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IS61LF51218A-6.5TQ

256K X 36 CACHE SRAM, 7.5 ns, PQFP100
256K × 36 高速缓存 静态随机存储器, 7.5 ns, PQFP100

器件类别:存储    存储   

厂商名称:ISSI(芯成半导体)

厂商官网:http://www.issi.com/

下载文档
器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
ISSI(芯成半导体)
零件包装代码
QFP
包装说明
TQFP-100
针数
100
Reach Compliance Code
compliant
ECCN代码
3A991.B.2.A
最长访问时间
6.5 ns
其他特性
FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK)
133 MHz
I/O 类型
COMMON
JESD-30 代码
R-PQFP-G100
JESD-609代码
e0
长度
20 mm
内存密度
9437184 bit
内存集成电路类型
CACHE SRAM
内存宽度
18
功能数量
1
端子数量
100
字数
524288 words
字数代码
512000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
512KX18
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装等效代码
QFP100,.63X.87
封装形状
RECTANGULAR
封装形式
FLATPACK, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
2.5/3.3,3.3 V
认证状态
Not Qualified
座面最大高度
1.6 mm
最大待机电流
0.08 A
最小待机电流
3.14 V
最大压摆率
0.185 mA
最大供电电压 (Vsup)
3.465 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
14 mm
Base Number Matches
1
文档预览
IS61LF25636A    IS61VF25636A    IS64LF25636A
IS61LF51218A    IS61VF51218A 
256K x 36, 512K x 18 
9 Mb SYNCHRONOUS FLOW-THROUGH 
SEPTEMBER 2010
STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth expan-
sion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• JTAG Boundary Scan for PBGA package
• Power Supply
LF: V
dd
3.3V + 5%,
V
ddq
3.3V/2.5V + 5%
VF: V
dd
2.5V + 5%,
V
ddq
2.5V + 5%
• JEDEC 100-Pin TQFP, 119-pin PBGA, and 165-
pin PBGA packages
• Lead-free available
• Automotive temperature available
VF51218A are high-speed, low-power synchronous
static RAMs designed to provide burstable, high-performance
memory for communication and networking applications.
The IS61LF/VF25636A and IS64LF25636A are organized
as 262,144 words by 36 bits. The IS61LF/VF51218A is
organized as 524,288 words by 18 bits. Fabricated with
ISSI
's advanced CMOS technology, the device integrates
a 2-bit burst counter, high-speed SRAM core, and high-
drive capability outputs into a single monolithic circuit. All
synchronous inputs pass through registers controlled by
a positive-edge-triggered single clock input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be one to
four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
Byte write operation is performed by using byte write en-
able (BWE) input combined with one or more individual
byte write signals (BWx). In addition, Global Write (GW)
is available for writing all bytes at one time, regardless of
the byte write controls.
Bursts can be initiated with either ADSP (Address Status
Processor) or ADSC (Address Status Cache Controller)
input pins. Subsequent burst addresses can be gener-
ated internally and controlled by the ADV (burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW. Inter-
leave burst is achieved when this pin is tied HIGH or left
floating.
-6.5 
6.5
7.5
133
-7.5 
7.5
8.5
117
Units
ns
ns
MHz
DESCRIPTION
The
ISSI
IS61LF/VF25636A, IS64LF25636A and IS61LF/
FAST ACCESS TIME
Symbol 
t
kq
t
kc
Parameter 
Clock Access Time
Cycle Time
Frequency
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.
Rev.  H
07/22/2010
1
 IS61/64LF25636A   IS61LF51218A   IS61VF25636A   IS61VF51218A
BLOCK DIAGRAM
MODE
CLK
CLK
Q0
A0
A0'
BINARY
COUNTER
ADV
ADSC
ADSP
CE
CLR
Q1
A1
A1'
