without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.
Rev. K
07/29/2010
1
IS61LF25672A
IS61VF25672A
BLOCK DIAGRAM
IS61LF51236A IS61LF102418A
IS61VF51236A IS61VF102418A
MODE
Q0
A0'
CLK
CLK
A0
BINARY
COUNTER
ADV
ADSC
ADSP
CE
CLR
Q1
A1'
A1
256Kx72;
512Kx36;
1024Kx18;
MEMORY ARRAY
17/18
19/20
19/20
A
D
Q
ADDRESS
REGISTER
CE
CLK
36,18
or 72
36,18
or 72
GW
BWE
BW(a-h)
x18: a,b
x36: a-d
x72: a-h
DQ(a-d)
BYTE WRITE
REGISTERS
CLK
D
Q
CE
CE2
CE2
D
Q
2/4/8
ENABLE
REGISTER
CE
CLK
INPUT
REGISTERS
CLK
OE
36,18
or 72
DQa - DQd
ZZ
POWER
DOWN
OE
2
Integrated Silicon Solution, Inc.
Rev. K
07/29/2010
IS61LF25672A
IS61VF25672A
IS61LF51236A IS61LF102418A
IS61VF51236A IS61VF102418A
119-PIN BGA
119-Ball, 14x22 mm BGA
165-PIN BGA
165-Ball, 13x15 mm BGA
BOTTOM VIEW
BOTTOM VIEW
209-BALL BGA
209-Ball, 14 mm x 22 mm BGA
1 mm Ball Pitch, 11 x 19 Ball Array
BOTTOM VIEW
Integrated Silicon Solution, Inc.
Rev. K
07/29/2010
3
IS61LF25672A
IS61VF25672A
IS61LF51236A IS61LF102418A
IS61VF51236A IS61VF102418A
PIN CONFIGURATION — 256K X 72, 209-Ball PBGA (TOP VIEW)
1
2
3
4
5
6
7
8
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
DQg
DQg
DQg
DQg
DQPg
DQc
DQc
DQc
DQc
NC
DQh
DQh
DQh
DQh
DQPd
DQd
DQd
DQd
DQd
DQg
DQg
DQg
DQg
DQPc
DQc
DQc
DQc
DQc
NC
DQh
DQh
DQh
DQh
DQPh
DQd
DQd
DQd
DQd
A
BWc
BWh
VSS
V
DDQ
VSS
V
DDQ
VSS
V
DDQ
CLK
V
DDQ
VSS
V
DDQ
VSS
V
DDQ
VSS
NC
A
TMS
CE2
BWg
BWd
NC
V
DDQ
VSS
V
DDQ
VSS
V
DDQ
NC
V
DDQ
VSS
V
DDQ
VSS
V
DDQ
NC
A
A
TDI
ADSP
NC
NC
NC
V
DD
VSS
V
DD
VSS
V
DD
VSS
V
DD
VSS
V
DD
VSS
V
DD
NC
A
A
A
ADSC
BWE
CE
OE
V
DD
NC
NC
NC
NC
NC
NC
NC
NC
ZZ
V
DD
MODE
A
A1
A0
ADV
A
NC
GW
V
DD
VSS
V
DD
VSS
V
DD
VSS
V
DD
VSS
V
DD
VSS
V
DD
NC
A
A
A
CE2
BWb
BWe
NC
V
DDQ
VSS
V
DDQ
VSS
V
DDQ
NC
V
DDQ
VSS
V
DDQ
VSS
V
DDQ
NC
A
A
TDO
9
A
BWf
BWa
VSS
V
DDQ
VSS
V
DDQ
VSS
V
DDQ
NC
V
DDQ
VSS
V
DDQ
VSS
V
DDQ
VSS
NC
A
TCK
10
DQb
DQb
DQb
DQb
DQPf
DQf
DQf
DQf
DQf
NC
DQa
DQa
DQa
DQa
DQPa
DQe
DQe
DQe
DQe
11
DQb
DQb
DQb
DQb
DQPb
DQf
DQf
DQf
DQf
NC
DQa
DQa
DQa
DQa
DQPe
DQe
DQe
DQe
DQe
11 x 19 Ball BGA—14 x 22 mm
2
Body—1 mm Ball Pitch
PIN DESCRIPTIONS
Symbol
A
A0, A1
ADV
ADSP
ADSC
GW
CLK
CE, CE2,
CE2
BWx
(x=a,b,c,d
e,f,g,h)
Pin Name
Address Inputs
Synchronous Burst Address Inputs
Synchronous Burst Address
Advance
Address Status Processor
Address Status Controller
Global Write Enable
Synchronous Clock
Synchronous Chip Select
Synchronous Byte Write
Controls
Symbol
BWE
OE
ZZ
MODE
TCK, TDO
TMS, TDI
NC
DQx
DQPx
V
DD
V
DDQ
Vss
Pin Name
Byte Write Enable
Output Enable
Power Sleep Mode
Burst Sequence Selection
JTAG Pins
No Connect
Data Inputs/Outputs
Data Inputs/Outputs
3.3V/2.5V Power Supply
Isolated Output Power Supply
3.3V
/2.5V
Ground
4
Integrated Silicon Solution, Inc.
Rev. K
07/29/2010
IS61LF25672A
IS61VF25672A
IS61LF51236A IS61LF102418A
IS61VF51236A IS61VF102418A
119 BGA PACKAGE PIN CONFIGURATION-
512K
X
36 (TOP VIEW)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
DDQ
NC
NC
DQc
DQc
V
DDQ
DQc
DQc
V
DDQ
DQd
DQd
V
DDQ
DQd
DQd
NC
NC
V
DDQ
2
A
A
A
DQPc
DQc
DQc
DQc
DQc
V
DD
DQd
DQd
DQd
DQd
DQPd
A
NC
TMS
3
A
A
A
Vss
Vss
Vss
BWc
Vss
NC
Vss
BWd
Vss
Vss
Vss
MODE
A
TDI
4
ADSP
ADSC
V
DD
NC
CE
OE
ADV
GW
V
DD
CLK
NC
BWE
A
1
*
A
0
*
V
DD
A
TCK
5
A
A
A
Vss
Vss
Vss
BWb
Vss
NC
Vss
BWa
Vss
Vss
Vss
NC
A
TDO
6
A
A
A
DQPb
DQb
DQb
DQb
DQb
V
DD
DQa
DQa
DQa
DQa
DQPa
A
NC
NC
7
V
DDQ
NC
NC
DQb
DQb
V
DDQ
DQb
DQb
V
DDQ
DQa
DQa
V
DDQ
DQa
DQa
NC
ZZ
V
DDQ
Note:
* A
0
and A
1
are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired.
IP(Intellectual Property)就是常说的知识产权。美国Dataquest咨询公司将半导体产业的IP定义为用于ASIC、ASSP和PLD等当中,并且是预先设计好的电路模块。IP核模块有行为(Behavior)、结构(Structure)和物理(Physical)三级不同程度的设计。根据描述功能行为的不同,IP核分为三类,即软核(Soft IP Core)、完成结构描述的固核(F...[详细]