2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS
ISM97 Series
Product Features:
Low Jitter, Non-PLL Based Output
CMOS/TTL Compatible Logic Levels
Compatible with Leadfree Processing
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
Frequency
Output Level
HC-MOS
TTL
Duty Cycle
Rise / Fall Time
Output Load
Frequency Stability
Start-up Time
Enable / Disable
Time
Supply Voltage
Current
1.000 MHz to 152.250 MHz
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
Specify 50% ±10% or ±5% See Table in Part Number Guide
6 nS Max.
See Table in Part Number Guide
See Frequency Stability Table (Includes room temperature tolerance and
stability over operating temperature)
10 mS Max.
100 nS Max. N.C. or
≥
70% Vdd = Enable.
≤
30% Vdd = Disable.
See Input Voltage Table, tolerance ±5 %
25 mA Max. (5.0V)
20 mA Max. (1.8V-3.3V)
2.0
1.3
Recommended Pad layout
2.6
Operating
Storage
Jitter:
RMS(1sigma)
1 MHz-60 MHz
Max Integrated
1 MHz-60 MHz
Max Total Jitter
1 MHz-60 MHz
See Operating Temperature Table in Part Number Guide
-55
C to +125
C
1.4
5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods)
1.5 pS RMS (1 sigma -12KHz to 20MHz)
50 pS p-p (100K adjacent periods)
Pin Connection
1
Enable
2
GND
3
Output
4
Vcc
Dimension Units: mm
Part Number Guide
Package
Input
Voltage
5 = 5.0 V
3 = 3.3 V
7 = 3.0 V
2 = 2.7 V
6 = 2.5 V
1 = 1.8 V*
Sample Part Number:
Symmetry
(Duty Cycle)
5 = 45 / 55 Max.
6 = 40 / 60 Max.
ISM97
- 3251BH - 20.000
Stability
(in ppm)
**E =
10
**D =
15
**F =
20
**A =
25
B =
50
C =
100
Operating
Temperature
1 = 0 C to +70 C
6 = -10 C to +70 C
3 = -20 C to +70 C
4 = -30 C to +75 C
2 = -40 C to +85 C
Output
1 = 10TTL / 15 pF HC-MOS
6 = 30 pF
5 = 50 pF HC-MOS (<40 MHz)
Enable /
Disable
H = Enable
O = N/C
Frequency
I
SM97 -
- 20.000 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
6/05/12
_B
Specifications subject to change without notice
Page 1
2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS
Pb Free Solder Reflow Profile:
ISM97 Series
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (YWW)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
6/05/12
_B
Specifications subject to change without notice
Page 2
FPGA/CPLD
