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IS25LP080D-JKLA1

Flash, 1MX8, PDSO8, WSON-8

器件类别:存储    存储   

厂商名称:ISSI(芯成半导体)

厂商官网:http://www.issi.com/

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器件参数
参数名称
属性值
包装说明
HVSON,
Reach Compliance Code
unknown
ECCN代码
EAR99
最大时钟频率 (fCLK)
133 MHz
JESD-30 代码
R-PDSO-N8
长度
6 mm
内存密度
8388608 bit
内存集成电路类型
FLASH
内存宽度
8
功能数量
1
端子数量
8
字数
1048576 words
字数代码
1000000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
1MX8
封装主体材料
PLASTIC/EPOXY
封装代码
HVSON
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行
SERIAL
编程电压
3 V
筛选级别
AEC-Q100
座面最大高度
0.8 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.3 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
DUAL
类型
NOR TYPE
宽度
5 mm
文档预览
IS25LP080D
IS25WP080D
IS25WP040D
IS25WP020D
8/4/2Mb
SERIAL FLASH MEMORY WITH 133MHZ MULTI I/O SPI &
QUAD I/O QPI DTR INTERFACE
DATA SHEET
IS25LP080D
IS25WP080D/040D/020D
8/4/2Mb
SERIAL FLASH MEMORY WITH 133MHZ MULTI I/O SPI &
QUAD I/O QPI DTR INTERFACE
FEATURES
Industry Standard Serial Interface
-
IS25LP080D: 8Mbit/1Mbyte
-
IS25WP080D: 8Mbit/1Mbyte
-
IS25WP040D: 4Mbit/512Kbyte
-
IS25WP020D: 2Mbit/256Kbyte
-
256 bytes per Programmable Page
-
Supports standard SPI, Fast, Dual, Dual
I/O, Quad, Quad I/O, SPI DTR, Dual I/O
DTR, Quad I/O DTR, and QPI
-
Supports Serial Flash Discoverable
Parameters (SFDP)
High Performance Serial Flash (SPI)
-
50MHz Normal and 133Mhz Fast Read
-
532 MHz equivalent QPI
-
DTR (Dual Transfer Rate) up to 66MHz
-
Selectable Dummy Cycles
-
Configurable Drive Strength
-
Supports SPI Modes 0 and 3
-
More than 100,000 Erase/Program Cycles
-
More than 20-year Data Retention
Flexible & Efficient Memory Architecture
-
Chip Erase with Uniform: Sector/Block
Erase (4/32/64 Kbyte)
-
Program 1 to 256 Bytes per Page
-
Program/Erase Suspend & Resume
Efficient Read and Program modes
-
Low Instruction Overhead Operations
-
Continuous Read 8/16/32/64-Byte
Burst Wrap
-
Selectable Burst Length
-
QPI for Reduced Instruction Overhead
-
AutoBoot Operation
Low Power with Wide Temp. Ranges
-
Single Voltage Supply
IS25LP: 2.30V to 3.60V
IS25WP: 1.65V to 1.95V
-
10 mA Active Read Current
-
8 µA Standby Current
-
1 µA Deep Power Down
-
Temp Grades:
Extended: -40°C to +105°C
Extended+: -40°C to +125°C(Call
Factory)
Auto Grade: up to +125°C
Note: Extended+ should not be used for Automotive.
Advanced Security Protection
-
Software and Hardware Write Protection
-
Power Supply Lock Protect
-
4x256-Byte Dedicated Security Area
with OTP User-lockable Bits
-
128 bit Unique ID for Each Device
(Call Factory)
Industry Standard Pin-out & Packages
(1)
-
B = 8-pin SOIC 208mil
-
N = 8-pin SOIC 150mil
-
V = 8-pin VVSOP 150mil
-
K = 8-contact WSON 6x5mm
-
U = 8-contact USON 2x3mm
-
T = 8-contact USON 4x3mm (Call Factory)
-
KGD (Call Factory)
Notes:
1. Call Factory for other package options available
Integrated Silicon Solution, Inc.- www.issi.com
Rev. B1
02/22/2017
2
IS25LP080D
IS25WP080D/040D/020D
GENERAL DESCRIPTION
The IS25LP080D and IS25WP080D/040D/020D Serial Flash memory offers a versatile storage solution with high
flexibility and performance in a simplified pin count package. ISSI’s “Industry Standard Serial Interface” Flash is for
systems that require limited space, a low pin count, and low power consumption. The device is accessed through
a 4-wire SPI Interface consisting of a Serial Data Input (SI), Serial Data Output (SO), Serial Clock (SCK), and Chip
Enable (CE#) pins, which can also be configured to serve as multi-I/O (see pin descriptions).
The device supports Dual and Quad I/O as well as standard, Dual Output, and Quad Output SPI. Clock frequencies
of up to 133MHz allow for equivalent clock rates of up to 532MHz (133MHz x 4) which equates to 66Mbytes/s of
data throughput. The IS25xP series of Flash adds support for DTR (Double Transfer Rate) commands that transfer
addresses and read data on both edges of the clock. These transfer rates can outperform 16-bit Parallel Flash
memories allowing for efficient memory access to support XIP (execute in place) operation.
The memory array is organized into programmable pages of 256-bytes. This family supports page program mode
where 1 to 256 bytes of data are programmed in a single command. QPI (Quad Peripheral Interface) supports 2-
cycle instruction further reducing instruction times. Pages can be erased in groups of 4Kbyte sectors, 32Kbyte
blocks, 64Kbyte blocks, and/or the entire chip. The uniform sector and block architecture allows for a high degree
of flexibility so that the device can be utilized for a broad variety of applications requiring solid data retention.
GLOSSARY
Standard SPI
In this operation, a 4-wire SPI Interface is utilized, consisting of Serial Data Input (SI), Serial Data Output (SO),
Serial Clock (SCK), and Chip Enable (CE#) pins. Instructions are sent via the SI pin to encode instructions,
addresses, or input data to the device on the rising edge of SCK. The SO pin is used to read data or to check the
status of the device. This device supports SPI bus operation modes (0, 0) and (1, 1).
Multi I/O SPI
Multi-I/O operation utilizes an enhanced SPI protocol to allow the device to function with Dual Output, Dual Input
and Output, Quad Output, and Quad Input and Output capability. Executing these instructions through SPI mode
will achieve double or quadruple the transfer bandwidth for READ and PROGRAM operations.
QPI
The device supports Quad Peripheral Interface (QPI) operations only when the device is switched from
Standard/Dual/Quad SPI mode to QPI mode using the enter QPI (35h) instruction. The typical SPI protocol requires
that the byte-long instruction code being shifted into the device only via SI pin in eight serial clocks. The QPI mode
utilizes all four I/O pins to input the instruction code thus requiring only two serial clocks. This can significantly
