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IS61VPS25618EC-250B3I

Cache SRAM, 256KX18, 2.6ns, CMOS, PBGA165, TFBGA-165

器件类别:存储    存储   

厂商名称:Integrated Silicon Solution ( ISSI )

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Integrated Silicon Solution ( ISSI )
零件包装代码
BGA
包装说明
TBGA, BGA165,11X15,40
针数
165
Reach Compliance Code
compli
ECCN代码
3A991.B.2.A
最长访问时间
2.6 ns
最大时钟频率 (fCLK)
250 MHz
I/O 类型
COMMON
JESD-30 代码
R-PBGA-B165
长度
15 mm
内存密度
4718592 bi
内存集成电路类型
CACHE SRAM
内存宽度
18
功能数量
1
端子数量
165
字数
262144 words
字数代码
256000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
256KX18
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
TBGA
封装等效代码
BGA165,11X15,40
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE
并行/串行
PARALLEL
电源
2.5 V
认证状态
Not Qualified
座面最大高度
1.2 mm
最大待机电流
0.085 A
最小待机电流
2.37 V
最大压摆率
0.26 mA
最大供电电压 (Vsup)
2.625 V
最小供电电压 (Vsup)
2.375 V
标称供电电压 (Vsup)
2.5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
宽度
13 mm
文档预览
IS61(4)LPS12836EC/IS61(4)VPS12836EC/IS61(4)LPS12832EC
IS61(4)VPS12832EC/IS61(4)LPS25618EC/IS61(4)VPS25618EC
128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS PIPELINED,
SINGLE CYCLE DESELECT SRAM
APRIL 2014
FEATURES
Internal self-timed write cycle
Individual Byte Write Control and Global Write
Clock controlled, registered address, data and
control
Burst sequence control using MODE input
Three chip enable option for simple depth
expansion and address pipelining
Common data inputs and data outputs
Auto Power-down during deselect
Single cycle deselect
Snooze MODE for reduced-power standby
JEDEC 100-pin QFP, 165-ball BGA and 119-
ball BGA packages
Power supply:
LPS: V
DD
3.3V (± 5%), V
DDQ
3.3V/2.5V (± 5%)
VPS: V
DD
2.5V (± 5%), V
DDQ
2.5V (± 5%)
JTAG Boundary Scan for BGA packages
Industrial and Automotive temperature support
Lead-free available
Error Detection and Error Correction
Write cycles are internally self-timed and are initiated
by the rising edge of the clock input. Write cycles can
be one to four bytes wide as controlled by the write
control inputs.
Separate byte enables allow individual bytes to be
written. The byte write operation is performed by using
the byte write enable (/BWE) input combined with one
or more individual byte write signals (/BWx). In
addition, Global Write (/GW) is available for writing all
bytes at one time, regardless of the byte write controls.
Bursts can be initiated with either /ADSP (Address
Status Processor) or /ADSC (Address Status Cache
Controller) input pins. Subsequent burst addresses can
be generated internally and controlled by the /ADV
(burst address advance) input pin.
The mode pin is used to select the burst sequence
order. Linear burst is achieved when this pin is tied
LOW. Interleave burst is achieved when this pin is tied
HIGH or left floating
DESCRIPTION
The 4Mb product family features high-speed, low-
power synchronous static RAMs designed to provide
burstable, high-performance memory for
communication and networking applications. The
IS61(64)LPS/VPS12836EC
are organized as
131,072
words
by 36bits. The
IS61(64)LPS/VPS12832EC
are organized as
131,072
words by 32bits. The
IS61(64)LPS/VPS25618EC
are
organized as
262,144
words by 18 bits. Fabricated with
ISSI's advanced CMOS technology, the device
integrates a 2-bit burst counter, high-speed SRAM
core, and high-drive capability outputs into a single
monolithic circuit. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single
clock input.
FAST ACCESS TIME
Symbol
t
KQ
t
KC
f
MAX
Parameter
Clock Access Time
Cycle time
Frequency
-250
2.6
4
250
-200
3.1
5
200
Units
ns
ns
MHz
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.- www.issi.com
Rev. C
03/19/2014
1
IS61(4)LPS12836EC/IS61(4)VPS12836EC/IS61(4)LPS12832EC
IS61(4)VPS12832EC/IS61(4)LPS25618EC/IS61(4)VPS25618EC
BLOCK DIAGRAM
Integrated Silicon Solution, Inc.- www.issi.com
Rev. C
03/19/2014
2
IS61(4)LPS12836EC/IS61(4)VPS12836EC/IS61(4)LPS12832EC
IS61(4)VPS12832EC/IS61(4)LPS25618EC/IS61(4)VPS25618EC
PIN CONFIGURATION
128K x 36, 165-Ball BGA (Top View)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
2
3
4
5
6
7
8
9
10
11
NC
NC
DQPc
DQc
DQc
DQc
DQc
NC
DQd
DQd
DQd
DQd
DQPd
NC
MODE
A
A
NC
DQc
DQc
DQc
DQc
V
SS
DQd
DQd
DQd
DQd
NC
NC
NC
/CE
CE2
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
NC
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
A
A
/BWc
/BWd
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
A
A
/BWb
/BWa
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
TDI
TMS
/CE2
CLK
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
A1*
A0*
/BWE
/GW
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
TDO
TCK
/ADSC
/OE
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
A
A
/ADV
/ADSP
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
NC
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
