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IP4283CZ10 series
ESD protection for ultra high-speed interfaces
Rev. 4 — 8 April 2013
Product data sheet
1. Product profile
1.1 General description
The devices are designed to protect high-speed interfaces such as High-Definition
Multimedia Interface (HDMI), DisplayPort, external Serial Advanced Technology
Attachment (eSATA) and Low-Voltage Differential Signaling (LVDS) interfaces against
ElectroStatic Discharge (ESD).
The devices include four high-level ESD protection diode structures for ultra high-speed
signal lines. They are available in three package variants: DFN2510-10 (SOT1165-1),
DFN2510A-10 (SOT1176-1) and TSSOP10 (SOT552-1).
All signal lines are protected by a special diode configuration offering ultra low line
capacitance of only 0.6 pF. These diodes provide protection to downstream components
from ESD voltages up to
8
kV contact according to IEC 61000-4-2, level 4.
1.2 Features and benefits
System ESD protection for HDMI, DisplayPort, eSATA and LVDS
All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of
8
kV according to IEC 61000-4-2, level 4
Matched 0.5 mm trace spacing
Signal lines with
0.05 pF matching capacitance between signal pairs
Line capacitance of only 0.6 pF for each channel
Design-friendly ‘pass-thru’ signal routing
1.3 Applications
The devices are designed for high-speed receiver and transmitter port protection:
TVs, monitors
DVD recorders and players
Notebooks, main board graphics cards and ports
Set-top boxes and game consoles
NXP Semiconductors
IP4283CZ10 series
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1.
Pin
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
Pinning
Description
negative channel 1
ESD protection
positive channel 1
ESD protection
ground
negative channel 2
ESD protection
positive channel 2
ESD protection
not connected
not connected
ground
not connected
not connected
negative channel 1
ESD protection
positive channel 1
ESD protection
ground
negative channel 2
ESD protection
positive channel 2
ESD protection
not connected
not connected
ground
not connected
not connected
1
2
3
4
5
Transparent top view
Symbol
TMDS_CH1
TMDS_CH1+
GND
TMDS_CH2
TMDS_CH2+
n.c.
n.c.
GND
n.c.
n.c.
TMDS_CH1
TMDS_CH1+
GND
TMDS_CH2
TMDS_CH2+
n.c.
n.c.
GND
n.c.
n.c.
Simplified outline
Graphic symbol
IP4283CZ10-TBA (SOT1165-1)
10
9
8
7
6
1
2
4
5
1
2
3
4
5
Transparent top view
DFN2510-10
3, 8
001aai619
IP4283CZ10-TBR (SOT1176-1)
10
9
8
7
6
1
2
4
5
DFN2510A-10
3, 8
001aai619
IP4283CZ10_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 8 April 2013
2 of 14
NXP Semiconductors
IP4283CZ10 series
ESD protection for ultra high-speed interfaces
Pinning
…continued
Description
negative channel 1
ESD protection
positive channel 1
ESD protection
ground
negative channel 2
ESD protection
positive channel 2
ESD protection
not connected
not connected
ground
not connected
not connected
1
5
3, 8
Table 1.
Pin
1
2
3
4
5
6
7
8
9
10
Symbol
TMDS_CH1
TMDS_CH1+
GND
TMDS_CH2
TMDS_CH2+
n.c.
n.c.
GND
n.c.
n.c.
Simplified outline
Graphic symbol
IP4283CZ10-TT (SOT552-1)
10
6
1
2
4
5
001aai619
TSSOP10
3. Ordering information
Table 2.
Ordering information
Package
Name
IP4283CZ10-TBA
DFN2510-10
Description
Version
plastic extremely thin small outline package;
SOT1165-1
no leads; 10 terminals; body 1
2.5
0.5 mm
plastic extremely thin small outline package;
SOT1176-1
no leads; 10 terminals; body 1
2.5
0.5 mm
plastic thin shrink small outline package;
10 leads; body width 3 mm
SOT552-1
Type number
IP4283CZ10-TBR DFN2510A-10
IP4283CZ10-TT
TSSOP10
4. Marking
Table 3.
Marking codes
Marking code
83
83
4283
Type number
IP4283CZ10-TBA
IP4283CZ10-TBR
IP4283CZ10-TT
IP4283CZ10_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 8 April 2013
3 of 14
NXP Semiconductors
IP4283CZ10 series
ESD protection for ultra high-speed interfaces
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
I
V
ESD
Parameter
input voltage
electrostatic discharge
voltage
IEC 61000-4-2, level 4
contact discharge
air discharge
T
stg
T
amb
[1]
[1]
Conditions
Min
0.5
8
15
55
40
Max
+5.5
8
15
+125
+85
Unit
V
kV
kV
C
C
storage temperature
ambient temperature
All pins to ground.
6. Characteristics
Table 5.
Characteristics
T
amb
= 25
C unless otherwise specified.
Symbol
V
BR
I
LR
V
F
C
line
C
line
C
line(mutual)
r
dyn
Parameter
breakdown voltage
reverse leakage current
forward voltage
line capacitance
line capacitance
difference
mutual line capacitance
dynamic resistance
Conditions
I
test
= 1 mA
per TMDS channel;
V=3V
I
test
= 1 mA
f = 1 MHz;
V
bias
= 2.5 V
f = 1 MHz;
V
bias
= 2.5 V
f = 1 MHz;
V
bias
= 2.5 V
surge
positive transient
negative transient
V
CL
clamping voltage
positive transient;
I
PP
= 3.8 A
negative transient;
I
PP
=
2.8
A
[1]
[2]
[3]
This parameter is guaranteed by design.
Between signal pin and pin n.c.
According to IEC 61000-4-5 (8/20
s).
[3]
[1]
Min
6
-
-
-
-
-
Typ
-
-
0.7
0.6
0.05
0.07
Max
9
1
-
-
-
-
Unit
V
A
V
pF
pF
pF
[1]
[1][2]
[3]
-
-
-
-
0.8
0.85
9.5
3.2
-
-
-
-
V
V
[3]
IP4283CZ10_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 8 April 2013
4 of 14
