型号
- 型号
- 关键词
MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40
厂商名称：SAMSUNG(三星)
厂商官网：http://www.samsung.com/Products/Semiconductor/
下载文档| 型号 | KM23C4100A-20 | KM23C4100AFP1-25 | KM23C4100A-25 | KM23C4100AFP2-15 | KM23C4100AFP1-15 | KM23C4100AFP2-20 | KM23C4100AFP1-20 | KM23C4100A-15 | KM23C4100AFP2-25 |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | MASK ROM, 512KX8, 250ns, CMOS, CQFP44, 14 X 14 MM, QFP-44 | MASK ROM, 512KX8, 250ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | MASK ROM, 512KX8, 150ns, CMOS, CQFP44, 10 X 10 MM, QFP-44 | MASK ROM, 512KX8, 150ns, CMOS, CQFP44, 14 X 14 MM, QFP-44 | MASK ROM, 512KX8, 200ns, CMOS, CQFP44, 10 X 10 MM, QFP-44 | MASK ROM, 512KX8, 200ns, CMOS, CQFP44, 14 X 14 MM, QFP-44 | MASK ROM, 512KX8, 150ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | MASK ROM, 512KX8, 250ns, CMOS, CQFP44, 10 X 10 MM, QFP-44 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | QFP | DIP | QFP | QFP | QFP | QFP | DIP | QFP |
| 包装说明 | DIP, DIP40,.6 | WQFP, QFP44,.7SQ,32 | DIP, DIP40,.6 | WQFP, TQFP44,.6SQ,32 | WQFP, QFP44,.7SQ,32 | WQFP, TQFP44,.6SQ,32 | WQFP, QFP44,.7SQ,32 | DIP, DIP40,.6 | WQFP, TQFP44,.6SQ,32 |
| 针数 | 40 | 44 | 40 | 44 | 44 | 44 | 44 | 40 | 44 |
| Reach Compliance Code | unknown | compliant | compliant | unknown | unknown | unknown | unknown | unknown | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 250 ns | 250 ns | 150 ns | 150 ns | 200 ns | 200 ns | 150 ns | 250 ns |
| 备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | R-PDIP-T40 | S-CQFP-G44 | R-PDIP-T40 | S-CQFP-G44 | S-CQFP-G44 | S-CQFP-G44 | S-CQFP-G44 | R-PDIP-T40 | S-CQFP-G44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 52.43 mm | 14 mm | 52.43 mm | 10 mm | 14 mm | 10 mm | 14 mm | 52.43 mm | 10 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bi |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 44 | 40 | 44 | 44 | 44 | 44 | 40 | 44 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | WQFP | DIP | WQFP | WQFP | WQFP | WQFP | DIP | WQFP |
| 封装等效代码 | DIP40,.6 | QFP44,.7SQ,32 | DIP40,.6 | TQFP44,.6SQ,32 | QFP44,.7SQ,32 | TQFP44,.6SQ,32 | QFP44,.7SQ,32 | DIP40,.6 | TQFP44,.6SQ,32 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK, WINDOW | IN-LINE | FLATPACK, WINDOW | FLATPACK, WINDOW | FLATPACK, WINDOW | FLATPACK, WINDOW | IN-LINE | FLATPACK, WINDOW |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 0.8 mm | 2.54 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 2.54 mm | 0.8 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 14 mm | 15.24 mm | 10 mm | 14 mm | 10 mm | 14 mm | 15.24 mm | 10 mm |
| 厂商名称 | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 座面最大高度 | 5.08 mm | 2.8 mm | 5.08 mm | - | 2.8 mm | - | 2.8 mm | 5.08 mm | - |
