CMOS / 3.3V / 7.0×5.0A
Clock Crystal Oscillators
Surface Mount Type
K50H-3C
Series
Features
• Miniature ceramic package
• Highly reliable with seam welding
• CMOS output
• Supply voltage V
DD
=3.3V
• Internal Bypass Capacitor
• Low Jitter
•
±25ppm
available
How to Order
K50H-3C 0 - S E 125.000
q
w er
t
qType(7×5
SMD, 3.3V)
wFrequency
Stability Code(See Table1)
eDuty
Ratio(S: 45% to 55% STD)
rEnable/Disable
Function(STD)
tOscillation
Frequency(Ex.: 125.000MHz)
Packaging(Tape & Reel 1,000pcs/reel)
Table 1
Stability
T
OPR
(°C)
Code (ppm)
0
±
50
S
±
30
−10
to
+70
(Standard)
U
±
25
F
±100 −40
to
+85
(Extend)
G
±
50
Note
Standard specifications
With only certain
frequencies
With only certain
frequencies
Pb Free
RoHS Conforming
Specifications
Item
Output Frequency Range
Frequency Stability
Storage Temperature Range
Operating Temperature Range
Max. Supply Voltage
Supply Voltage
Current Consumption
(Maximum Loaded)
Duty Ratio(Symmetry)
Duty Ratio(Symmetry)
Rise/Fall Time
(10% V
DD
to 90% V
DD
Maximum Loaded)
Output Voltage-"L"
Output Voltage-"H"
Output Load
Input Voltage Range
Input Voltage-"L"
Input Voltage-"H"
Output Disable Time
Output Enable Time
Start-up Time
Deterministic Jitter pk-pk
1Sigma jitter
Symbol
F
OUT
F
SBY
T
STG
T
OPR
-----
V
DD
Stability:
±50ppm, ±100ppm
(Ext Temp)
Stability:
±25ppm, ±30ppm, ±50ppm
(Ext Temp)
Conditions
Overall conditions:
initial tolerance, operating temperature range, rated
power supply voltage change, load change, aging(1year
@25°C), shock and vibration
Standard
Extend(option)
I
DD
I
ST
SYM
Tr/Tf
50≤F
OUT
≤
85MHz
85<F
OUT
≤100MHz
100<F
OUT
≤135MHz
135<F
OUT
≤160MHz
Standby Function
@50% V
DD
50≤F
OUT
<100MHz
100≤F
OUT
≤160MHz
20% V
DD
to 80% V
DD
10% V
DD
to 90% V
DD
20% V
DD
to 80% V
DD
10% V
DD
to 90% V
DD
V
OL
V
OH
CL
V
IN
V
IL
V
IH
-----
-----
ST
DJ
1sigma
CMOS
@Minimum operating Voltage to be 0sec.
Measured with "Wavecrest DTS-2079",
VISI 6.3.1
Min.
50
−25
−30
−50
−55
−10
−40
−0.5
2.97
3.14
-----
-----
-----
-----
-----
45
-----
-----
-----
-----
-----
90% V
DD
-----
0
-----
70% V
DD
-----
-----
-----
-----
-----
Max.
170
+25
+30
+50
+125
+70
+85
7.0
3.63
3.46
30
40
50
60
10
55
3.5
5.0
1.5
2.0
10% V
DD
-----
15
V
DD
30% V
DD
-----
5
150
10
2
4
Units
MHz
ppm
°C
Volt
mA
µA
%
nS
Volt
pF
Volt
Volt
mS
nS
mS
psec
Note: Please contact us for inquires about extended operating temperature range, available frequencies and other conditions.
All electrical characteristics are defined at the maximum load and operating temperature range.
Dimensions
7.0
1.4
0.6
(Unit : mm)
Recommended Land Pattern
5.08
2.0
(Unit : mm)
e
5.0
1.1
r
2.6
w
q
1.8
0.7
5.08
1.6
Pin Connections
q
Control
w
Case GND
e
Output
r
V
DD
Enable/Disable Function
Pin1
Pin3(Output)
Open
Active
"H" Level
Active
"L" Level High Z(No-Oscillation)
Note: K50H Series has Bypass Capacitor of 0.01µF
between V
DD
and GND.
