Synchronous DRAM Module, 8MX72, 6ns, CMOS
厂商名称:SAMSUNG(三星)
厂商官网:http://www.samsung.com/Products/Semiconductor/
下载文档型号 | KMM374S823BTL-GL | KMM374S823BTL-GH | KMM374S823BTL-G8 |
---|---|---|---|
描述 | Synchronous DRAM Module, 8MX72, 6ns, CMOS | Synchronous DRAM Module, 8MX72, 6ns, CMOS | Synchronous DRAM Module, 8MX72, 6ns, CMOS |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
Reach Compliance Code | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 6 ns | 6 ns | 6 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
内存密度 | 603979776 bit | 603979776 bit | 603979776 bit |
内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
内存宽度 | 72 | 72 | 72 |
功能数量 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 |
端子数量 | 168 | 168 | 168 |
字数 | 8388608 words | 8388608 words | 8388608 words |
字数代码 | 8000000 | 8000000 | 8000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C |
组织 | 8MX72 | 8MX72 | 8MX72 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
自我刷新 | YES | YES | YES |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | NO | NO | NO |
技术 | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD |
端子位置 | DUAL | DUAL | DUAL |