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IS25LP064A-JBLA3

NOR Flash 64M 2.3-3.6V 133Mhz Serial NOR Flash

器件类别:存储   

厂商名称:ISSI(芯成半导体)

厂商官网:http://www.issi.com/

器件标准:

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
ISSI(芯成半导体)
产品种类
Product Category
NOR Flash
RoHS
Details
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
SOIC-8
Memory Size
64 Mbit
Maximum Clock Frequency
133 MHz
接口类型
Interface Type
Serial, SPI, QPI
Organization
8 M x 8
Data Bus Width
8 bit
电源电压-最小
Supply Voltage - Min
2.3 V
电源电压-最大
Supply Voltage - Max
3.6 V
Supply Current - Max
25 mA
最小工作温度
Minimum Operating Temperature
- 40 C
最大工作温度
Maximum Operating Temperature
+ 125 C
Memory Type
NOR
速度
Speed
133 MHz
工厂包装数量
Factory Pack Quantity
90
文档预览
IS25LP064A
IS25LP032A
64/32Mb
3V SERIAL FLASH MEMORY WITH 133MHZ MULTI I/O SPI & QUAD
I/O QPI DTR INTERFACE
DATA SHEET
IS25LP064A/032A
64/32Mb
3V SERIAL FLASH MEMORY WITH 133MHZ MULTI I/O SPI &
QUAD I/O QPI DTR INTERFACE
FEATURES
Industry Standard Serial Interface
-
IS25LP064A: 64Mbit/8Mbyte
-
IS25LP032A: 32Mbit/4Mbyte
-
256 bytes per Programmable Page
-
Supports standard SPI, Fast, Dual, Dual
I/O, Quad, Quad I/O, SPI DTR, Dual I/O
DTR, Quad I/O DTR, and QPI
-
Double Transfer Rate (DTR) option
-
Supports Serial Flash Discoverable
Parameters (SFDP)
High Performance Serial Flash (SPI)
-
133Mhz Fast Read at Vcc=2.7V to 3.6V
-
104Mhz Fast Read at Vcc=2.3V to 3.6V
-
532MHz equivalent at QPI operation
-
50MHz Normal Read
-
DTR (Dual Transfer Rate) up to 66MHz
-
Selectable dummy cycles
-
Configurable drive strength
-
Supports SPI Modes 0 and 3
-
More than 100,000 erase/program cycles
-
More than 20-year data retention
Flexible & Efficient Memory Architecture
-
Chip Erase with Uniform Sector/Block
Erase (4/32/64 Kbyte)
-
Program 1 to 256 bytes per page
-
Program/Erase Suspend & Resume
Efficient Read and Program modes
-
Low Instruction Overhead Operations
-
Continuous Read 8/16/32/64-Byte burst
Wrap
-
Selectable burst length
-
QPI for reduced instruction overhead
Low Power with Wide Temp. Ranges
-
Single 2.3V to 3.6V Voltage Supply
-
5 mA Active Read Current (typ.)
-
10 µA Standby Current (typ.)
-
5 µA Deep Power Down (typ.)
-
Temp Grades:
Extended: -40°C to +105°C
Extended+: -40°C to +125°C
(1)
Auto Grade: up to +125°C
Note:
1.
Extended+ should not be used for Automotive.
Advanced Security Protection
-
Software and Hardware Write Protection
-
Power Supply lock protect
-
4x256-Byte dedicated security area
with OTP user-lockable bits
-
128 bit Unique ID for each device (Call
Factory)
Industry Standard Pin-out & Packages
(1),(2)
-
B = 8-pin SOIC 208mil
-
F = 8-pin VSOP 208mil
-
K = 8-contact WSON 6x5mm
-
L = 8-contact WSON 8x6mm
-
M = 16-pin SOIC 300mil
(3)
-
G= 24-ball TFBGA 6x8mm 4x6
(3)
-
H =
24-ball TFBGA 6x8mm 5x5
(Call
Factory)
(3)
-
KGD (Call Factory)
Notes:
1. Call Factory for other package options available.
2. For the RESET# pin option instead of HOLD# pin, call
Factory.