4.2
Plating: Ni+Au
Tolerance:
±0.2
CMOS / 3.3V / 7.0×5.0A
Clock Crystal Oscillators
Surface Mount Type
K50-3C
Series
Features
• Miniature ceramic package
• Highly reliable with seam welding
• CMOS output
• Supply voltage V
DD
=3.3V
•
±25ppm
available
How to Order
K50-3C 0 - S E 25.0000
q
w er
t
qType(7×5
SMD, 3.3V)
wFrequency
Stability Code(See Table1)
eDuty
Ratio(S: 45% to 55% STD)
rEnable/Disable
Function(STD)
tOscillation
Frequency(Ex.: 25.0000MHz)
Packaging(Tape & Reel 1Kpcs/reel)
Table 1
Stability
T
OPR
(°C)
Code (ppm)
0
±
50
S
±
30
−10
to
+70
(Standard)
U
±
25
F
±100 −40
to
+85
(Extend)
G
±
50
Note
Standard specifications
With only certain
frequencies
With only certain
frequencies
Pb Free
RoHS Conforming
Specifications
Item
Output Frequency Range
Frequency Stability
Storage Temperature Range
Operating Temperature Range
Max. Supply Voltage
Supply Voltage
Current Consumption
(Maximum Loaded)
Symbol
F
OUT
F
SBY
T
STG
T
OPR
---
--
V
DD
Stability:
±50ppm, ±30ppm, ±100ppm(Ext
Temp)
Stability:
±25ppm, ±50ppm(Ext
Temp)
1.5≤F
OUT
≤20MHz
20<F
OUT
≤40MHz
40<F
OUT
≤60MHz
60<F
OUT
≤80MHz
8≤F
OUT
≤32MHz(Standby
Function)
32<F
OUT
≤50MHz(Disable
Function)
50<F
OUT
≤80MHz(Standby
Function)
@50% V
DD
8≤F
OUT
≤26MHz
26<F
OUT
≤45MHz
45<F
OUT
≤80MHz
I
OL
=8mA
I
OH
=−8mA
CMOS
Overall conditions:
initial tolerance, operating temperature range, rated power
supply voltage change, load change, aging(1year @25°C),
shock and vibration
Conditions
Min.
1.5
−25
−30
−50
−55
−10
−40
−0.5
2.97
3.14
---
--
---
--
---
--
---
--
---
--
---
--
---
--
45
---
--
---
--
---
--
---
--
90% V
DD
---
--
Max.
80
+25
+30
+50
+125
+70
+85
7.0
3.63
3.46
10
15
20
30
10
15
10
55
10
8
5
10% V
DD
---
--
15
Units
MHz
ppm
Standard
Extend(option)
°C
Volt
I
DD
mA
µA
mA
µA
%
nS
Standby/Disable Current
Duty Ratio(Symmetry)
Rise/Fall Time
(10% V
DD
to 90% V
DD
Maximum Loaded)
Output Voltage-"L"
Output Voltage-"H"
Output Load
Input Voltage Range
Input Voltage-"L"
Input Voltage-"H"
Output Disable Time
Output Enable Time
Start-up Time
I
ST
/I
DE
SYM
Tr/Tf
V
OL
V
OH
CL
Volt
pF
V
IN
V
IL
V
IH
---
--
---
--
ST
8≤F
OUT
≤32MHz
32<F
OUT
≤50MHz
50<F
OUT
≤80MHz
0
---
--
70% V
DD
---
--
---
--
---
--
---
--
---
--
V
DD
30% V
DD
---
--
150
5
150
5
10
Volt
Volt
nS
mS
nS
mS
mS
@Minimum operating Voltage to be 0sec.
Note: Please contact us for inquires about extended operating temperature range, available frequencies and other conditions.
All electrical characteristics are defined at the maximum load and operating temperature range.
Dimensions
7.0
1.4
R0.35
(Unit : mm)
Recommended Land Pattern
5.08
2.0
(Unit : mm)
e
5.0
1.1
r
2.6
Plating: Ni+Au
Tolerance:
±0.2
4.2
Enable/Disable Function
Pin1
Pin3(Output)
Open
Active
"H" Level
Active
"L" Level
High Z
∗
∗
No-Oscillation:
8≤F
OUT
≤32MHz,
50<F
OUT
≤80MHz
w
q
Pin Connections
q
Control
w
Case GND
e
Output
r
V
DD
0.6
5.08
1.6
1.8
Note: A capacitor of value 0.01µF between V
DD
and GND is recommended.
