The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 18 January 2007.
INCH-POUND
MIL-PRF-19500/533H
18 October 2006
SUPERSEDING
MIL-PRF-19500/533G
21 July 2005
*
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR,
TYPES 1N6309 THROUGH 1N6355; 1N6309US THROUGH 1N6355US,
PLUS C AND D TOLERANCE SUFFIX,
JAN, JANTX, JANTXV, AND JANS
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for microminiature 500 mW, silicon,
metallurgically bonded, voltage regulator diodes with voltage tolerances of 5 percent, 2 percent (C), and 1 percent
(D). Four levels of product assurance are provided for each encapsulated device type as specified in
MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (DO-35) and figure 2 (surface mount).
* 1.3 Maximum ratings. Maximum ratings are as shown in maximum and primary test ratings (see 3.11 herein) and
as follows:
a.
P
TL
= 500 mW (DO-35) at T
L
= + 75°C, L = .375 inch (9.53 mm); both ends of case or diode body to
heat sink at L = .375 inch (9.53 mm). (Derate I
Z
to 0.0 mA dc at +175°C).
P
TEC
= 500 mW (surface mount) at T
EC
= 125°C. (Derate to 0 at 175°C).
P
TPCB
= 500 mW, T
A
= +55°C.
-65°C
≤
T
J
≤
+175°C; -65°C
≤
T
STG
≤
+175°C.
b.
c.
d.
Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columbus,
ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dscc.dla.mil.
Since contact information can change, you may want to verify the currency of this address information using the
ASSIST Online database at
http://assist.daps.dla.mil.
AMSC N/A
FSC 5961
MIL-PRF-19500/533H
* 1.4 Primary electrical characteristics. Primary electrical characteristic are shown in maximum and primary test
ratings (see 3.11 herein) and as follows:
a.
b.
c.
d.
e.
2.4 V dc
≤
V
Z
≤
200 V dc (nominal).
1N6309D through 1N6355D, and US devices are 1 percent voltage tolerance.
1N6309C through 1N6355C, and US devices are 2 percent voltage tolerance.
1N6309 through 1N6355, and US devices are 5 percent voltage tolerance.
L = .375 inch (9.53 mm) (DO-35) non-surface mount.
(1) 1N6309 – 1N6320, R
θ
JL
= 150°C/W (maximum).
(2) 1N6321 – 1N6355, R
θ
JL
= 95.5°C/W (maximum).
f.
g.
R
θ
JL
= 50°C/W (maximum) at L = 0 inch non-surface mount.
Surface mount (US).
(1) 1N6309US – 1N6320US, R
θ
JEC
= 35°C/W (maximum).
(2) 1N6321US – 1N6355US, R
θ
JEC
= 21°C/W (maximum).
H.
R
θ
JA
= 240°C/W junction to ambient including PCB see note (1).
(1) See figures 3, 4, 5, 6, and 7 for derating curves. T
A
= +75°C for both axial and MELF (US) on printed circuit
board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, still air, pads (US) = .067 inch (1.70
mm) x .105 inch (2.67 mm); pads (axial) = .092 inch (2.34 mm) diameter, strip = .030 inch (7.62 mm) x 1 inch
(25.4 mm) long, axial lead length L
≤
.187 inch (≤ 4.76 mm); R
θJA
with a defined thermal resistance condition
included is measured at IZ = as defined in the characteristics and ratings table herein.
2
MIL-PRF-19500/533H
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
-
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
-
Test Methods for Semiconductor Devices.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil.
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500 and as follows.
C
D
EC
T
EC
US
................................ 2 percent voltage tolerance.
................................ 1 percent voltage tolerance.
................................ End-cap.
................................ Temperature of end-cap.
................................ Unleaded square end-cap.
3
MIL-PRF-19500/533H
Ltr
Inches
Min
BD
BL
LD
LL
LL
1
.060
.120
.018
1.000
Dimensions
Millimeters
Min
1.52
3.05
0.46
25.40
Max
2.29
5.08
0.56
38.10
1.27
Notes
Max
.090
.200
.022
1.500
.050
5
3
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. Lead diameter not controlled in this zone to allow for flash. Lead finish build-up and minor
irregularities other than slugs.
4. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
5. The BL dimension shall include the entire body including slugs.
* FIGURE 1. Physical dimensions (DO-35).
4
MIL-PRF-19500/533H
Symbol
Inches
Min
BD
ECT
BL
S
.070
.019
.165
Dimensions
Millimeters
Min
1.78
0.48
4.19
Max
2.16
0.71
4.95
Max
.085
.028
.195
.003 min
0.08 min
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
* FIGURE 2. Physical dimensions surface mount device, “US”.
5