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IS42S32400AL-7TL

Synchronous DRAM, 4MX32, 5.4ns, CMOS, PDSO86, LEAD FREE, TSOP2-86

器件类别:存储    存储   

厂商名称:Integrated Silicon Solution ( ISSI )

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Integrated Silicon Solution ( ISSI )
零件包装代码
TSOP2
包装说明
SOP, TSSOP86,.46,20
针数
86
Reach Compliance Code
compliant
ECCN代码
EAR99
访问模式
FOUR BANK PAGE BURST
最长访问时间
5.4 ns
其他特性
AUTO/SELF REFRESH
最大时钟频率 (fCLK)
143 MHz
I/O 类型
COMMON
交错的突发长度
1,2,4,8
JESD-30 代码
R-PDSO-G86
JESD-609代码
e3
内存密度
134217728 bit
内存集成电路类型
SYNCHRONOUS DRAM
内存宽度
32
湿度敏感等级
3
功能数量
1
端口数量
1
端子数量
86
字数
4194304 words
字数代码
4000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
4MX32
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
TSSOP86,.46,20
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
电源
3.3 V
认证状态
Not Qualified
刷新周期
4096
自我刷新
YES
连续突发长度
1,2,4,8,FP
最大待机电流
0.00001 A
最大压摆率
0.21 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Matte Tin (Sn) - annealed
端子形式
GULL WING
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
文档预览
IS42S81600AL, IS42LS81600AL
IS42S16800AL, IS42LS16800AL
IS42S32400AL, IS42LS32400AL
16Meg x 8, 8Meg x16 & 4Meg x 32
128-MBIT LOW-POWER
SYNCHRONOUS DRAM
FEATURES
• Clock frequency: 133, 100, MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
IS42LS81600AL
IS42LS16800AL
IS42LS32400AL
IS42S81600AL
IS42S16800AL
IS42S32400AL
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Extended Mode Register
• Programmable Power Reduction Feature by
partial array activation during Self-Refresh
• Auto Precharge and Auto refresh Modes
• Temp. Compensated Self Refresh.
• Self Refresh Mode: Standard and Low-Power
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable
CAS
latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and Precharge
command
• Industrial Temperature Availability
• Lead-free Availability
V
DD
2.5V
2.5V
2.5V
3.3V
3.3V
3.3V
V
DDQ
1.8V (2.5V tolerant)
1.8V (2.5V tolerant)
1.8V (2.5V tolerant)
3.3V
3.3V
3.3V
IS42LS81600AL
IS42S81600AL
4M x8x4 Banks
54-Pin TSOPII
ISSI
®
PRELIMINARY INFORMATION
SEPTEMBER 2003
OVERVIEW
ISSI
's 128Mb Low - Power Synchronous DRAM achieves
high-speed data transfer using pipeline architecture. All
inputs and outputs signals refer to the rising edge of the
clock input. The 128Mb SDRAM is organized as follows.
IS42LS16800AL
IS42S16800AL
2M x16x4 Banks
54-ball FBGA
54-pin TSOPII
IS42LS32400AL
IS42S32400AL
1M x32x4 Banks
90-ball FBGA
86-pin TSOPII
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
CAS
Latency = 3
CAS
Latency = 2
Clk Frequency
CAS
Latency = 3
CAS
Latency = 2
Access Time from Clock
CAS
Latency = 3
CAS
Latency = 2
-7
7
10
133
100
5.4
6
-10
10
10
100
100
7
9
Unit
ns
ns
Mhz
Mhz
ns
ns
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
PRELIMINARY
09/18/03
INFORMATION,
Rev. 00A
1
IS42S81600AL, IS42S16800AL, IS42S32400AL
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL
DEVICE OVERVIEW
The 128Mb Low - Power SDRAM is a high speed CMOS,
dynamic random-access memory designed to operate in
2.5V V
DD
and 1.8V V
DDQ
or 3.3VV
DD
and 3.3V V
DDQ
memory
systems containing 134,217 ,728 bits. Internally configured
as a quad-bank DRAM with a synchronous interface. (Each
33,554,432-bit bank is organized as 4,096 rows by 512
columns by 16 bits.)
The 128Mb Low - Power SDRAM includes an AUTO RE-
FRESH MODE, and a power-saving, power-down mode.
All signals are registered on the positive edge of the clock
signal, CLK. All inputs and outputs are LVTTL compatible.
Only partials of the memory array can be selected for Self-
Refresh and the refresh period during Self-Refresh is
programmable in 4 steps which drastically reduces the self
refresh current, depending on the case temperature of the
components in the system application.
The 128Mb Low - Power SDRAM has the ability to synchro-
nously burst data at a high data rate with automatic column-
address generation, the ability to interleave between inter-
ISSI
®
nal banks to hide precharge time and the capability to
randomly change column addresses on each clock cycle
