Flash, 16MX8, 30ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48
厂商名称:SAMSUNG(三星)
厂商官网:http://www.samsung.com/Products/Semiconductor/
下载文档型号 | K9F2808Q0C-BCB0 | K9F2816Q0C-BCB0 | K9F2816Q0C-BIB0 | K9F2808Q0C-BIB0 | K9F2816U0C-BCB0 | K9F2816U0C-BIB0 |
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描述 | Flash, 16MX8, 30ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | Flash, 8MX16, 30ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | Flash, 8MX16, 30ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | Flash, 16MX8, 30ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | Flash, 8MX16, 30ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | Flash, 8MX16, 30ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | VFBGA, | 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 |
针数 | 48 | 48 | 48 | 48 | 48 | 48 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
最长访问时间 | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns |
其他特性 | CONTAINS ADDITIONAL 4M BIT NAND FLASH | CONTAINS ADDITIONAL 4M BIT NAND FLASH | CONTAINS ADDITIONAL 4M BIT NAND FLASH | CONTAINS ADDITIONAL 4M BIT NAND FLASH | CONTAINS ADDITIONAL 4M BIT NAND FLASH | CONTAINS ADDITIONAL 4M BIT NAND FLASH |
JESD-30 代码 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
长度 | 8.5 mm | 8.5 mm | 8.5 mm | 8.5 mm | 8.5 mm | 8.5 mm |
内存密度 | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 8 | 16 | 16 | 8 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 48 | 48 | 48 | 48 | 48 | 48 |
字数 | 16777216 words | 8388608 words | 8388608 words | 16777216 words | 8388608 words | 8388608 words |
字数代码 | 16000000 | 8000000 | 8000000 | 16000000 | 8000000 | 8000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C |
组织 | 16MX8 | 8MX16 | 8MX16 | 16MX8 | 8MX16 | 8MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.7 V | 2.7 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
最大供电电压 (Vsup) | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
类型 | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE |
宽度 | 6 mm | 6 mm | 6 mm | 6 mm | 6 mm | 6 mm |