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IS25LP128F-RGLE-TR

NOR闪存 128Mb 3V 80/166Mhz Serial NOR闪存

器件类别:半导体    存储器 IC    NOR闪存   

厂商名称:ISSI(芯成半导体)

厂商官网:http://www.issi.com/

器件标准:

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器件参数
参数名称
属性值
厂商名称
ISSI(芯成半导体)
产品种类
NOR闪存
安装风格
SMD/SMT
封装 / 箱体
TFBGA-24
系列
IS25LP128F
存储容量
128 Mbit
最大时钟频率
166 MHz
接口类型
SPI
组织
16 M x 8
定时类型
Synchronous
数据总线宽度
8 bit
电源电压-最小
2.3 V
电源电压-最大
3.6 V
电源电流—最大值
13.5 mA
最小工作温度
- 40 C
最大工作温度
+ 105 C
封装
Reel
速度
166 MHz
工厂包装数量
2500
文档预览
IS25LP128F
128Mb
IS25WP128F
SERIAL FLASH MEMORY WITH 166MHZ MULTI I/O SPI &
QUAD I/O QPI DTR INTERFACE
DATA SHEET
IS25LP128F
IS25WP128F
128Mb
SERIAL FLASH MEMORY WITH 166MHZ MULTI I/O SPI &
QUAD I/O QPI DTR INTERFACE
FEATURES
Industry Standard Serial Interface
-
IS25LP128F: 128Mbit/16Mbyte
-
IS25WP128F: 128Mbit/16Mbyte
-
3 or 4 Byte Addressing Mode
-
Supports Standard SPI, Fast, Dual, Dual
I/O, Quad, Quad I/O, SPI DTR, Dual I/O
DTR, Quad I/O DTR, and QPI
-
Software & Hardware Reset
-
Supports Serial Flash Discoverable
Parameters (SFDP)
High Performance Serial Flash (SPI)
-
80MHz Normal Read
-
Up to166Mhz Fast Read
-
Up to 80MHz DTR (Dual Transfer Rate)
-
Equivalent Throughput of 664 Mb/s
-
Selectable Dummy Cycles
-
Configurable Drive Strength
-
Supports SPI Modes 0 and 3
-
More than 100,000 Erase/Program Cycles
-
More than 20-year Data Retention
Flexible & Efficient Memory Architecture
-
Chip Erase with Uniform Sector/Block
Erase (4/32/64 Kbyte)
-
Program 1 to 256 Byte per Page
-
Program/Erase Suspend & Resume
Efficient Read and Program modes
-
Low Instruction Overhead Operations
-
Continuous Read 8/16/32/64 Byte
Burst Wrap
-
Selectable Burst Length
-
QPI for Reduced Instruction Overhead
-
AutoBoot Operation
Low Power with Wide Temp. Ranges
-
Single Voltage Supply
IS25LP: 2.30V to 3.60V
IS25WP: 1.65V to 1.95V
-
10 mA Active Read Current
-
8 µA Standby Current
-
1 µA Deep Power Down
-
Temp Grades:
Extended: -40°C to +105°C
Auto Grade (A3) : -40°C to +125°C
Advanced Security Protection
-
Software and Hardware Write Protection
-
Advanced Sector/Block Protection
-
Top/Bottom Block Protection
-
Power Supply Lock Protection
-
4x256 Byte Dedicated Security Area
with OTP User-lockable Bits
-
128 bit Unique ID for Each Device
(Call Factory)
Industry Standard Pin-out & Packages
-
M =16-pin SOIC 300mil
-
B = 8-pin SOIC 208mil
-
K = 8-contact WSON 6x5mm
-
L = 8-contact WSON 8x6mm
-
G = 24-ball TFBGA (4x6 ball array)
-
H = 24-ball TFBGA (5x5 ball array)
-
KGD (Call Factory)
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A4
04/15/2019
2
IS25LP128F
IS25WP128F
GENERAL DESCRIPTION
The IS25LP128F and IS25WP128F Serial Flash memory offers a versatile storage solution with high flexibility and
performance in a simplified pin count package. ISSI’s “Industry Standard Serial Interface” Flash is for systems that
require limited space, a low pin count, and low power consumption. The device is accessed through a 4-wire SPI
Interface consisting of a Serial Data Input (SI), Serial Data Output (SO), Serial Clock (SCK), and Chip Enable
(CE#) pins, which can also be configured to serve as multi-I/O (see pin descriptions).