3. For the dedicated RESET# option, see the Ordering
Information
Integrated Silicon Solution, Inc.- www.issi.com
Rev. A
11/06/2015
2
IS25LP064A/032A
GENERAL DESCRIPTION
The IS25LP064A/032A Serial Flash memory offers a versatile storage solution with high flexibility and
performance in a simplified pin count package. ISSI’s “Industry Standard Serial Interface” Flash are for systems
that require limited space, a low pin count, and low power consumption. The device is accessed through a 4-
wire SPI Interface consisting of a Serial Data Input (SI), Serial Data Output (SO), Serial Clock (SCK), and Chip
Enable (CE#) pins, which can also be configured to serve as multi-I/O (see pin descriptions).
The device supports Dual and Quad I/O as well as standard, Dual Output, and Quad Output SPI. Clock
frequencies of up to 133MHz allow for equivalent clock rates of up to 532MHz (133MHz x 4) which equates to
66Mbytes/s of data throughput. The IS25xP series of Flash adds support for DTR (Double Transfer Rate)
commands that transfer addresses and read data on both edges of the clock. These transfer rates can
outperform 16-bit Parallel Flash memories allowing for efficient memory access to support XIP (execute in
place) operation.
The memory array is organized into programmable pages of 256-bytes. This family supports page program
mode where 1 to 256 bytes of data are programmed in a single command. QPI (Quad Peripheral Interface)
supports 2-cycle instruction further reducing instruction times. Pages can be erased in groups of 4Kbyte
sectors, 32Kbyte blocks, 64Kbyte blocks, and/or the entire chip. The uniform sector and block architecture
allows for a high degree of flexibility so that the device can be utilized for a broad variety of applications
requiring solid data retention.
GLOSSARY
Standard SPI
In this operation, a 4-wire SPI Interface is utilized, consisting of Serial Data Input (SI), Serial Data Output (SO),
Serial Clock (SCK), and Chip Enable (CE#) pins. Instructions are sent via the SI pin to encode instructions,
addresses, or input data to the device on the rising edge of SCK. The SO pin is used to read data or to check the
status of the device. This device supports SPI bus operation modes (0,0) and (1,1).
Multi I/O SPI
Multi-I/O operation utilizes an enhanced SPI protocol to allow the device to function with Dual Output, Dual Input
and Output, Quad Output, and Quad Input and Output capability. Executing these instructions through SPI
mode will achieve double or quadruple the transfer bandwidth for READ and PROGRAM operations.
QPI
The device supports Quad Peripheral Interface (QPI) operations only when the device is switched from
Standard/Dual/Quad SPI mode to QPI mode using the enter QPI (35h) instruction. The typical SPI protocol
requires that the byte-long instruction code being shifted into the device only via SI pin in eight serial clocks. The
QPI mode utilizes all four I/O pins to input the instruction code thus requiring only two serial clocks. This can
significantly reduce the SPI instruction overhead and improve system performance. Only QPI mode or
SPI/Dual/Quad mode can be active at any given time. Enter QPI (35h) and Exit QPI (F5h) instructions are used
to switch between these two modes, regardless of the non-volatile Quad Enable (QE) bit status in the Status
Register. Power Reset or Hardware/Software Reset will return the device into the standard SPI mode. SI and
SO pins become bidirectional I/O0 and I/O1, and WP# and HOLD# pins become I/O2 and I/O3 respectively
during QPI mode.
DTR
In addition to SPI and QPI features, the device also supports Fast READ DTR operation, which allows high data
throughput while running at lower clock frequencies. DTR READ mode uses both rising and falling edges of the
clock to drive output, resulting in reducing input and output cycles by half.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. A
11/06/2015
3
IS25LP064A/032A
TABLE OF CONTENTS
FEATURES .......................................................................................................................................................... 2
GENERAL DESCRIPTION .................................................................................................................................. 3
TABLE OF CONTENTS ....................................................................................................................................... 4
1.
2.
3.
4.
5.
6.
PIN CONFIGURATION ................................................................................................................................. 7
PIN DESCRIPTIONS .................................................................................................................................... 9
BLOCK DIAGRAM ...................................................................................................................................... 11
SPI MODES DESCRIPTION ...................................................................................................................... 12
SYSTEM CONFIGURATION ...................................................................................................................... 14
5.1 BLOCK/SECTOR ADDRESSES .......................................................................................................... 14
REGISTERS ............................................................................................................................................... 15
6.1 STATUS REGISTER ............................................................................................................................ 15
6.2 FUNCTION REGISTER ........................................................................................................................ 18
6.3 READ REGISTER................................................................................................................................. 19
7.
PROTECTION MODE................................................................................................................................. 21
7.1 HARDWARE WRITE PROTECTION.................................................................................................... 21
7.2 SOFTWARE WRITE PROTECTION .................................................................................................... 21
8.
