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K7M163645A-FC130

ZBT SRAM, 512KX36, CMOS, PBGA165, FBGA-165

器件类别:存储    存储   

厂商名称:SAMSUNG(三星)

厂商官网:http://www.samsung.com/Products/Semiconductor/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
SAMSUNG(三星)
零件包装代码
BGA
包装说明
LBGA,
针数
165
Reach Compliance Code
compliant
ECCN代码
3A991.B.2.A
其他特性
PIPELINED ARCHITECTURE
JESD-30 代码
R-PBGA-B165
JESD-609代码
e0
长度
15 mm
内存密度
18874368 bit
内存集成电路类型
ZBT SRAM
内存宽度
36
功能数量
1
端子数量
165
字数
524288 words
字数代码
512000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
512KX36
封装主体材料
PLASTIC/EPOXY
封装代码
LBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
座面最大高度
1.4 mm
最大供电电压 (Vsup)
3.465 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
TIN LEAD
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
13 mm
文档预览
K7M163625A
K7M161825A
512Kx36 & 1Mx18 Flow-Through NtRAM
TM
18Mb
TM
NtRAM
Specification
100 TQFP with Pb & Pb-Free
(RoHS compliant)
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.
ALL INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-
lar applications where Product failure couldresult in loss of life or personal or physical harm, or any military
or defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
-1-
Rev. 3.0 November 2003
K7M163625A
K7M161825A
Document Title
512Kx36 & 1Mx18 Flow-Through NtRAM
TM
512Kx36 & 1Mx18-Bit Flow Through NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
0.3
History
1. Initial document.
1. Add JTAG Scan Order
1. Remove bin -90
2. Updated DC characteristics(ICC,ISB,ISB1,ISB2)
1. Add x32 org and industrial temperature .
2. Add 165FBGA package
1. Final spec release
1. Add the speed bin (-60)
1. Delete 119BGA package.
2. Correct the Ball Size of 165 FBGA.
1. Delete x32 Org. and 165FBGA pkg. type.
2. Delete the 6.0ns and 8.5ns speed bin
Draft Date
Feb. 23. 2001
May. 10. 2001
Aug. 03. 2001
Aug. 30. 2001
Remark
Preliminary
Preliminary
Preliminary
Preliminary
1.0
2.0
2.1
May. 10. 2002
Oct. 26, 2002
April. 04. 2003
Final
Final
Final
3.0
Nov. 17, 2003
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-2-
Rev. 3.0 November 2003
K7M163625A
K7M161825A
512Kx36 & 1Mx18 Flow-Through NtRAM
TM
16Mb NtRAM(Flow Through / Pipelined) Ordering Informa
tion
Org.
Part Number
K7M161825A-QC(I)65/75
1Mx18 K7N161801A-Q(F)C(I)25/20/16/13
K7N161845A-Q(F)C(I)25/20/16/13
K7M163625A-QC(I)65/75
512Kx36 K7N163601A-Q(F)C(I)25/20/16/13
K7N163645A-Q(F)C(I)25/20/16/13
Mode
FlowThrough
Pipelined
Pipelined
FlowThrough
Pipelined
Pipelined
VDD
3.3
3.3
2.5
3.3
3.3
2.5
Speed
FT ; Access Time(ns)
Pipelined ; Cycle Time(MHz)
6.5/7.5 ns
250/200/167/133MHz
250/200/167/133MHz
6.5/7.5 ns
250/200/167/133MHz
250/200/167/133MHz
Q : 100TQFP
F : 165FBGA
PKG
Temp
C
; Commercial
Temp.Range
I
; Industrial
Temp.Range
-3-
Rev. 3.0 November 2003
K7M163625A
K7M161825A
512Kx36 & 1Mx18 Flow-Through NtRAM
TM
512Kx36 & 1Mx18-Bit Flow Through NtRAM
TM
FEATURES
• 3.3V+0.165V/-0.165V Power Supply.
• I/O Supply Voltage 3.3V+0.165V/-0.165V for 3.3V I/O
or 2.5V+0.4V/-0.125V for 2.5V I/O
• Byte Writable Function.
• Enable clock and suspend operation.
• Single READ/WRITE control pin.
• Self-Timed Write Cycle.
• Three Chip Enable for simple depth expansion with no data
contention .
• A interleaved burst or a linear burst mode.
• Asynchronous output enable control.
• Power Down mode.
• TTL-Level Three-State Outputs.
• 100-TQFP-1420A
• Operating in commeical and industrial temperature range.
GENERAL DESCRIPTION
