ISD1400 SERIES
SINGLE-CHIP
VOICE RECORD/PLAYBACK DEVICES
16- AND 20-SECOND DURATION
-1-
Publication Release Date: November 16, 2005
Revision 1.3
ISD1400 SERIES
TABLE OF CONTENTS
1. GENERAL DESCRIPTION.............................................................................................................................3
2. FEATURES........................................................................................................................................................3
3. BLOCK DIAGRAM..........................................................................................................................................4
4. PIN CONFIGURATION ..................................................................................................................................5
5. PIN DESCRIPTION..........................................................................................................................................6
6. FUNCTIONAL DESCRIPTION....................................................................................................................10
6.1. D
ETAILED
D
ESCRIPTION
..............................................................................................................................10
6.2. O
PERATIONAL
M
ODES
.................................................................................................................................11
6.2.1. Operational Modes Description ..........................................................................................................11
7. TIMING DIAGRAMS ....................................................................................................................................13
8. ABSOLUTE MAXIMUM RATINGS............................................................................................................14
8.1 O
PERATING
C
ONDITIONS
..............................................................................................................................15
9. ELECTRICAL CHARACTERISTICS .........................................................................................................16
9.1. P
ARAMETERS
F
OR
P
ACKAGED
P
ARTS
..........................................................................................................16
9.1.1. Typical Parameter Variation with Voltage and Temperature .............................................................19
9.2. P
ARAMETERS
F
OR
DIE ................................................................................................................................20
9.2.1. Typical Parameter Variation with Voltage and Temperature .............................................................23
10. TYPICAL APPLICATION CIRCUIT ........................................................................................................24
11. PACKAGE DRAWING AND DIMENSIONS............................................................................................27
11.1. 28-L
EAD
300
MIL
P
LASTIC
S
MALL
O
UTLINE
IC (SOIC) ............................................................................27
11.2. 28-L
EAD
600
MIL
P
LASTIC
D
UAL
I
NLINE
P
ACKAGE
(PDIP).......................................................................28
11.3. D
IE
P
HYSICAL
L
AYOUT
[1]
..........................................................................................................................29
12. ORDERING INFORMATION.....................................................................................................................31
13. VERSION HISTORY....................................................................................................................................32
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ISD1400 SERIES
1. GENERAL DESCRIPTION
Winbond’s ISD1400 ChipCorder
®
series provide high-quality, single-chip, Record/Playback solutions
to short-duration messaging applications. The CMOS devices include an on-chip oscillator,
microphone preamplifier, automatic gain control, anti-aliasing filter, smoothing filter, and speaker
amplifier. A minimum Record/Playback subsystem can be configured with a microphone, a speaker,
several passive components, two push buttons and a power source. Recordings are stored into on-
chip non-volatile memory cells, providing zero-power message storage. This unique, single-chip
solution is made possible through Winbond’s patented Multi-Level Storage (MLS) technology. Voice
and audio signals are stored directly into memory in their natural form, providing high-quality, solid-
state voice reproduction.
2. FEATURES
•
•
•
•
•
•
•
Single +5 volt power supply
Duration: 14 and 20 seconds.
Easy-to-use single-chip, voice record/playback solution
High-quality, natural voice/audio reproduction
Manual switch or microcontroller compatible Playback can be edge- or level-activated
Directly cascadable for longer durations
Automatic power-down (push-button mode)
o
Standby current 1 µA (typical)
Eliminates battery backup circuits
Zero-power message storage
o
Fully addressable to handle multiple messages
100-year message retention (typical)
100,000 record cycles (typical)
On-chip oscillator
Programmer support for play-only applications
Packaged types: Leaded and Lead-Free
Available in die, PDIP and SOIC
Temperature:
o
o
Commercial - Packaged unit : 0°C to 70°C, Die : 0°C to 50°C
Industrial - Packaged unit : -40°C to 85°C
•
•
•
•
•
•
•
•
•
-3-
Publication Release Date: November 16, 2005
Revision 1.3
ISD1400 SERIES
3. BLOCK DIAGRAM
Internal Clock
XCLK
Timing
Sampling Clock
ANA IN
Amp
5-Pole Active
Antialiasing Filter
Decoders
Analog Transceivers
128K Cell
Nonvolatile
Multilevel Storage
Array
SP +
Amp
SP -
ANA OUT
MIC
MIC REF
AGC
Pre-
Amp
Automatic
Gain Control
(AGC)
Power Conditioning
5-Pole Active
Smoothing Filter
Address Buffers
Device Control
V
CCA
V
SSA
V
SSD
V
CCD
A0 A1 A2 A3 A4 A5 A6 A7
REC
PLAYE PLAYL RECLED
-4-
ISD1400 SERIES
4. PIN CONFIGURATION
A0
A1
A2
A3
A4
A5
NC
NC
A6
A7
NC
V
SSD
V
SSA
SP +
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CCD
REC
XCLK
RECLED
PLAYE
PLAYL
NC
ANA OUT
ANA IN
AGC
MIC REF
MIC
V
CCA
SP-
SOIC / PDIP
Note:
NC means must be No connect
-5-
Publication Release Date: November 16, 2005
Revision 1.3
模拟与混合信号