A
A
A
A
NC
DQb
DQb
DQb
DQb
NC
DQa
DQa
DQa
DQa
NC
A
A
NC
NC
DQPb
DQb
DQb
DQb
DQb
ZZ
DQa
DQa
DQa
DQa
DQPa
NC
A
Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired.
PIN DESCRIPTIONS
Symbol
CLK
A0,A1
A
/ADV
/ADSP
/ADSC
MODE
/CE,CE2,/CE2
/BWE
/BWx (x=a-d)
/GW
/OE
DQx
DQPx
TCK,TDI,TDO,TMS
ZZ
NC
VDD
VDDQ
VSS
Pin Name
Synchronous Clock
Synchronous Burst Address Inputs
Synchronous Address Inputs
Synchronous Burst Address Advance
Synchronous Address Status
Processor
Synchronous Address Status
Controller
Burst Sequence Selection
Synchronous Chip Enable
Synchronous Byte Write Enable
Synchronous Byte Write Inputs
Synchronous Global Write Enable
Asynchronous Output Enable
Synchronous Data Inputs/Outputs
Synchronous Parity Data I/O
JTAG Pins
Asynchronous Power Sleep Mode
No Connect
Power Supply
I/O Power Supply
Ground
Bottom View
165-Ball, 13 mm x 15mm BGA
11 x 15 Ball Array
Integrated Silicon Solution, Inc.- www.issi.com
Rev. C
03/19/2014
3
IS61(4)LPS12836EC/IS61(4)VPS12836EC/IS61(4)LPS12832EC
IS61(4)VPS12832EC/IS61(4)LPS25618EC/IS61(4)VPS25618EC
128K x 32, 165-Ball BGA (Top View)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
2
3
4
5
6
7
8
9
10
11
NC
NC
NC
DQc
DQc
DQc
DQc
NC
DQd
DQd
DQd
DQd
NC
NC
MODE
A
A
NC
DQc
DQc
DQc
DQc
V
SS
DQd
DQd
DQd
DQd
NC
NC
NC
/CE
CE2
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
NC
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
A
A
/BWc
/BWd
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
A
A
/BWb
/BWa
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
TDI
TMS
/CE2
CLK
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
A1*
A0*
/BWE
/GW
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
TDO
TCK
/ADSC
/OE
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
A
A
/ADV
/ADSP
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
NC
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
A
A
A
A
NC
DQb
DQb
DQb
DQb
NC
DQa
DQa
DQa
DQa
NC
A
A
NC
NC
NC
DQb
DQb
DQb
DQb
ZZ
DQa
DQa
DQa
DQa
NC
NC
A
Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired.
PIN DESCRIPTIONS
Symbol
CLK
A0,A1
A
/ADV
/ADSP
/ADSC
MODE
/CE,CE2,/CE2
/BWE
/BWx (x=a-d)
/GW
/OE
DQx
TCK,TDI,TDO,TM
S
ZZ
NC
VDD
VDDQ
VSS
Pin Name
Synchronous Clock
Synchronous Burst Address Inputs
Synchronous Address Inputs
Synchronous Burst Address Advance
Synchronous Address Status
Processor
Synchronous Address Status
Controller
Burst Sequence Selection
Synchronous Chip Enable
Synchronous Byte Write Enable
Synchronous Byte Write Inputs
Synchronous Global Write Enable
Asynchronous Output Enable
Synchronous Data Inputs/Outputs
JTAG Pins
Asynchronous Power Sleep Mode
No Connect
Power Supply
I/O Power Supply
Ground
Bottom View
165-Ball, 13 mm x 15mm BGA
11 x 15 Ball Array
Integrated Silicon Solution, Inc.- www.issi.com
Rev. C
03/19/2014
4
IS61(4)LPS12836EC/IS61(4)VPS12836EC/IS61(4)LPS12832EC
IS61(4)VPS12832EC/IS61(4)LPS25618EC/IS61(4)VPS25618EC
256K x 18, 165-Ball BGA (Top View)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
2
3
4
5
6
7
8
9
10
11
NC
NC
NC
NC
NC
NC
NC
NC
DQb
DQb
DQb
DQb
DQPb
NC
MODE
A
A
NC
DQb
DQb
DQb
DQb
V
SS
NC
NC
NC
NC
NC
NC
NC
/CE
CE2
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
NC
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
A
A
/BWb
NC
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
A
A
NC
/BWa
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
TDI
TMS
/CE2
CLK
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
A1*
A0*
/BWE
/GW
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
TDO
TCK
/ADSC
/OE
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
A
A
/ADV
/ADSP
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
NC
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
A
A
A
A
NC
NC
NC
NC
NC
NC
DQa
DQa
DQa
DQa
NC
A
A
A
NC
DQPa
DQa
DQa
DQa
DQa
ZZ
NC
NC
NC
NC
NC
NC
A
Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired.
PIN DESCRIPTIONS
Symbol
CLK
A0,A1
A
/ADV
/ADSP
/ADSC
MODE
/CE,CE2,/CE2
/BWE
/BWx (x=a-b)
/GW
/OE
DQx
DQPx
TCK,TDI,TDO,TMS
ZZ
NC
VDD
VDDQ
VSS
Pin Name
Synchronous Clock
Synchronous Burst Address Inputs
Synchronous Address Inputs
Synchronous Burst Address Advance
Synchronous Address Status
Processor
Synchronous Address Status
Controller
Burst Sequence Selection
Synchronous Chip Enable
Synchronous Byte Write Enable
Synchronous Byte Write Inputs
Synchronous Global Write Enable
Asynchronous Output Enable
Synchronous Data Inputs/Outputs
Synchronous Parity Data I/O
JTAG Pins
Asynchronous Power Sleep Mode
No Connect
Power Supply
I/O Power Supply
Ground
Bottom View
165-Ball, 13 mm x 15mm BGA
11 x 15 Ball Array
Integrated Silicon Solution, Inc.- www.issi.com
Rev. C
03/19/2014
5
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器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
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