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K8S2815ETE-FC7E0

Flash, 8MX16, 70ns, PBGA44, 7.70 X 6.20 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44

器件类别:存储    存储   

厂商名称:SAMSUNG(三星)

厂商官网:http://www.samsung.com/Products/Semiconductor/

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器件参数
参数名称
属性值
厂商名称
SAMSUNG(三星)
零件包装代码
BGA
包装说明
VFBGA,
针数
44
Reach Compliance Code
compliant
ECCN代码
3A991.B.1.A
最长访问时间
70 ns
其他特性
TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
启动块
TOP
JESD-30 代码
R-PBGA-B44
内存密度
134217728 bit
内存集成电路类型
FLASH
内存宽度
16
功能数量
1
端子数量
44
字数
8388608 words
字数代码
8000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
8MX16
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行
PARALLEL
编程电压
1.8 V
认证状态
Not Qualified
座面最大高度
1 mm
最大供电电压 (Vsup)
1.95 V
最小供电电压 (Vsup)
1.7 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
BALL
端子节距
0.5 mm
端子位置
BOTTOM
文档预览
Rev. 1.0, Nov 2010
K8S2815ET(B)E
128Mb E-die NOR FLASH
44FBGA, 7.7x6.2, 0.5mm ball pitch
8M x16, Muxed Burst, Multi Bank
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2009 Samsung Electronics Co., Ltd. All rights reserved.
-1-
K8S2815ET(B)E
datasheet
NOR FLASH MEMORY
History
Draft Date
13. May, 2010
28. Oct, 2010
23. Nov, 2010
Remark
Target
Preliminary
Final
Editor
-
-
-
Rev. 1.0
Revision History
Revision No.
0.0
0.5
1.0
- Initial Draft
- Preliminary datasheet.
- Specification is finalized.
-2-
K8S2815ET(B)E
128Mb E-die NOR FLASH 1
datasheet
NOR FLASH MEMORY
Rev. 1.0
1.0 FEATURES................................................................................................................................................................. 4
2.0 GENERAL DESCRIPTION ......................................................................................................................................... 4
3.0 PIN DESCRIPTION .................................................................................................................................................... 5
4.0 44Ball FBGA TOP VIEW (BALL DOWN) .................................................................................................................... 6
5.0 FUNCTIONAL BLOCK DIAGRAM .............................................................................................................................. 7
6.0 ORDERING INFORMATION ...................................................................................................................................... 8
7.0 PRODUCT INTRODUCTION...................................................................................................................................... 10
8.0 COMMAND DEFINITIONS ......................................................................................................................................... 11
8.1 COMMAND DEFINITIONS...................................................................................................................................... 11
9.0 DEVICE OPERATION ................................................................................................................................................ 13
9.1 Read Mode .............................................................................................................................................................. 13
9.2 Asynchronous Read Mode ...................................................................................................................................... 13
9.3 Synchronous (Burst) Read Mode ............................................................................................................................ 13
9.4 Output Driver Setting ............................................................................................................................................... 14
9.5 Programmable Wait State ....................................................................................................................................... 14
9.6 Set Burst Mode Configuration Register ................................................................................................................... 14
9.6.1 Extended Configuration Register (option : K8S2615ET(B)E only) .................................................................... 15
9.7 Programmable Wait State Configuration ................................................................................................................. 15
9.8 Burst Read Mode Setting ........................................................................................................................................ 15
9.9 RDY Configuration................................................................................................................................................... 15
9.10 Autoselect Mode.................................................................................................................................................... 16
9.11 Standby Mode ....................................................................................................................................................... 16
9.12 Automatic Sleep Mode .......................................................................................................................................... 16
9.13 Output Disable Mode............................................................................................................................................. 16
9.14 Block Protection & Unprotection ............................................................................................................................ 16
9.15 Hardware Reset..................................................................................................................................................... 17
9.16 Software Reset ...................................................................................................................................................... 17
9.17 Program ................................................................................................................................................................. 17
9.18 Accelerated Program Operation ............................................................................................................................ 17
9.19 Unlock Bypass....................................................................................................................................................... 18
9.20 Chip Erase ............................................................................................................................................................. 18
9.21 Block Erase ........................................................................................................................................................... 18
