EDO DRAM Module, 16MX32, 50ns, CMOS, SIMM-72
厂商名称:SAMSUNG(三星)
厂商官网:http://www.samsung.com/Products/Semiconductor/
下载文档型号 | KMM53216004CK-50 | KMM53216004CK-6 | KMM53216004CKG-5 | KMM53216004CKG-6 | KMM53216004CK-60 | KMM53216004CK-5 |
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描述 | EDO DRAM Module, 16MX32, 50ns, CMOS, SIMM-72 | EDO DRAM Module, 16MX32, 60ns, CMOS, SIMM-72 | EDO DRAM Module, 16MX32, 50ns, CMOS, SIMM-72 | EDO DRAM Module, 16MX32, 60ns, CMOS, SIMM-72 | EDO DRAM Module, 16MX32, 60ns, CMOS, SIMM-72 | EDO DRAM Module, 16MX32, 50ns, CMOS, SIMM-72 |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
包装说明 | SIMM, | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, | SIMM, SSIM72 |
Reach Compliance Code | compliant | unknown | unknown | unknown | compliant | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
最长访问时间 | 50 ns | 60 ns | 50 ns | 60 ns | 60 ns | 50 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; WD-MAX | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; WD-MAX | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 |
内存密度 | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bi |
内存集成电路类型 | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 72 | 72 | 72 | 72 | 72 | 72 |
字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
零件包装代码 | - | SIMM | SIMM | SIMM | - | SIMM |
针数 | - | 72 | 72 | 72 | - | 72 |
I/O 类型 | - | COMMON | COMMON | COMMON | - | COMMON |
输出特性 | - | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
封装等效代码 | - | SSIM72 | SSIM72 | SSIM72 | - | SSIM72 |
电源 | - | 5 V | 5 V | 5 V | - | 5 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
刷新周期 | - | 4096 | 4096 | 4096 | - | 4096 |
最大待机电流 | - | 0.008 A | 0.008 A | 0.008 A | - | 0.008 A |
最大压摆率 | - | 0.88 mA | 0.96 mA | 0.88 mA | - | 0.96 mA |