The device supports Dual and Quad I/O as well as standard, Dual Output, and Quad Output SPI. Clock frequencies
of up to 166MHz allow for equivalent clock rates of up to 664MHz (166MHz x 4) which equates to 83Mbytes/s of
data throughput. The IS25xP series of Flash adds support for DTR (Double Transfer Rate) commands that transfer
addresses and read data on both edges of the clock. These transfer rates can outperform 16-bit Parallel Flash
memories allowing for efficient memory access to support XIP (execute in place) operation.
Initial state of the memory array is erased (all bits are set to 1) when shipped from the factory.
QPI (Quad Peripheral Interface) supports 2-cycle instruction further reducing instruction times. Pages can be
erased in groups of 4Kbyte sectors, 32Kbyte blocks, 64Kbyte blocks, and/or the entire chip. The uniform sector
and block architecture allows for a high degree of flexibility so that the device can be utilized for a broad variety of
applications requiring solid data retention.
Supply Voltage & Temperature Range vs. Maximum Speed
Voltage & Temp.
IS25LP (3.0V typ.)
IS25WP (1.8V typ.)
2.30~3.6V, 125
°C
2.70~3.6V, 125
°C
1.65~1.95V, 125
°C
1.70~1.95V, 105
°C
Speed
133MHz
166MHz
133MHz
166MHz
(1)
Note:
1. Values are guaranteed by characterization and not 100% tested in production.
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A4
04/15/2019
3
IS25LP128F
IS25WP128F
TABLE OF CONTENTS
FEATURES ............................................................................................................................................................ 2
GENERAL DESCRIPTION .................................................................................................................................... 3
TABLE OF CONTENTS ......................................................................................................................................... 4
1.
2.
3.
4.
5.
PIN CONFIGURATION ................................................................................................................................... 7
PIN DESCRIPTIONS ...................................................................................................................................... 9
BLOCK DIAGRAM ........................................................................................................................................ 11
SPI MODES DESCRIPTION ........................................................................................................................ 12
SYSTEM CONFIGURATION ........................................................................................................................ 14
5.1 BLOCK/SECTOR ADDRESSES ............................................................................................................ 14
5.2 Serial Flash Discoverable Parameters ................................................................................................... 15
6.
REGISTERS ................................................................................................................................................. 20
6.1 STATUS REGISTER .............................................................................................................................. 20
6.2 FUNCTION REGISTER .......................................................................................................................... 25
6.3 READ REGISTER AND EXTENDED REGISTER .................................................................................. 26
6.3.1 READ REGISTER .......................................................................................................................... 26
6.3.2 EXTENDED READ REGISTER ...................................................................................................... 28
6.4 AUTOBOOT REGISTER ........................................................................................................................ 30
6.5 BANK ADDRESS REGISTER ................................................................................................................ 31
6.6 ADVANCED SECTOR/BLOCK PROTECTION (ASP) RELATED REGISTER ...................................... 32
6.6.1 ADVANCED SECTOR/BLOCK PROTECTION REGISTER (ASPR) ............................................. 32
6.6.2 PASSWORD REGISTER ............................................................................................................... 33
6.6.3 PPB LOCK REGISTER .................................................................................................................. 33
6.6.4 PPB REGISTER ............................................................................................................................. 34
6.6.5 DYB REGISTER ............................................................................................................................. 34
7.
