2.0 mm x 1.6 mm Ceramic Package SMD Oscillator, CMOS
Product Features:
Very Low Current Consumption
CMOS Logic Levels
Compatible with Leadfree Processing
Small Footprint Package
AT Cut Temperature Stability Characteristics
Applications:
Real Time Clocks
Metering
Industrial Control
Time Reference
System Clock
ISM36
Series
Frequency
Output Level
CMOS
Duty Cycle
Rise / Fall Time
32.768 kHz
‘0’ = 0.1 V
cc
Max., ‘1’ = 0.9 V
cc
Min.
50% ±5%
50 nSec Max. 1.8V (20% to 80% V
cc
Levels)
40 nSec Max. 2.5V (20% to 80% V
cc
Levels)
30 nSec Max. 3.3V (20% to 80% V
cc
Levels)
15pF Max
See Part Number Guide Below
Output Load
Frequency Tolerance
(at +25°C)
Frequency Stability
Enable / Disable Time
Start Up Time
See Part Number Guide Below
200 nSec Max
7.0 mSec Max. (Vcc = 3.3V)
10.0 mSec Max. (Vcc = 1.8V)
See Input Voltage Table, tolerance ±10%
40 µA Max. (F=32.768kHz, V
cc
= 3.3V, 15 pF load)
3 µA Max
Output Enable (High) = 0.7 V
cc
Min,
Output Disable (Low/High Impedance) = 0.3 V
cc
Max.
See Operating Temperature Table in Part Number Guide
-40
°
C to +105
°
C Standard
Supply Voltage
Current Operating
Current Standby
Stand-by Function
Operating
Storage
Part Number Guide
Package
Input
Voltage
3 = 3.3 V
6 = 2.5 V
1 = 1.8 V
Sample Part Number:
Frequency Tolerance 25°C
(in ppm)
E =
10
D =
15
F =
20
Z =
30
B =
50
ISM36 -32ZBH – 32.768 kHz
Stability
(in ppm)
E =
10*
D =
15
F =
20
Z =
30
B =
50
- 32.768 kHz
Operating
Temperature
1 = 0 C to +70 C
3 = -20 C to +70 C
5 = -30 C to +85 C
2 = -40 C to +85 C
Enable /
Disable
H = Stand-by
Frequency
I
SM36 -
NOTE: A 0.01 µF bypass capacitor is recommended between Vdd (pin 4) and GND (pin 2) to minimize power supply noise. * Not available at all
operating temperature options.
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 01/30/17_B
Page 1 of 2
2.0 mm x 1.6 mm Ceramic Package SMD Oscillator, CMOS
Pb Free Solder Reflow Profile
Typical Application:
ISM36
Series
Vcc
Rs
C1
.01uF
4
Oscillator
1
Enable /
Disable
Units are backward compatible with 240C reflow processes
Output
3
2
Rs is optional
Rs can be used to
reduce EMI.
Package Information:
MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metallization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
8.0+/-.3
4.0 +/-.2
3.5 +/-.2
16.5 +/-2
50 / 60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1:
I-Date
Code (YWW
Line 2: Frequency
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 01/30/17_B
Page 2 of 2
微控制器 MCU
