型号
- 型号
- 关键词
NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDFP14, CERAMIC, FP-14
厂商名称：Motorola ( NXP )
厂商官网：https://www.nxp.com
下载文档| 型号 | JM38510/33003BDA | JM38510/33003BCA | JM38510/33003B2A |
|---|---|---|---|
| 描述 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDFP14, CERAMIC, FP-14 | F/FAST SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERDIP-14 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CQCC20, CERAMIC, LCC-20 |
| 厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| 包装说明 | CERAMIC, FP-14 | DIP, | CERAMIC, LCC-20 |
| Reach Compliance Code | unknown | unknown | unknown |
| 系列 | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | R-GDFP-F14 | R-GDIP-T14 | S-CQCC-N20 |
| 长度 | 9.65 mm | 19.495 mm | 8.885 mm |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 |
| 端子数量 | 14 | 14 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | CHIP CARRIER |
| 传播延迟（tpd） | 6.5 ns | 6.5 ns | 6.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.15 mm | 5.08 mm | 1.9 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES |
| 技术 | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD |
| 宽度 | 6.415 mm | 7.62 mm | 8.885 mm |
| Base Number Matches | 1 | 1 | 1 |
| Is Samacsys | N | - | N |