PROTECTION MODE................................................................................................................................... 35
7.1 HARDWARE WRITE PROTECTION...................................................................................................... 35
7.2 SOFTWARE WRITE PROTECTION ...................................................................................................... 35
7.2.1 BLOCK PROTECTION BITS .......................................................................................................... 35
7.2.2 ADVANCED SECTOR/BLOCK PROTECTION (ASP) ................................................................... 36
8.
DEVICE OPERATION .................................................................................................................................. 43
8.1 COMMAND OVERVIEW ........................................................................................................................ 43
8.2 COMMAND SET SUMMARY ................................................................................................................. 44
8.3 NORMAL READ OPERATION (NORD, 03h or 4NORD, 13h) ............................................................... 52
8.4 FAST READ OPERATION (FRD, 0Bh or 4FRD, 0Ch) ........................................................................... 55
8.5 HOLD OPERATION ................................................................................................................................ 59
8.6 FAST READ DUAL I/O OPERATION (FRDIO, BBh or 4FRDIO, BCh) .................................................. 60
8.7 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh or 4FRDO, 3Ch)........................................... 64
8.8 FAST READ QUAD OUTPUT OPERATION (FRQO, 6Bh or 4FRQO 6Ch) .......................................... 67
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A4
04/15/2019
4
IS25LP128F
IS25WP128F
8.9 FAST READ QUAD I/O OPERATION (FRQIO, EBh or 4FRQIO, ECh) ................................................. 70
8.10 PAGE PROGRAM OPERATION (PP, 02h or 4PP, 12h)...................................................................... 77
8.11 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 32h/38h or 4PPQ, 34h/3Eh) .......................... 80
8.12 ERASE OPERATION ........................................................................................................................... 81
8.13 SECTOR ERASE OPERATION (SER, D7h/20h or 4SER, 21h) .......................................................... 82
8.14 BLOCK ERASE OPERATION (BER32K:52h or 4BER32K:5Ch, BER64K:D8h or 4BER64K:DCh) .... 84
8.15 CHIP ERASE OPERATION (CER, C7h/60h) ....................................................................................... 87
8.16 WRITE ENABLE OPERATION (WREN, 06h) ...................................................................................... 88
8.17 WRITE DISABLE OPERATION (WRDI, 04h) ....................................................................................... 89
8.18 READ STATUS REGISTER OPERATION (RDSR, 05h) ..................................................................... 90
8.19 WRITE STATUS REGISTER OPERATION (WRSR, 01h) ................................................................... 91
8.20 READ FUNCTION REGISTER OPERATION (RDFR, 48h) ................................................................. 92
8.21 WRITE FUNCTION REGISTER OPERATION (WRFR, 42h)............................................................... 93
8.22 ENTER QUAD PERIPHERAL INTERFACE (QPI) MODE OPERATION (QPIEN, 35h; QPIDI,F5h) ... 94
8.23 PROGRAM/ERASE SUSPEND & RESUME ........................................................................................ 95
8.24 ENTER DEEP POWER DOWN (DP, B9h) ........................................................................................... 98
8.25 RELEASE DEEP POWER DOWN (RDPD, ABh) ................................................................................. 99
8.26 SET READ PARAMETERS OPERATION (SRPNV: 65h, SRPV: C0h/63h) ...................................... 100