DEVICE OPERATION ................................................................................................................................ 22
8.1 NORMAL READ OPERATION (NORD, 03h) ....................................................................................... 24
8.2 FAST READ OPERATION (FRD, 0Bh) ................................................................................................ 26
8.3 HOLD OPERATION .............................................................................................................................. 28
8.4 FAST READ DUAL I/O OPERATION (FRDIO, BBh) ........................................................................... 28
8.5 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh) ................................................................... 31
8.6 FAST READ QUAD OUTPUT OPERATION (FRQO, 6Bh).................................................................. 32
8.7 FAST READ QUAD I/O OPERATION (FRQIO, EBh) .......................................................................... 34
8.8 PAGE PROGRAM OPERATION (PP, 02h) .......................................................................................... 38
8.9 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 32h/38h) ........................................................ 40
8.10 ERASE OPERATION ......................................................................................................................... 41
8.11 SECTOR ERASE OPERATION (SER, D7h/20h) ............................................................................... 42
8.12 BLOCK ERASE OPERATION (BER32K:52h, BER64K:D8h) ............................................................ 43
8.13 CHIP ERASE OPERATION (CER, C7h/60h) ..................................................................................... 45
8.14 WRITE ENABLE OPERATION (WREN, 06h) .................................................................................... 46
8.15 WRITE DISABLE OPERATION (WRDI, 04h) ..................................................................................... 47
8.16 READ STATUS REGISTER OPERATION (RDSR, 05h) ................................................................... 48
8.17 WRITE STATUS REGISTER OPERATION (WRSR, 01h) ................................................................. 49
8.18 READ FUNCTION REGISTER OPERATION (RDFR, 48h) ............................................................... 50
8.19 WRITE FUNCTION REGISTER OPERATION (WRFR, 42h)............................................................. 51
Integrated Silicon Solution, Inc.- www.issi.com
Rev. A
11/06/2015
4
IS25LP064A/032A
8.20 ENTER QUAD PERIPHERAL INTERFACE (QPI) MODE OPERATION (QPIEN, 35h; QPIDI, F5h) 52
8.21 PROGRAM/ERASE SUSPEND & RESUME ...................................................................................... 53
8.22 ENTER DEEP POWER DOWN (DP, B9h) ......................................................................................... 55
8.23 RELEASE DEEP POWER DOWN (RDPD, ABh) ............................................................................... 56
8.24 SET READ PARAMETERS OPERATION (SRP, C0h) ...................................................................... 57
8.25 READ PRODUCT IDENTIFICATION (RDID, ABh) ............................................................................ 59
8.26 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh; RDJDIDQ, AFh) 61
8.27 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) ........................ 62
8.28 READ UNIQUE ID NUMBER (RDUID, 4Bh) ...................................................................................... 63
8.29 READ SFDP OPERATION (RDSFDP, 5Ah) ...................................................................................... 64
8.30 NO OPERATION (NOP, 00h) ............................................................................................................. 64
8.31 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h)) AND HARDWARE
RESET ........................................................................................................................................................ 65
8.32 SECURITY INFORMATION ROW ...................................................................................................... 66
8.33 INFORMATION ROW ERASE OPERATION (IRER, 64h) ................................................................. 67
8.34 INFORMATION ROW PROGRAM OPERATION (IRP, 62h) ............................................................. 68
8.35 INFORMATION ROW READ OPERATION (IRRD, 68h) ................................................................... 69
8.36 FAST READ DTR MODE OPERATION (FRDTR, 0Dh) ..................................................................... 70
8.37 FAST READ DUAL IO DTR MODE OPERATION (FRDDTR, BDh) .................................................. 72
8.38 FAST READ QUAD IO DTR MODE OPERATION (FRQDTR, EDh) ................................................. 75
8.39 SECTOR LOCK/UNLOCK FUNCTIONS ............................................................................................ 79
9.
ELECTRICAL CHARACTERISTICS........................................................................................................... 81
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
................................................................................................... 81
9.2 OPERATING RANGE ........................................................................................................................... 81
9.3 DC CHARACTERISTICS ...................................................................................................................... 82
9.4 AC MEASUREMENT CONDITIONS .................................................................................................... 83
9.5 PIN CAPACITANCE ............................................................................................................................. 83
9.6 AC CHARACTERISTICS ...................................................................................................................... 84
9.7 SERIAL INPUT/OUTPUT TIMING ........................................................................................................ 86
9.8 POWER-UP AND POWER-DOWN ...................................................................................................... 88
9.9 PROGRAM/ERASE PERFORMANCE ................................................................................................. 89
9.10 RELIABILITY CHARACTERISTICS ................................................................................................... 89
10.
