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ISL55005IEZ-T7

1 CHANNEL, VIDEO AMPLIFIER, PDSO6, ROHS COMPLIANT, PLASTIC, EIAJ, MO-203AB, SC-70, 6 PIN

器件类别:模拟混合信号IC    消费电路   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Renesas(瑞萨电子)
零件包装代码
TSSOP
包装说明
TSSOP,
针数
6
Reach Compliance Code
compliant
ECCN代码
EAR99
商用集成电路类型
VIDEO AMPLIFIER
JESD-30 代码
R-PDSO-G6
JESD-609代码
e3
长度
2 mm
湿度敏感等级
2
信道数量
1
功能数量
1
端子数量
6
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
座面最大高度
1.1 mm
表面贴装
YES
技术
BIPOLAR
温度等级
INDUSTRIAL
端子面层
MATTE TIN
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
1.25 mm
文档预览
ISL55005
ESIGNS
OR NEW D
F
S
MMENDED
ENT PART
OT RECO
N
EPLACEM
NDED R
RECOMME
ISL55015
ISL55012,
DATASHEET
FN6199
Rev 0.00
May 22, 2006
MMIC Silicon Bipolar Broadband Amplifier
The ISL55005, ISL55007, ISL55008 and ISL55009,
ISL55010, ISL55011 constitute a family of high performance
gain blocks featuring a Darlington configuration using high f
t
transistors and excellent thermal performance. They are an
ideal choice for DVB-S LNB cable receiver applications.
ISL55005, ISL55007, ISL55008 offer higher OIP3
performance while the ISL55009, ISL55010, ISL55011 offer
lower operating supply currents.
ISL55005 and ISL55009 match a 75 source to a 50 load.
ISL55007 and ISL55010 match a 75 source to a 75 load.
ISL55008 and ISL55011 match a 50 source to a 50 load.
Features
• Input impedance of 75
• Output impedance of 50
• Noise figure of 3.6dB
• OIP3 of 17dBm
• Low input and output return losses
• Pb-free plus anneal available (RoHS compliant)
Applications
• LNB and LNB-T line amplifiers
• IF gain blocks for satellite and terrestrial HDTV STBs
Ordering Information
PART
NUMBER
(Note)
PART
MARKING
TAPE &
REEL
PACKAGE
(Pb-Free)
PKG.
DWG. #
P6.049
• PA driver amplifier
• Wireless data, satellite
• Bluetooth/WiFi
• Satellite locator and signal strength meters
ISL55005IEZ-T7 CSA
7” (3k pcs) 6 Ld SC-70
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
Typical Application Circuit
+3.3V
Pinout
6 LD SC-70
GND
1
2
3
6
5
4
OUT
GND
VSP
0.1µF
100pF
100pF
0.1µF
GND
IN
3
68pF
1, 2, 5
4
6
100nH
68pF
FN6199 Rev 0.00
May 22, 2006
Page 1 of 6
ISL55005
Absolute Maximum Ratings
(T
A
= 25°C)
Supply Voltage from VSP to GND . . . . . . . . . . . . . . . . . . . . . . . . 6V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . V
S
+ +0.3V to GND -0.3V
Power Dissipation . . . . . . . . . . . . See Packging Information Section
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .3000V
Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .300V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are
at the specified temperature and are pulsed tests, therefore: T
J
= T
C
= T
A
Electrical Specifications
PARAMETER
Gt
VSP = +3.3V, Zrsc = Zload = 50, TA = 25°C, unless otherwise specified.