reduce the SPI instruction overhead and improve system performance. Only QPI mode or SPI/Dual/Quad mode
can be active at any given time. Enter QPI (35h) and Exit QPI (F5h) instructions are used to switch between these
two modes, regardless of the non-volatile Quad Enable (QE) bit status in the Status Register. Power Reset or
Software Reset will return the device into the standard SPI mode. SI and SO pins become bidirectional I/O0 and
I/O1, and WP# and HOLD# pins become I/O2 and I/O3 respectively during QPI mode.
DTR
In addition to SPI and QPI features, the device also supports SPI DTR READ. SPI DTR allows high data throughput
while running at lower clock frequencies. SPI DTR READ mode uses both rising and falling edges of the clock to
drive output, resulting in reducing input and output cycles by half.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. B1
02/22/2017
3
IS25LP080D
IS25WP080D/040D/020D
TABLE OF CONTENTS
FEATURES ............................................................................................................................................................ 2
GENERAL DESCRIPTION .................................................................................................................................... 3
TABLE OF CONTENTS ......................................................................................................................................... 4
1.
2.
3.
4.
5.
6.
PIN CONFIGURATION ................................................................................................................................... 7
PIN DESCRIPTIONS ...................................................................................................................................... 8
BLOCK DIAGRAM .......................................................................................................................................... 9
SPI MODES DESCRIPTION ........................................................................................................................ 10
SYSTEM CONFIGURATION ........................................................................................................................ 12
5.1 BLOCK/SECTOR ADDRESSES ............................................................................................................ 12
REGISTERS ................................................................................................................................................. 13
6.1 STATUS REGISTER .............................................................................................................................. 13
6.2 FUNCTION REGISTER .......................................................................................................................... 16
6.3 READ REGISTER AND EXTENDED REGISTER .................................................................................. 17
6.4 AUTOBOOT REGISTER ........................................................................................................................ 21
7.
PROTECTION MODE................................................................................................................................... 22
7.1 HARDWARE WRITE PROTECTION...................................................................................................... 22
7.2 SOFTWARE WRITE PROTECTION ...................................................................................................... 22
8.
DEVICE OPERATION .................................................................................................................................. 23
8.1 NORMAL READ OPERATION (NORD, 03h) ......................................................................................... 26
8.2 FAST READ OPERATION (FRD, 0Bh) .................................................................................................. 28
8.3 HOLD OPERATION ................................................................................................................................ 30
8.4 FAST READ DUAL I/O OPERATION (FRDIO, BBh) ............................................................................. 30
8.5 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh) ..................................................................... 33
8.6 FAST READ QUAD OUTPUT OPERATION (FRQO, 6Bh).................................................................... 34
8.7 FAST READ QUAD I/O OPERATION (FRQIO, EBh) ............................................................................ 36
8.8 PAGE PROGRAM OPERATION (PP, 02h) ............................................................................................ 40
8.9 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 32h/38h) .......................................................... 42
8.10 ERASE OPERATION ........................................................................................................................... 43
8.11 SECTOR ERASE OPERATION (SER, D7h/20h) ................................................................................. 44
8.12 BLOCK ERASE OPERATION (BER32K:52h, BER64K:D8h) .............................................................. 45
8.13 CHIP ERASE OPERATION (CER, C7h/60h) ....................................................................................... 47
8.14 WRITE ENABLE OPERATION (WREN, 06h) ...................................................................................... 48
8.15 WRITE DISABLE OPERATION (WRDI, 04h) ....................................................................................... 49
8.16 READ STATUS REGISTER OPERATION (RDSR, 05h) ..................................................................... 50
8.17 WRITE STATUS REGISTER OPERATION (WRSR, 01h) ................................................................... 51