8.27 SET EXTENDED READ PARAMETERS OPERATION (SERPNV: 85h, SERPV: 83h) .................... 102
8.28 READ READ PARAMETERS OPERATION (RDRP, 61h) ................................................................. 103
8.29 READ EXTENDED READ PARAMETERS OPERATION (RDERP, 81h) .......................................... 104
8.30 CLEAR EXTENDED READ REGISTER OPERATION (CLERP, 82h) ............................................... 105
8.31 READ PRODUCT IDENTIFICATION (RDID, ABh) ............................................................................ 106
8.32 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh; RDJDIDQ, AFh) 108
8.33 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) ........................ 109
8.34 READ UNIQUE ID NUMBER (RDUID, 4Bh) ...................................................................................... 110
8.35 READ SFDP OPERATION (RDSFDP, 5Ah) ...................................................................................... 111
8.36 NO OPERATION (NOP, 00h) ............................................................................................................. 111
8.37 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h)) AND HARDWARE
RESET ........................................................................................................................................................ 112
8.38 SECURITY INFORMATION ROW ...................................................................................................... 113
8.39 INFORMATION ROW ERASE OPERATION (IRER, 64h) ................................................................. 114
8.40 INFORMATION ROW PROGRAM OPERATION (IRP, 62h) ............................................................. 115
8.41 INFORMATION ROW READ OPERATION (IRRD, 68h) ................................................................... 116
8.42 FAST READ DTR MODE OPERATION (FRDTR, 0Dh or 4FRDTR, 0Eh) ......................................... 117
8.43 FAST READ DUAL IO DTR MODE OPERATION (FRDDTR, BDh or 4FRDDTR, BEh) ................... 122
8.44 FAST READ QUAD IO DTR MODE OPERATION IN SPI MODE (FRQDTR, EDh or 4FRQDTR,
EEh) ............................................................................................................................................................ 126
8.45 SECTOR LOCK/UNLOCK FUNCTIONS ............................................................................................ 134
8.46 AUTOBOOT ........................................................................................................................................ 137
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A4
04/15/2019
5
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参数对比
与IS25LP128F-RGLE-TR相近的元器件有:IS25LP128F-RHLE-TR、IS25WP128F-RMLE-TR、IS25WP128F-RMLE、IS25LP128F-RHLE、IS25LP128F-RGLE。描述及对比如下:
型号 IS25LP128F-RGLE-TR IS25LP128F-RHLE-TR IS25WP128F-RMLE-TR IS25WP128F-RMLE IS25LP128F-RHLE IS25LP128F-RGLE
描述 NOR闪存 128Mb 3V 80/166Mhz Serial NOR闪存 NOR闪存 128Mb 3V 80/166Mhz Serial NOR闪存 NOR闪存 128Mb QPI/QSPI, 16-pin SOP 300Mil, RoHS, reset pin, T&R NOR闪存 128Mb QPI/QSPI, 16-pin SOP 300Mil, RoHS, reset pin Flash, 16MX8, PBGA24, TFBGA-24 Flash, 16MX8, PBGA24, TFBGA-24
组织 16 M x 8 16 M x 8 16 M x 8 16 M x 8 16MX8 16MX8
厂商名称 ISSI(芯成半导体) ISSI(芯成半导体) ISSI(芯成半导体) ISSI(芯成半导体) - -
产品种类 NOR闪存 NOR闪存 NOR闪存 NOR闪存 - -
安装风格 SMD/SMT SMD/SMT SMD/SMT SMD/SMT - -
封装 / 箱体 TFBGA-24 TFBGA-24 SOIC-16 SOIC-16 - -
系列 IS25LP128F IS25LP128F IS25WP128F IS25WP128F - -
存储容量 128 Mbit 128 Mbit 128 Mbit 128 Mbit - -
最大时钟频率 166 MHz 166 MHz 166 MHz 166 MHz - -
接口类型 SPI SPI Serial, SPI, QPI Serial, SPI, QPI - -
定时类型 Synchronous Synchronous Synchronous Synchronous - -
数据总线宽度 8 bit 8 bit 8 bit 8 bit - -
电源电压-最小 2.3 V 2.3 V 1.65 V 1.65 V - -
电源电压-最大 3.6 V 3.6 V 1.95 V 1.95 V - -
电源电流—最大值 13.5 mA 13.5 mA 30 mA 30 mA - -
最小工作温度 - 40 C - 40 C - 40 C - 40 C - -
最大工作温度 + 105 C + 105 C + 105 C + 105 C - -
速度 166 MHz 166 MHz 166 MHz 166 MHz - -
工厂包装数量 2500 2500 1000 44 - -
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