PACKAGE TYPE INFORMATION ......................................................................................................... 90
10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (B) ............................ 90
10.2 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 6x5mm (K)...................................... 91
10.3 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 8x6mm (L) ...................................... 92
10.4 8-Pin 208mil VSOP Package (F) ........................................................................................................ 93
10.5 16-lead Plastic Small Outline package (300 mils body width) (M) ..................................................... 94
Integrated Silicon Solution, Inc.- www.issi.com
Rev. A
11/06/2015
5
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参数对比
与IS25LP064A-JBLA3相近的元器件有:IS25LP064A-JLLE、IS25LP064A-JMLE-TR、IS25LP064A-JMLE、IS25LP064A-JLLE-TR、IS25LP064A-JBLE-TR、IS25LP064A-JGLE。描述及对比如下:
型号 IS25LP064A-JBLA3 IS25LP064A-JLLE IS25LP064A-JMLE-TR IS25LP064A-JMLE IS25LP064A-JLLE-TR IS25LP064A-JBLE-TR IS25LP064A-JGLE
描述 NOR Flash 64M 2.3-3.6V 133Mhz Serial NOR Flash NOR Flash 64Mb QPI/QSPI, WSON, RoHS, ET Flash, NOR Flash 64Mb QPI/QSPI, 16-pin SOP 300Mil, RoHS, ET NOR Flash 64Mb QPI/QSPI, WSON, RoHS, T&R NOR Flash 64Mb QPI/QSPI, 8-pin SOP 2064Mil, RoHS, T&R NOR Flash 64M 3V 133MHz Serial Flash
Product Attribute Attribute Value Attribute Value - Attribute Value Attribute Value Attribute Value Attribute Value
制造商
Manufacturer
ISSI(芯成半导体) ISSI(芯成半导体) - ISSI(芯成半导体) ISSI(芯成半导体) ISSI(芯成半导体) ISSI(芯成半导体)
产品种类
Product Category
NOR Flash NOR Flash - NOR Flash NOR Flash NOR Flash NOR Flash
RoHS Details Details - Details Details Details -
安装风格
Mounting Style
SMD/SMT SMD/SMT - SMD/SMT SMD/SMT SMD/SMT SMD/SMT
封装 / 箱体
Package / Case
SOIC-8 WSON-6x8-8 - SOIC-16 WSON-6x8-8 SOIC-Wide-8 TFBGA-24
Memory Size 64 Mbit 64 Mbit - 64 Mbit 64 Mbit 64 Mbit 64 Mbit
Maximum Clock Frequency 133 MHz 133 MHz - 133 MHz 133 MHz 133 MHz 133 MHz
接口类型
Interface Type
Serial, SPI, QPI Serial - Serial Serial Serial QPI, SPI
Organization 8 M x 8 8 M x 8 - 8 M x 8 8 M x 8 8 M x 8 -
Data Bus Width 8 bit 8 bit - 8 bit 8 bit 8 bit -
电源电压-最小
Supply Voltage - Min
2.3 V 2.3 V - 2.3 V 2.3 V 2.3 V 2.3 V
电源电压-最大
Supply Voltage - Max
3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V
Supply Current - Max 25 mA 14 mA - 14 mA 13 mA 13 mA 14 mA
最小工作温度
Minimum Operating Temperature
- 40 C - 40 C - - 40 C - 40 C - 40 C - 40 C
最大工作温度
Maximum Operating Temperature
+ 125 C + 105 C - + 105 C + 105 C + 105 C + 105 C
Memory Type NOR NOR - NOR - - NOR
速度
Speed
133 MHz 133 MHz - 133 MHz 133 MHz 133 MHz 133 MHz
工厂包装数量
Factory Pack Quantity
90 480 - 44 4000 2000 480
Timing Type - Synchronous - Synchronous Synchronous Synchronous -
Architecture - Sector - Sector Block, Uniform Sector Block, Uniform Sector -
Moisture Sensitive - Yes - Yes Yes Yes -
单位重量
Unit Weight
- 0.000384 oz - 0.225753 oz 0.000384 oz 0.030018 oz -
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