256Kx36;
512Kx18;
MEMORY ARRAY
18/19
A
18/19
D
Q
16/17
ADDRESS
REGISTER
CE
CLK
36,
or 18
36,
or 18
GW
BWE
BW(a-d)
x18: a,b
x36: a-d
DQ(a-d)
BYTE WRITE
REGISTERS
CLK
D
Q
CE
CE2
CE2
D
Q
2/4/8
ENABLE
REGISTER
CE
CLK
INPUT
REGISTERS
CLK
36,
or 18
DQa - DQd
OE
ZZ
POWER
DOWN
OE
2
Integrated Silicon Solution, Inc.
Rev.  H
07/22/2010
 IS61/64LF25636A   IS61LF51218A   IS61VF25636A   IS61VF51218A
165-PIN BGA
165-Ball, 13x15 mm BGA
119-PIN BGA
119-Ball, 14x22 mm BGA
BOTTOM VIEW
BOTTOM VIEW
Integrated Silicon Solution, Inc.
Rev. H
07/22/2010
3
 IS61/64LF25636A   IS61LF51218A   IS61VF25636A   IS61VF51218A
119 BGA PACKAGE PIN CONFIGURATION-
256k
x
36 (TOP VIEW)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
DDQ
NC
NC
DQc
DQc
V
DDQ
DQc
DQc
V
DDQ
DQd
DQd
V
DDQ
DQd
DQd
NC
NC
V
DDQ
2
A
CE2
A
DQPc
DQc
DQc
DQc
DQc
V
DD
DQd
DQd
DQd
DQd
DQPd
A
NC
TMS
3
A
A
A
Vss
Vss
Vss
BWc
Vss
NC
Vss
BWd
Vss
Vss
Vss
MODE
A
TDI
4
ADSP
ADSC
V
DD
NC
CE
OE
ADV
GW
V
DD
CLK
NC
BWE
A
1
*
A
0
*
V
DD
A
TCK
5
A
A
A
Vss
Vss
Vss
BWb
Vss
NC
Vss
BWa
Vss
Vss
Vss
NC
A
TDO
6
A
A
A
DQPb
DQb
DQb
DQb
DQb
V
DD
DQa
DQa
DQa
DQa
DQPa
A
NC
NC
7
V
DDQ
NC
NC
DQb
DQb
V
DDQ
DQb
DQb
V
DDQ
DQa
DQa
V
DDQ
DQa
DQa
NC
ZZ
V
DDQ
Note:  * A
0
and A
1
are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired.
PIN DESCRIPTIONS
Symbol 
A
A0, A1
ADV
ADSP
ADSC
GW
CLK
CE, CE2
BWE
Pin Name
Address Inputs
Synchronous Burst Address Inputs
Synchronous Burst Address
Advance
Address Status Processor
Address Status Controller
Global Write Enable
Synchronous Clock
Synchronous Chip Select
Byte Write Enable
Symbol 
OE
ZZ
MODE
TCK, TDO
TMS, TDI
NC
DQa-DQd
DQPa-Pd
V
dd
V
ddq
Vss
No Connect
Data Inputs/Outputs
Output Power Supply
Power Supply
Output Power Supply
Ground
Pin Name
Output Enable
Power Sleep Mode
Burst Sequence Selection
JTAG Pins
BWx (x=a-d)
Synchronous Byte Write Controls
4
Integrated Silicon Solution, Inc.
Rev.  H
07/22/2010
 IS61/64LF25636A   IS61LF51218A   IS61VF25636A   IS61VF51218A
119 BGA PACKAGE PIN CONFIGURATION
512k
x
18 (TOP VIEW)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
DDQ
NC
NC
DQb
NC
V
DDQ
NC
DQb
V
DDQ
NC
DQb
V
DDQ
DQb
NC
NC
NC
V
DDQ
2
A
CE2
A
NC
DQb
NC
DQb
NC
V
DD
DQb
NC
DQb
NC
DQPb
A
A
TMS
3
A
A
A
Vss
Vss
Vss
BWb
Vss
NC
Vss
Vss
Vss
Vss
Vss
MODE
A
TDI
4
ADSP
ADSC
V
DD
NC
CE
OE
ADV
GW
V
DD
CLK
NC
BWE
A
1
*
A
0
*
V
DD
NC
TCK
5
A
A
A
Vss
Vss
Vss
Vss
Vss
NC
Vss
BWa
Vss
Vss
Vss
NC
A
TDO
6
A
A
A
DQPa
NC
DQa
NC
DQa
V
DD
NC
DQa
NC
DQa
NC
A
A
NC
7       
V
DDQ
NC
NC
NC
DQa
V
DDQ
DQa
NC
V
DDQ
DQa
NC
V
DDQ
NC
DQa
NC
ZZ
V
DDQ
Note:  * A
0
and A
1
are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired.
PIN DESCRIPTIONS
Symbol 
A
A0, A1
ADV
ADSP
ADSC
GW
CLK
CE, CE2
BWE
Pin Name
Address Inputs
Synchronous Burst Address Inputs
Synchronous Burst Address
Advance
Address Status Processor
Address Status Controller
Global Write Enable
Synchronous Clock
Synchronous Chip Select
Byte Write Enable
Symbol 
OE
ZZ
MODE
TCK, TDO
TMS, TDI
NC
DQa-DQb
DQPa-Pb
V
dd
V
ddq
Vss
No Connect
Data Inputs/Outputs
Output Power Supply
Power Supply
Output Power Supply
Ground
Pin Name
Output Enable
Power Sleep Mode
Burst Sequence Selection
JTAG Pins
BWx (x=a,b)
Synchronous Byte Write Controls
Integrated Silicon Solution, Inc.
Rev. H
07/22/2010
5
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