CONDITIONS
1.0GHz
1.5GHz
2.0GHz
MIN
16.2
16.0
15.6
5.5
4.9
TYP
17.2
17.0
16.6
7.5
6.4
18.0
17.3
3.0
14.5
17.6
21.8
3.6
17.5
20.6
23.5
MAX
18.2
18.0
17.6
9.5
7.9
UNIT
dB
dB
dB
dBm
dBm
dBm
dBm
GHz
dB
dB
dB
dB
mA
DESCRIPTION
Small Signal Gain
P1dB
Output Power at 1dB Compression
1.0GHz
2.0GHz
OIP3
Output Third Order Intercept Point
1.0GHz
2.0GHz
BW
IRL
ORL
RISOL
NF
ID
3dB Bandwidth
Input Return Loss
Output Return Loss
Reverse Isolation
Noise Figure
Device Operating Current
3dB below Gain @ 500MHz
1.0GHz Zrsc = 75Zload = 50
1.0GHz Zrsc = 75Zload = 50
2.0GHz
2.0GHz
Device Test Setup
Agilent _8753ES
VNA
50
CONNECTORLESS
PLATFORM
50
PIN 3
DUT
PIN 6
50
50
PICOSECOND LABS
MODEL 5542
DC BLOCK
BIAS TEE
PICOSECOND LABS
MODEL 5508-110
3.3V
I
1
I
2
I
DEVICE
INPUT
REFERENCE
PLANE
OUTPUT
REFERENCE
PLANE
3.3V
POWER
SUPPLY
FN6199 Rev 0.00
May 22, 2006
Page 2 of 6
ISL55005
Typical Performance Curves
Z
src
= 75, Z
load
= 50
20
16
12
8
4
0
0.5
ORL (dB)
1.0
1.5
2.0
Frequency (GHz)
2.5
3.0
IRL (dB)
20
16
12
8
4
0
0.5
1.0
1.5
2.0
Frequency (GHz)
2.5
3.0
FIGURE 1. INPUT RETURN LOSS vs FREQUENCY
FIGURE 2. OUTPUT RETURN LOSS vs FREQUENCY
Typical Performance Curves
50 environment
18.0
17.2
16.4
-8.0
-8.6
-9.2
S
21
(dB)
15.6
14.8
14.0
0.5
S
11
(dB)
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
-9.8
-10.4
-11.0
0.5
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
FIGURE 3. |S21| vs FREQUENCY
FIGURE 4. |S11| vs FREQUENCY
-21.0
-21.4
-21.8
-9.0
-9.8
-10.6
S
12
(dB)
-22.2
-22.6
-23.0
0.5
S
22
(dB)
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
-11.4
-12.2
-13.0
0.5
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
FIGURE 5. |S12| vs FREQUENCY
FIGURE 6. |S22| vs FREQUENCY
FN6199 Rev 0.00
May 22, 2006
Page 3 of 6
ISL55005
Typical Performance Curves
50 environment
(Continued)
21
20
19
18
17
16
0.5
8.0
1dBm Output Compression Point
(dBm)
7.6
7.2
6.8
6.4
6.0
0.5
OIP
3
(dBm)
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
FIGURE 7. OIP3 vs FREQUENCY
FIGURE 8. P1dB vs FREQUENCY
5
4
Noise Figure (dB)
3
2
1
0
0.5
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
FIGURE 9. NOISE FIGURE vs FREQUENCY
0.9
1.0
0.8
1.2
0.7
1.4
0.6
1.6
0.2
1.8
0.4
2.0
0.2
0.1
3 GHz
2.2
0.2
0.5 GHz
0.4
0.5 GHz
1.0
20
0.3
4
0.
0.4
0.6
0.7
0.8
0.9
RF Café 2002
FIGURE 10. S11 AND S22 vs FREQUENCY
FN6199 Rev 0.00
May 22, 2006
1.0
1.2
1.4
1.6
1.8
2.0
5
0.
0.2
4.0
3.
0
1.0
3 GHz
0.8
0.6
5.0
0
1.
6.0
8
0.
2.2
S
11
7.0
1.0
0.6
50
S
22
0.8
0.9
0.1
0.3
0.4
0.5
0.6
0.7
1.0
1.2
1.4
1.6
1.8
2.0
3.0
4.0
0.2
5.0
10
20
8.0
9.0
10
50
0
1.
0
0.
8
0.6
0.4
0.2
0.
5
0.
4
0.6
0
3.
0.3
0.8
1.0
4.0
5.0
0.2
0.1
6.0
7.0
8.0
9.0
10
20
50
Page 4 of 6
ISL55005
Packaging Information
0.3
POWER DISSIPATION (W)
0.25
0.2
0.15
0.1
0.05
0
176mW
JA
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
SC
7
= 5 0- 6
67
°C
/W
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FN6199 Rev 0.00
May 22, 2006
Page 5 of 6
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