8.18 READ FUNCTION REGISTER OPERATION (RDFR, 48h) ................................................................. 52
8.19 WRITE FUNCTION REGISTER OPERATION (WRFR, 42h)............................................................... 53
8.20 ENTER QUAD PERIPHERAL INTERFACE (QPI) MODE OPERATION (QPIEN, 35h; QPIDI, F5h) .. 54
8.21 PROGRAM/ERASE SUSPEND & RESUME ........................................................................................ 55
Integrated Silicon Solution, Inc.- www.issi.com
Rev. B1
02/22/2017
4
IS25LP080D
IS25WP080D/040D/020D
8.22 ENTER DEEP POWER DOWN (DP, B9h) ........................................................................................... 57
8.23 RELEASE DEEP POWER DOWN (RDPD, ABh) ................................................................................. 58
8.24 SET READ PARAMETERS OPERATION (SRPNV: 65h, SRPV: C0h/63h) ........................................ 59
8.25 SET EXTENDED READ PARAMETERS OPERATION (SERPNV: 85h, SERPV: 83h) ...................... 61
8.26 READ READ PARAMETERS OPERATION (RDRP, 61h) ................................................................... 62
8.27 READ EXTENDED READ PARAMETERS OPERATION (RDERP, 81h) ............................................ 63
8.28 CLEAR EXTENDED READ PARAMETERS OPERATION (CLERP, 82h) .......................................... 64
8.29 READ PRODUCT IDENTIFICATION (RDID, ABh) .............................................................................. 65
8.30 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh; RDJDIDQ, AFh) .. 67
8.31 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) .......................... 68
8.31 READ UNIQUE ID NUMBER (RDUID, 4Bh) ........................................................................................ 69
8.32 READ SFDP OPERATION (RDSFDP, 5Ah) ........................................................................................ 70
8.33 NO OPERATION (NOP, 00h) ............................................................................................................... 70
8.34 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h)) AND HARDWARE
RESET .......................................................................................................................................................... 71
8.35 SECURITY INFORMATION ROW ........................................................................................................ 72
8.36 INFORMATION ROW ERASE OPERATION (IRER, 64h) ................................................................... 73
8.37 INFORMATION ROW PROGRAM OPERATION (IRP, 62h) ............................................................... 74
8.38 INFORMATION ROW READ OPERATION (IRRD, 68h) ..................................................................... 75
8.39 FAST READ DTR MODE OPERATION In SPI MODE (FRDTR, 0Dh) ................................................ 76
8.40 FAST READ DUAL IO DTR MODE OPERATION (FRDDTR, BDh) .................................................... 78
8.41 FAST READ QUAD IO DTR MODE OPERATION IN SPI MODE (FRQDTR, EDh) ............................ 81
8.42 SECTOR LOCK/UNLOCK FUNCTIONS .............................................................................................. 85
8.43 AUTOBOOT .......................................................................................................................................... 87
9.
ELECTRICAL CHARACTERISTICS............................................................................................................. 91
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
..................................................................................................... 91
9.2 OPERATING RANGE ............................................................................................................................. 91
9.3 DC CHARACTERISTICS ........................................................................................................................ 92
9.4 AC MEASUREMENT CONDITIONS ...................................................................................................... 93
9.5 PIN CAPACITANCE ............................................................................................................................... 93
9.6 AC CHARACTERISTICS ........................................................................................................................ 94
9.7 SERIAL INPUT/OUTPUT TIMING .......................................................................................................... 96
9.8 POWER-UP AND POWER-DOWN ........................................................................................................ 98
9.9 PROGRAM/ERASE PERFORMANCE ................................................................................................... 99
9.10 RELIABILITY CHARACTERISTICS ..................................................................................................... 99
10.
PACKAGE TYPE INFORMATION ......................................................................................................... 100
10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (B) ............................ 100
10.2 8-Pin JEDEC 150mil Broad Small Outline Integrated Circuit (SOIC) Package (N) ............................ 101
10.3 8-Pin 150mil VVSOP Package (V)...................................................................................................... 102
10.4 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 2x3mm (U) ...................................... 103
10.5 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 4x3mm (T)....................................... 104
Integrated Silicon Solution, Inc.- www.issi.com
Rev. B1
02/22/2017
5
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