CMOS / 5.0V / 7.0×5.0A
Clock Crystal Oscillators
Surface Mount Type
K50-HC
Series
Features
• Miniature ceramic package
• Highly reliable with seam welding
• CMOS output
• Supply voltage V
DD
=5.0V
•
±25ppm
available
How to Order
K50-HC 0 - C S E 25.0000
q
w ert
y
qType(7×5
SMD, 5.0V)
wFrequency
Stability Code(See Table1)
eCMOS
Output
rDuty
Ratio(S: 45% to 55% STD)
tEnable/Disable
Function(STD)
yOscillation
Frequency(Ex.: 25.0000MHz)
Packaging(Tape & Reel 1Kpcs/reel)
Table 1
Stability
T
OPR
(°C)
Code (ppm)
0
±
50
S
±
30
−10
to
+70
(Standard)
U
±
25
F
±100 −40
to
+85
G
±
50 (Extend)
Note
Standard specifications
With only certain
frequencies
With only certain
frequencies
Pb Free
RoHS Conforming
Specifications
Item
Output Frequency Range
Frequency Stability
Storage Temperature Range
Operating Temperature Range
Max. Supply Voltage
Supply Voltage
Current Consumption
(Maximum Loaded)
Disable Current
Duty Ratio(Symmetry)
Rise/Fall Time
(10% V
DD
to 90% V
DD
Maximum Loaded)
Output Voltage-"L"
Output Voltage-"H"
Output Load(CMOS)
Input Voltage Range
Input Voltage-"L"
Input Voltage-"H"
Output Disable Time
Output Enable Time
Start-up Time
Symbol
F
OUT
F
SBY
T
STG
T
OPR
-----
V
DD
Stability:
±50ppm, ±30ppm, ±100ppm(Ext
Temp)
Stability:
±25ppm, ±50ppm(Ext
Temp)
1.5≤F
OUT
≤20MHz
20<F
OUT
≤40MHz
40<F
OUT
≤68MHz
@68.0000MHz
@50% V
DD
8≤F
OUT
≤26MHz
26<F
OUT
≤45MHz
45<F
OUT
≤68MHz
I
OL
=16mA
I
OH
=−16mA
8≤F
OUT
≤50MHz
50<F
OUT
≤68MHz
Standard
Extend(option)
Conditions
Overall conditions:
initial tolerance, operating temperature range, rated power
supply voltage change, load change, aging(1year @25°C),
shock and vibration
I
DD
I
DE
SYM
Tr/Tf
V
OL
V
OH
CL
V
IN
V
IL
V
IH
-----
-----
ST
@Minimum operating Voltage to be 0sec.
Min.
1.5
−25
−30
−50
−55
−10
−40
−0.5
4.5
4.75
-----
-----
-----
-----
45
-----
-----
-----
-----
90% V
DD
-----
-----
0
-----
2.2
-----
-----
-----
Max.
68
+25
+30
+50
+125
+70
+85
7.0
5.5
5.25
25
35
50
30
55
10
8
5
10% V
DD
-----
50
15
V
DD
0.8
-----
100
100
10
Units
MHz
ppm
°C
Volt
mA
mA
%
nS
Volt
pF
Volt
Volt
nS
nS
mS
Note: Please contact us for inquires about extended operating temperature range, available frequencies and other conditions.
All electrical characteristics are defined at the maximum load and operating temperature range.
Dimensions
7.0
1.4
R0.35
(Unit : mm)
Recommended Land Pattern
5.08
2.0
(Unit : mm)
e
5.0
1.1
r
2.6
Plating: Ni+Au
Tolerance:
±0.2
4.2
Enable/Disable Function
Pin1
Pin3(Output)
Open
Active
"H" Level
Active
"L" Level
High Z
w
q
0.6
5.08
1.6
Pin Connections
q
Control
w
Case GND
e
Output
r
V
DD
1.8
Note: A capacitor of value 0.01µF between V
DD
and GND is recommended.