9.22 Erase Suspend / Resume...................................................................................................................................... 18
9.23 Program Suspend / Resume ................................................................................................................................. 19
9.24 Read While Write Operation .................................................................................................................................. 19
9.25 OTP Block Region ................................................................................................................................................. 19
9.26 Write Pulse “Glitch” Protection .............................................................................................................................. 19
9.27 Low VCC Write Inhibit ........................................................................................................................................... 19
9.28 Logical Inhibit......................................................................................................................................................... 19
9.29 Power-up Protection .............................................................................................................................................. 19
9.30 FLASH MEMORY STATUS FLAGS ...................................................................................................................... 20
10.0 COMMON FLASH MEMORY INTERFACE .............................................................................................................. 22
11.0 ABSOLUTE MAXIMUM RATINGS
..................................................................................................................... 24
12.0 RECOMMENDED OPERATING CONDITIONS ( Voltage reference to GND )
..................................................... 24
13.0 DC CHARACTERISTICS...................................................................................................................................
24
14.0 CAPACITANCE ........................................................................................................................................................ 26
15.0 AC TEST CONDITION
...................................................................................................................................... 26
15.1 Asynchronous Read
........................................................................................................................................29
15.2 Hardware Reset(RESET)
................................................................................................................................32
15.3 Erase/Program Operation................................................................................................................................33
16.0 ERASE/PROGRAM PERFORMANCE
.............................................................................................................. 33
17.0 CROSSING OF FIRST WORD BOUNDARY IN BURST READ MODE ................................................................... 40
-3-
K8S2815ET(B)E
datasheet
NOR FLASH MEMORY
2.0 GENERAL DESCRIPTION
Rev. 1.0
128M Bit (8M x16) Muxed Burst , Multi Bank NOR Flash Memory
1.0 FEATURES
Single Voltage, 1.7V to 1.95V for Read and Write operations
Organization
- 8,386,108 x 16 bit ( Word Mode Only)
Multiplexed Data and Address for reduction of interconnections
- A/DQ0 ~ A/DQ15
Read While Program/Erase Operation
Multiple Bank Architecture
- 16 Banks (8Mb Partition)
OTP Block : Extra 256-word block
Read Access Time (@ C
L
=30pF)
- Asynchronous Random Access Time : 70ns
- Synchronous Random Access Time : 70ns
- Burst Access Time :
14.5ns (54MHz) / 11ns (66MHz) / 9ns (83Mhz) / 7ns (108Mhz)
Burst Length :
- Continuous Linear Burst
- Linear Burst : 8-word & 16-word with Wrap
Block Architecture
- Eight 4Kword blocks and two hundreds fifty-five 32Kword blocks
- Bank 0 contains eight 4 Kword blocks and fifteen 32Kword blocks
- Bank 1 ~ Bank 15 contain two hundred forty 32Kword blocks
Reduce program time using the V
PP
Support Single & Quad word accelerate program
Power Consumption (Typical value, C
L
=30pF)
- Burst Access Current : 24mA
- Program/Erase Current : 15mA
- Read While Program/Erase Current : 40mA
- Standby Mode/Auto Sleep Mode : 15uA
Block Protection/Unprotection
- Using the software command sequence
- Last two boot blocks are protected by WP=V
IL
- All blocks are protected by V
PP
=V
IL
Handshaking Feature
- Provides host system with minimum latency by monitoring
RDY
Erase Suspend/Resume
Program Suspend/Resume
Unlock Bypass Program/Erase
Hardware Reset (RESET)
Data Polling and Toggle Bits
- Provides a software method of detecting the status of program
or erase completion
Endurance
- 100K Program / Erase cycles
Extended Temperature : -25°C ~ 85°C
Support Common Flash Memory Interface
Low Vcc Write Inhibit
Package : Package : 44-ball FBGA Type, 7.7 x 6.2mm
0.5 mm ball pitch
1.0 mm (Max.) Thickness
The K8S2815E featuring single 1.8V power supply is a 128Mbit Synchro-
nous Burst Multi Bank Flash Memory organized as 8Mx16. The memory
architecture of the device is designed to divide its memory arrays into 263
blocks with independent hardware protection. This block architecture pro-
vides highly flexible erase and program capability. The K8S2815E NOR
Flash consists of sixteen banks. This device is capable of reading data from
one bank while programming or erasing in the other bank.
Regarding read access time, the K8S2815E provides an 14.5ns burst
access time and an 70ns initial access time at 54MHz. At 66MHz, the
K8S2815E provides an 11ns burst access time and 70ns initial access time.
At 83MHz, the K8S2815E provides an 9ns burst access time and 70ns ini-
tial access time. At 108MHz, the K8S2815E provides an 7ns burst access
time and 70ns initial access time. The device performs a program operation
in units of 16 bits (Word) and an erase operation in units of a block. Single
or multiple blocks can be erased. The block erase operation is completed
within typically 0.7sec. The device requires 15mA as program/erase current
in the extended temperature ranges.
The K8S2815E NOR Flash Memory is created by using Samsung's
advanced CMOS process technology.
-4-
K8S2815ET(B)E
datasheet
NOR FLASH MEMORY
Pin Function
Address Inputs
Multiplexed Address/Data input/output
Chip Enable
Output Enable
Hardware Reset Pin
Accelerates Programming
Write Enable
Hardware Write Protection Input
Clock
Ready Output
Address Valid Input
Power Supply
Ground
Rev. 1.0
3.0 PIN DESCRIPTION
Pin Name
A16 - A22
A/DQ0 - A/DQ15
CE
OE
RESET
V
PP
WE
WP
CLK
RDY
AVD
V
CC
V
SS
-5-
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