during burst access.
A self-timed row precharge initiated at the end of the burst
sequence is available with the AUTO PRECHARGE func-
tion enabled. Precharge one bank while accessing one of the
other three banks will hide the precharge cycles and provide
seamless, high-speed, random-access operation.
SDRAM read and write accesses are burst oriented starting at
a selected location and continuing for a programmed num-
ber of locations in a programmed sequence. The registra-
tion of an ACTIVE command begins accesses, followed by
a READ or WRITE command. The ACTIVE command in
conjunction with address bits registered are used to select
the bank and row to be accessed (BA0, BA1 select the
bank; A0-A11 select the row). The READ or WRITE
commands in conjunction with address bits registered are
used to select the starting column location for the burst
access.
Programmable READ or WRITE burst lengths consist of 1,
2, 4 and 8 locations or full page, with a burst terminate
option.
FUNCTIONAL BLOCK DIAGRAM (ONLY FOR 2MX16X4 BANKS)
CLK
CKE
CS
RAS
CAS
WE
DQML
DQMH
COMMAND
DECODER
&
CLOCK
GENERATOR
DATA IN
BUFFER
16
16
2
MODE
REGISTER
12
REFRESH
CONTROLLER
I/O 0-15
SELF
REFRESH
CONTROLLER
A10
A11
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
12
DATA OUT
BUFFER
16
16
V
DD
/V
DDQ
V
ss
/V
ss
Q
REFRESH
COUNTER
4096
4096
4096
4096
ROW DECODER
MULTIPLEXER
MEMORY CELL
ARRAY
12
ROW
ADDRESS
LATCH
12
ROW
ADDRESS
BUFFER
BANK 0
SENSE AMP I/O GATE
COLUMN
ADDRESS LATCH
9
512
(x 16)
BANK CONTROL LOGIC
BURST COUNTER
COLUMN DECODER
COLUMN
ADDRESS BUFFER
9
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
PRELIMINARY
INFORMATION
Rev. 00A
09/18/03
IS42S81600AL, IS42S16800AL, IS42S32400AL
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL
PIN CONFIGURATIONS
54-Pin TSOP - Type II for x8
ISSI
®
V
DD
I/O0
V
DD
Q
NC
I/O1
V
SS
Q
NC
I/O2
V
DD
Q
NC
I/O3
V
SS
Q
NC
V
DD
NC
WE
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
A3
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
V
SS
I/O7
V
SS
Q
NC
I/O6
V
DD
Q
NC
I/O5
V
SS
Q
NC
I/O4
V
DD
Q
NC
V
SS
NC
DQM
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
V
SS
PIN DESCRIPTIONS
A0-A11
A0-A9
BA0, BA1
I/O0 to I/O15
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
WE
DQM
V
DD
Vss
V
DDQ
Vss
Q
NC
Write Enable
x 8 Lower Byte, Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
PRELIMINARY
09/18/03
INFORMATION
Rev. 00A
3
IS42S81600AL, IS42S16800AL, IS42S32400AL
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL
PIN CONFIGURATIONS
54-Ball FBGA for x16
ISSI
8
9
®
1
2
3
4
5
6
7
A
Vss
B
I/O14
C
I/O12
D
I/O10
E
I/O8
F
DQMH
G
NC/A12
H
A8
J
Vss
A5
A4
A3
A2
VDD
A7
A6
A0
A1
A10
A11
A9
BA0
BA1
CLK
CKE
NC
Vss
VDD
CAS
DQML
RAS
I/O7
WE
CS
I/O9
VDDQ
VssQ
I/O6
I/O5
I/O11
VssQ
VDDQ
I/O4
I/O3
I/O13
VDDQ
VssQ
I/O2
I/O1
I/O15
VssQ
VDDQ
I/O0
VDD
PIN DESCRIPTIONS
A0-A11
A0-A8
BA0, BA1
I/O0 to I/O15
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
WE
DQML
DQMH
V
DD
Vss
V
DDQ
Vss
Q
NC
Write Enable
x16 Lower Byte, Input/Output Mask
x16 Upper Byte, Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
4
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
PRELIMINARY
INFORMATION
Rev. 00A
09/18/03
IS42S81600AL, IS42S16800AL, IS42S32400AL
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL
PIN CONFIGURATIONS
54-Pin TSOP - Type II for x16
ISSI
®
V
DD
I/O0
V
DD
Q
I/O1
I/O2
V
SS
Q
I/O3
I/O4
V
DD
Q
I/O5
I/O6
V
SS
Q
I/O7
V
DD
DQML
WE
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
A3
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
V
SS
I/O15
V
SS
Q
I/O14
I/O13
V
DD
Q
I/O12
I/O11
V
SS
Q
I/O10
I/O9
V
DD
Q
I/O8
V
SS
NC
DQMH
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
V
SS
PIN DESCRIPTIONS
A0-A11
A0-A8
BA0, BA1
I/O0 to I/O15
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
WE
DQML
DQMH
V
DD
Vss
V
DDQ
Vss
Q
NC
Write Enable
x16 Lower Byte, Input/Output Mask
x16 Upper Byte, Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
PRELIMINARY
09/18/03
INFORMATION
Rev. 00A
5
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