sec
max
100°C
200°C
60 sec to 75 sec
1.25°C/sec
~50 sec
217°C
245°C
+0°C/−5°C
20 sec to 30 sec
3°C/sec
max
5 min max
Preheat
Ramp-Up Rate (T
SMAX
to T
L
)
Time Maintained Above Liquidous (t
L
)
Liquidous Temperature (T
L
)
Peak Temperature (T
P
)
Time Within +5°C of Actual Peak
Temperature (t
P
)
Ramp-Down Rate
Time +25°C (t
25°C
) to Peak Temperature
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
Document Number: DS-INMP504-00
Revision: 1.1
Page 5 of 14
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参数对比
与INMP504ACEZ-R7相近的元器件有：INMP504ACEZ-R0。描述及对比如下：
型号 INMP504ACEZ-R7 INMP504ACEZ-R0
描述 MIC MEMS ANALOG OMNI -38DB MIC MEMS ANLG OMNI -38DB
类型 MEMS（硅） MEMS（硅）
输出类型 模拟 模拟
方向 全向 全向
频率范围 100Hz ~ 20kHz 100Hz ~ 20kHz
灵敏度 -38dB ±3dB @ 94dB SPL -38dB ±3dB @ 94dB SPL
信噪比 65dB 65dB
阻抗 200 Ohms 200 Ohms
电压范围 1.6V ~ 3.3V 1.6V ~ 3.3V
电流 - 电源 225µA 225µA
端口位置 底部 底部
端接 焊盘 焊盘
大小/尺寸 0.132" 长 x 0.098" 宽（3.35mm x 2.50mm） 0.132" 长 x 0.098" 宽（3.35mm x 2.50mm）
高度（最大值） 0.039"（0.98mm） 0.039"（0.98mm）
形状 矩形 矩形
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