K9K2G08U0M-VCB0,VIB0,FCB0,FIB0
K9K2G08Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G08U0M-YCB0,YIB0,PCB0,PIB0
K9K2G16Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G16U0M-YCB0,YIB0,PCB0,PIB0
FLASH MEMORY
Document Title
256M x 8 Bit / 128M x 16 Bit
NAND Flash Memory
Revision History
Revision No
0.0
0.1
History
1. Initial issue
1.
IO
L(R/B) of 1.8V device is changed.
-min. Value: 7mA -->3mA
-typ. Value: 8mA -->4mA
Draft Date
Sep. 19.2001
Nov. 5. 2001
Remark
Advance
0.2
1. 5th cycle of ID is changed
: 40h --> 44h
Jan. 23.2002
0.3
1. Add WSOP Package Dimensions.
May. 29.2002
0.4
1. Max Icc value of 1.8V/3.3V device is changed.
- Max. value Icc1,Icc2,Icc3: 20mA --> 30mA (3.3V device)
- Max. value Icc1,Icc2,Icc3: 15mA --> 20mA (1.8V device)
Sep. 12.2002
0.5
1. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V device (Page 35)
2. Add the data protection Vcc guidence for 1.8V device - below about
1.1V. (Page 36)
Nov. 22.2002
0.6
0.7
The min. Vcc value 1.8V devices is changed.
K9K2GXXQ0M : Vcc 1.65V~1.95V --> 1.70V~1.95V
Pb-free Package is added.
K9K2G08U0M-FCB0,FIB0
K9K2G08Q0M-PCB0,PIB0
K9K2G08U0M-PCB0,PIB0
K9K2G16U0M-PCB0,PIB0
K9K2G16Q0M-PCB0,PIB0
Errata is added.(Front Page)-K9K2GXXQ0M
tWC tWP tWH tRC tREH tRP tREA tCEA
Specification
45 25 15 50 15 25 30
45
Relaxed value 80 60 20 60 80 60 60
75
1. The 3rd Byte ID after 90h ID read command is don’ cared.
t
The 5th Byte ID after 90h ID read command is deleted.
1. Added Addressing method for program operation
Mar. 6.2003
Mar. 13.2003
0.8
Mar. 17.2003
0.9
1.0
Apr. 9. 2003
Jan. 27. 2004
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you
have any questions, please contact the SAMSUNG branch office near your office.
1
K9K2G08U0M-VCB0,VIB0,FCB0,FIB0
K9K2G08Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G08U0M-YCB0,YIB0,PCB0,PIB0
K9K2G16Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G16U0M-YCB0,YIB0,PCB0,PIB0
FLASH MEMORY
Document Title
256M x 8 Bit / 128M x 16 Bit
NAND Flash Memory
Revision History
Revision No
1.1
1.2
History
1. Add the Protrusion/Burr value in WSOP1 PKG Diagram.
1. PKG(TSOP1, WSOP1) Dimension Change
Draft Date
Apr. 24. 2004
May. 19. 2004
Remark
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you
have any questions, please contact the SAMSUNG branch office near your office.
2
K9K2G08U0M-VCB0,VIB0,FCB0,FIB0
K9K2G08Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G08U0M-YCB0,YIB0,PCB0,PIB0
K9K2G16Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G16U0M-YCB0,YIB0,PCB0,PIB0
FLASH MEMORY
256M x 8 Bit / 128M x 16 Bit NAND Flash Memory
PRODUCT LIST
Part Number
K9K2G08Q0M-Y,P
K9K2G16Q0M-Y,P
K9K2G08U0M-Y,P
K9K2G16U0M-Y,P
K9K2G08U0M-V,F
2.7 ~ 3.6V
2.7 ~ 3.6V
Vcc Range
1.70 ~ 1.95V
Organization
X8
X16
X8
X16
X8
WSOP1
TSOP1
PKG Type
FEATURES
•
Voltage Supply
-1.8V device(K9K2GXXQ0M): 1.70V~1.95V
-3.3V device(K9K2GXXU0M): 2.7 V ~3.6 V
•
Organization
- Memory Cell Array
-X8 device(K9K2G08X0M) : (256M + 8,192K)bit x 8bit
-X16 device(K9K2G16X0M) : (128M + 4,096K)bit x 16bit
- Data Register
-X8 device(K9K2G08X0M): (2K + 64)bit x8bit
-X16 device(K9K2G16X0M): (1K + 32)bit x16bit
- Cache Register
-X8 device(K9K2G08X0M) : (2K + 64)bit x8bit
-X16 device(K9K2G16X0M) : (1K + 32)bit x16bit
•
Automatic Program and Erase
- Page Program
-X8 device(K9K2G08X0M) : (2K + 64)Byte
-X16 device(K9K2G16X0M) : (1K + 32)Word
- Block Erase
-X8 device(K9K2G08X0M) : (128K + 4K)Byte
-X16 device(K9K2G16X0M) : (64K + 2K)Word
•
Page Read Operation
- Page Size
- X8 device(K9K2G08X0M) : 2K-Byte
- X16 device(K9K2G16X0M) : 1K-Word
- Random Read : 25µs(Max.)
- Serial Access : 50ns(Min.)
•
Fast Write Cycle Time
- Program time : 300µs(Typ.)
- Block Erase Time : 2ms(Typ.)
