Intel
®
Pentium
®
4 Processors
570/571, 560/561, 550/551,
∆
540/541, 530/531 and 520/521
Supporting Hyper-Threading
Technology
1
Datasheet
On 90 nm Process in 775-land LGA Package and
supporting Intel
®
Extended Memory 64 Technology
Φ
May 2005
Document Number: 302351-004
Contents
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ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
Pentium
®
4 processor in the 775-land package on 90 nm process may contain design defects or errors known as errata which may cause
the product to deviate from published specifications. Current characterized errata are available on request.
∆
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across
different processor families.
1
Hyper-Threading Technology requires a computer system with an Intel
®
Pentium
®
4 processor supporting Hyper-Threading Technology and an HT
Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See
http:/
/www.intel.com/info/hyperthreading/
for more information including details on which processors support HT Technology.
Φ
Intel
®
Extended Memory 64 Technology (Intel
®
EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device
drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS.
Performance will vary depending on your hardware and software configurations. See
http://www.intel.com/info/em64t
for more information including
details on which processors support EM64T or consult with your system vendor for more information.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.
Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, Itanium, Intel Xeon, Intel NetBurst and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in
the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2004–2005 Intel Corporation.
2
Datasheet
Contents
Contents
1
Introduction.................................................................................................................................... 11
1.1
1.2
2
2.1
2.2
2.3
Terminology ........................................................................................................................ 12
1.1.1 Processor Packaging Terminology ........................................................................ 12
References ......................................................................................................................... 13
FSB and GTLREF............................................................................................................... 15
Power and Ground Lands................................................................................................... 15
Decoupling Guidelines........................................................................................................ 15
2.3.1 VCC Decoupling .................................................................................................... 16
2.3.2 FSB GTL+ Decoupling........................................................................................... 16
2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 16
Voltage Identification .......................................................................................................... 17
2.4.1 Phase Lock Loop (PLL) Power and Filter .............................................................. 19
Reserved, Unused, FC and TESTHI Signals...................................................................... 20
FSB Signal Groups ............................................................................................................. 21
GTL+ Asynchronous Signals ..............................................................................................22
Test Access Port (TAP) Connection ................................................................................... 23
FSB Frequency Select Signals (BSEL[2:0]) ....................................................................... 23
Absolute Maximum and Minimum Ratings ......................................................................... 24
Processor DC Specifications ..............................................................................................24
VCC Overshoot Specification ............................................................................................. 33
2.12.1 Die Voltage Validation ........................................................................................... 33
GTL+ FSB Specifications....................................................................................................34
Package Mechanical Drawing ............................................................................................ 35
Processor Component Keep-Out Zones............................................................................. 39
Package Loading Specifications......................................................................................... 39
Package Handling Guidelines............................................................................................. 39
Package Insertion Specifications........................................................................................ 40
Processor Mass Specification............................................................................................. 40
Processor Materials ............................................................................................................ 40
Processor Markings ............................................................................................................ 40
Processor Land Coordinates ..............................................................................................41
Processor Land Assignments ............................................................................................. 43
Alphabetical Signals Reference .......................................................................................... 66
Processor Thermal Specifications ...................................................................................... 75
5.1.1 Thermal Specifications .......................................................................................... 75
5.1.2 Thermal Metrology ................................................................................................. 79
Processor Thermal Features ..............................................................................................79
5.2.1 Thermal Monitor..................................................................................................... 79
5.2.2 Thermal Monitor 2.................................................................................................. 80
Electrical Specifications ................................................................................................................. 15
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4
4.1
4.2
5
5.1
Package Mechanical Specifications ..............................................................................................35
Land Listing and Signal Descriptions ............................................................................................ 43
Thermal Specifications and Design Considerations ...................................................................... 75
5.2
Datasheet
3
Contents
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
6
6.1
6.2
On-Demand Mode ................................................................................................. 81
PROCHOT# Signal................................................................................................ 82
THERMTRIP# Signal............................................................................................. 82
T
CONTROL
and Fan Speed Reduction.................................................................... 82
Thermal Diode ....................................................................................................... 83
Features ........................................................................................................................................ 85
Power-On Configuration Options........................................................................................ 85
Clock Control and Low Power States ................................................................................. 85
6.2.1 Normal State.......................................................................................................... 86
6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 86
6.2.3 Stop-Grant State.................................................................................................... 87
6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State ...................... 88
Mechanical Specifications .................................................................................................. 90
7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 90
7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 91
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly............................................................................................. 91
Electrical Requirements...................................................................................................... 91
7.2.1 Fan Heatsink Power Supply .................................................................................. 91
Thermal Specifications ....................................................................................................... 93
7.3.1 Boxed Processor Cooling Requirements............................................................... 93
7.3.2 Variable Speed Fan ............................................................................................... 95
7
Boxed Processor Specifications .................................................................................................... 89
7.1
7.2
7.3
4
Datasheet
Contents
Figures
2-1
2-2
2-3
2-4
3-1
3-2
3-3
3-4
3-5
3-6
3-7
4-1
4-2
5-1
5-2
5-3
5-4
6-1
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
7-9
Phase Lock Loop (PLL) Filter Requirements.............................................................................. 19
VCC Static and Transient Tolerance for 775_VR_CONFIG_04A............................................... 28
VCC Static and Transient Tolerance for 775_VR_CONFIG_04B............................................... 30
VCC Overshoot Example Waveform .......................................................................................... 33
Processor Package Assembly Sketch ........................................................................................ 35
Processor Package Drawing 1 ................................................................................................... 36
Processor Package Drawing 2 ................................................................................................... 37
Processor Package Drawing 3 ................................................................................................... 38
Processor Top-Side Marking Example ....................................................................................... 40
Processor Top-Side Marking Example for Processors Supporting Intel
®
EM64T ...................... 41
Processor Land Coordinates (Top View).................................................................................... 42
Landout Diagram (Top View – Left Side).................................................................................... 44
Landout Diagram (Top View – Right Side) ................................................................................. 45
Thermal Profile for Processors with PRB = 1 ............................................................................. 77
Thermal Profile for Processors with PRB = 0 ............................................................................. 78
Case Temperature (TC) Measurement Location ........................................................................ 79
Thermal Monitor 2 Frequency and Voltage Ordering .................................................................81
Processor Low Power State Machine......................................................................................... 87
Mechanical Representation of the Boxed Processor.................................................................. 89
Space Requirements for the Boxed Processor (Side View) ....................................................... 90
Space Requirements for the Boxed Processor (Top View) ........................................................ 90
Space Requirements for the Boxed Processor (Overall View) ................................................... 91
Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92
Baseboard Power Header Placement Relative to Processor Socket ......................................... 93
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) ........................... 94
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) .......................... 94
Boxed Processor Fan Heatsink Set Points................................................................................. 95
Datasheet
5