The K7M163625A and K7M161825A are 18,874,368-bits Syn-
chronous Static SRAMs.
The NtRAM
TM
, or No Turnaround Random Access Memory uti-
lizes all bandwidth in any combination of operating cycles.
Address, data inputs, and all control signals except output
enable and linear burst order are synchronized to input clock.
Burst order control must be tied "High or Low".
Asynchronous inputs include the sleep mode enable(ZZ).
Output Enable controls the outputs at any given time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-chip
write pulse generation
and provides increased timing flexibility for incoming signals.
For read cycles, Flow-Through SRAM allows output data to
simply flow freely from the memory array.
The K7M163625A and K7M161825A are implemented with
SAMSUNG′s high performance CMOS technology and is avail-
able in 100pin TQFP packages. Multiple power and ground pins
minimize ground bounce.
FAST ACCESS TIMES
Parameter
Cycle Time
Clock Access Time
Output Enable Access Time
Sym.
t
CYC
t
CD
t
OE
-65
7.5
6.5
3.5
-75
8.5
7.5
3.5
Unit
ns
ns
ns
LOGIC BLOCK DIAGRAM
LBO
ADDRESS
REGISTER
A
2
~A
18
or A
2
~A
19
A
0
~A
1
BURST
ADDRESS
COUNTER
A′
0
~A′
1
512Kx36, 1Mx18
MEMORY
ARRAY
A [0:18]or
A [0:19]
CLK
CKE
K
WRITE
ADDRESS
REGISTER
K
DATA-IN
REGISTER
CONTROL
LOGIC
CS
1
CS
2
CS
2
ADV
WE
BW
x
(x=a,b,c,d or a,b)
OE
ZZ
DQa
0
~ DQd
7
or DQa
0
~ DQb
8
DQPa ~ DQPd
CONTROL
REGISTER
CONTROL
LOGIC
BUFFER
36 or 18
NtRAM
TM
and No Turnaround Random Access Memory are trademarks of Samsung.
-4-
Rev. 3.0 November 2003
K7M163625A
K7M161825A
PIN CONFIGURATION
(TOP VIEW)
BWd
512Kx36 & 1Mx18 Flow-Through NtRAM
TM
BWb
BWa
BWc
ADV
CKE
CLK
CS
1
CS
2
CS
2
V
DD
V
SS
WE
A
18
A
17
83
OE
A
6
A
7
A
8
82
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
81
A
9
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
A
5
A
4
A
3
A
2
A
1
A
0
A
10
A
12
A
13
A
14
A
15
N.C.
N.C.
V
DD
N.C.
LBO
N.C.
V
SS
PIN NAME
SYMBOL
A
0
- A
18
PIN NAME
Address Inputs
TQFP PIN NO.
SYMBOL
V
DD
V
SS
N.C.
DQa
0
~a
7
DQb
0
~b
7
DQc
0
~c
7
DQd
0
~d
7
DQPa~P
d
or NC
V
DDQ
V
SSQ
PIN NAME
TQFP PIN NO.
32,33,34,35,36,37,44
45,46,47,48,49,50,81
82,83,84,99,100
ADV
Address Advance/Load 85
WE
Read/Write Control Input 88
89
Clock
CLK
87
Clock Enable
CKE
98
Chip Select
CS
1
97
Chip Select
CS
2
92
Chip Select
CS
2
93,94,95,96
BWx(x=a,b,c,d) Byte Write Inputs
86
Output Enable
OE
64
Power Sleep Mode
ZZ
31
Burst Mode Control
LBO
Power Supply(+3.3V) 15,16,41,65,91
14,17,40,66,67,90
Ground
No Connect
Data Inputs/Outputs
Data Inputs/Outputs
Data Inputs/Outputs
Data Inputs/Outputs
Data Inputs/Outputs
38,39,42,43
52,53,56,57,58,59,62,63
68,69,72,73,74,75,78,79
2,3,6,7,8,9,12,13
18,19,22,23,24,25,28,29
51,80,1,30
A
11
Output Power Supply 4,11,20,27,54,61,70,77
(2.5V or 3.3V)
5,10,21,26,55,60,71,76
Output Ground
Notes :
1. A
0
and A
1
are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.
-5-
Rev. 3.0 November 2003
A
16
50
NC/DQPc
DQc
0
DQc
1
V
DDQ
V
SSQ
DQc
2
DQc
3
DQc
4
DQc
5
V
SSQ
V
DDQ
DQc
6
DQc
7
Vss
V
DD
V
DD
V
SS
DQd
0
DQd
1
V
DDQ
V
SSQ
DQd
2
DQd
3
DQd
4
DQd
5
V
SSQ
V
DDQ
DQd
6
DQd
7
NC/DQPd
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
100 Pin TQFP
(20mm x 14mm)
K7M163625A(512Kx36)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DQPb/NC
DQb
7
DQb
6
V
DDQ
V
SSQ
DQb
5
DQb
4
DQb
3
DQb
2
V
SSQ
V
DDQ
DQb
1
DQb
0
V
SS
V
SS
V
DD
ZZ
DQa
7
DQa
6
V
DDQ
V
SSQ
DQa
5
DQa
4
DQa
3
DQa
2
V
SSQ
V
DDQ
DQa
1
DQa
0
DQPa/NC
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