Handling Notes for Crystal Oscillators
1. Shock & Drop • Vibration
Do not inflict excessive shock and mechanical vibration that
exceeds the norm, such as hitting or mistakenly dropping, when
transporting and mounting on a board. There are cases when
pieces of crystal break, and pieces that are used become
damaged, and become inoperable. When a shock or vibration that
exceeds the norm has been inflicted, make sure to check the
characteristics.
2. Cleaning
Since a crystal piece can be broken by resonance when a crystal
device is cleaned by ultrasonic cleaning. Be careful when carrying
out ultrasonic cleaning.
3. Soldering conditions
To maintain the product reliability, please follow recommended conditions.
Standard soldering iron conditions
Crystal Oscillators
Soldering iron
Time
280˚C ~ 340˚C
3+1/−0sec. max
Reflow conditions (Example)
+0
Peak:260
-10
˚C
10sec. max
Temperature(˚C)
+0
180
-10
˚C
200˚C min
40sec. max
120sec. max
Time(sec.)
Crystal Oscillators/TCXOs
Recommended reflow Conditions vary depending upon products.
Please check with the respective specification for details.
4. Mounting Precautions
Leaded Devices
The special glass, located where the lead of the retainer base comes out, is aligned with the coefficient of thermal expansion of the lead, If the
glass is damaged and cracks appear, there may be cases in which performance deteriorates and it fails to operate.
Consequently, when making the device adhere closely and applying solder, align the gap of the hole of the board with the gap of the lead and
insert without excessive force.
When making the device adhere closely to a through hole board and applying solder, be careful that the solder does not get into the metal part
of the retainer base and cause a short. Putting in an insulation spacer is one more method of preventing a short circuit.
When the lead is mounted floating, fix it as far as possible so that contact with other parts and the breakage due to the fatigue, and the
mechanical resonance of the lead will not occur.
When the lead is bent and used, do not bend the lead directly from the base, separate it 0.5mm or more and then bend it. When bending,
before attaching to the board, fix the place where the lead comes out in advance and attach it after bending so that a crack does not occur in
the glass part.
Surface Mount Devices
The lead of the device and the pattern of the board is soldered on the surface. Since extreme deformation of the board tears off the pattern,
tears off the lead metal, cracks the solder and damages the sealed part of the device and there are cases in which performance deteriorates
and operation fails, use it within the stipulated bending conditions. Due to the small cracks in the board resulting from mounting, please pay
sufficient attention when attaching a device at the position where the warping of the board is great.
When using an automatic loading machine, as far as possible, select a type that has a small impact and use it while confirming that there is no
damage.
Surface mount devices are NOT flow soldering compatible.
5. Storage Condition
Since the long hour high temperature and low temperature storage, as well as the storage at high humidity are causes of deterioration in
frequency accuracy and solderability.
Parts should be stored in temperature range of -5 to +40C˚, humidity 40 to 60% RH, and avoid direct sunlight. Then use within 6 months.
Handling Notes for Crystal Oscillators
6. In order to use crystal oscillators
(1)The minlature crystal oscillator for the clock utillzes a C-MOS IC and incorporates a protective circuit against static electricity
However, exerclse care in the same manner as for a normal C−MOS IC.
(2)Internal capacitor is not provided in the power supply section (+DC−GNC).
To serve as overimpressed voltage and overcurrent protective device, place a bypass capacitor (0.01
µF)
as near as possible
to the (+DC−GND) terminal.
However, the capacity value is meant as a guideline.
Depending on the capacitor type, frequency characteristics vary. Accordingly, use a capacitor that matches the frequency
characteristics.
(3)Applying reverse voltage could result in damage to internal parts. Take care not to connect terminals incorrectly.
(4)Please do not use oscillators under unfavorable condition such as beyond specified range in catalog or specification sheet.
(5)Please keep oscillators away from water, salt water or harmful gas.
(6)K50H-3C / FSO series should be stored in humidity-controlled area after the package is unsealed, in temperature
+25±5˚C
under humidity of 65%RH, and should be mounted on PCB within 7 days.
(7)K50H-3C / FSO series has Bypass Capacitior between VDD and GND.
Test Circuits and Clock Timing Chart
CMOS Output Test Circuits
Clock Timing chart(C-MOS Output)
Note) Maximum load(Includes capacitances of fixture and probe)
LV-PECL Output Test Circuits
Clock Timing chart (LV-PECL Output)
嵌入式系统