•
Command/Address/Data Multiplexed I/O Port
•
Hardware Data Protection
- Program/Erase Lockout During Power Transitions
•
Reliable CMOS Floating-Gate Technology
- Endurance : 100K Program/Erase Cycles
- Data Retention : 10 Years
•
Command Register Operation
•
Cache Program Operation for High Performance Program
•
Power-On Auto-Read Operation
•
Intelligent Copy-Back Operation
•
Unique ID for Copyright Protection
•
Package :
- K9K2GXXX0M-YCB0/YIB0
48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- K9K2G08U0M-VCB0/VIB0
48 - Pin WSOP I (12X17X0.7mm)
- K9K2GXXX0M-PCB0/PIB0
48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)- Pb-free Package
- K9K2G08U0M-FCB0/FIB0
48 - Pin WSOP I (12X17X0.7mm)- Pb-free Package
* K9K2G08U0M-V,F(WSOPI ) is the same device as
K9K2G08U0M-Y,P(TSOP1) except package type.
GENERAL DESCRIPTION
Offered in 256Mx8bit or 128Mx16bit, the K9K2GXXX0M is 2G bit with spare 64M bit capacity. Its NAND cell provides the most cost-
effective solution for the solid state mass storage market. A program operation can be performed in typical 300µs on the 2112-
byte(X8 device) or 1056-word(X16 device) page and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device)
or 64K-word(X16 device) block. Data in the data page can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for
address and data input/output as well as command input. The on-chip write controller automates all program and erase functions
including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take
advantage of the K9K2GXXX0M′s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with
real time mapping-out algorithm. The K9K2GXXX0M is an optimum solution for large nonvolatile storage applications such as solid
state file storage and other portable applications requiring non-volatility.
3
K9K2G08U0M-VCB0,VIB0,FCB0,FIB0
K9K2G08Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G08U0M-YCB0,YIB0,PCB0,PIB0
K9K2G16Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G16U0M-YCB0,YIB0,PCB0,PIB0
FLASH MEMORY
PIN CONFIGURATION (TSOP1)
K9K2GXXX0M-YCB0,PCB0/YIB0,PIB0
X16
N.C
N.C
N.C
N.C
N.C
N.C
R/B
RE
CE
N.C
N.C
Vcc
Vss
N.C
N.C
CLE
ALE
WE
WP
N.C
N.C
N.C
N.C
N.C
X8
N.C
N.C
N.C
N.C
N.C
N.C
R/B
RE
CE
N.C
N.C
Vcc
Vss
N.C
N.C
CLE
ALE
WE
WP
N.C
N.C
N.C
N.C
N.C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
X8
N.C
N.C
N.C
N.C
I/O7
I/O6
I/O5
I/O4
N.C
N.C
PRE
Vcc
Vss
N.C
N.C
N.C
I/O3
I/O2
I/O1
I/O0
N.C
N.C
N.C
N.C
X16
Vss
I/O15
I/O7
I/O14
I/O6
I/O13
I/O5
I/O12
I/O4
N.C
PRE
Vcc
N.C
N.C
N.C
I/O11
I/O3
I/O10
I/O2
I/O9
I/O1
I/O8
I/O0
Vss
48-pin TSOP1
Standard Type
12mm x 20mm
PACKAGE DIMENSIONS
48-PIN LEAD/LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I)
48 - TSOP1 - 1220AF
Unit :mm/Inch
0.10
MAX
0.004
#48
( 0.25 )
0.010
12.40
0.488 MAX
#24
#25
1.00
±0.05
0.039
±0.002
0.25
0.010 TYP
18.40
±0.10
0.724
±0.004
+0.075
20.00
±0.20
0.787
±0.008
0.20
-0.03
+0.07
#1
0.008
-0.001
0.16
-0.03
+0.07
+0.003
0.50
0.0197
12.00
0.472
0.05
0.002 MIN
0.125
0.035
0~8°
0.45~0.75
0.018~0.030
( 0.50 )
0.020
4
0.005
-0.001
+0.003
1.20
0.047MAX
K9K2G08U0M-VCB0,VIB0,FCB0,FIB0
K9K2G08Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G08U0M-YCB0,YIB0,PCB0,PIB0
K9K2G16Q0M-YCB0,YIB0,PCB0,PIB0
K9K2G16U0M-YCB0,YIB0,PCB0,PIB0
FLASH MEMORY
PIN CONFIGURATION (WSOP1)
K9K2G08U0M-VCB0,FCB0/VIB0,FIB0
N.C
N.C
DNU
N.C
N.C
N.C
R/B
RE
CE
DNU
N.C
Vcc
Vss
N.C
DNU
CLE
ALE
WE
WP
N.C
N.C
DNU
N.C
N.C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
N.C
N.C
DNU
N.C
I/O7
I/O6
I/O5
I/O4
N.C
DNU
N.C
Vcc
Vss
N.C
DNU
N.C
I/O3
I/O2
I/O1
I/O0
N.C
DNU
N.C
N.C
PACKAGE DIMENSIONS
48-PIN LEAD PLASTIC VERY VERY THIN SMALL OUT-LINE PACKAGE TYPE (I)
48 - WSOP1 - 1217F
Unit :mm
0.70 MAX
15.40
±0.10
0.58
±0.04
#1
+0.07
-0.03
#48
+0.07
-0.03
0.16
12.40MAX
12.00
±0.10
0.50TYP
(0.50
±
0.06)
0.20
#24
#25
(0.01Min)
0.10
+0.075
-0.035
8
°
0
°
~
0.45~0.75
17.00
±0.20
5
