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KMPC8260AZUPIBB

Microprocessors - MPU POWERQUICC II HIP4 REV B

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
NXP(恩智浦)
零件包装代码
BGA
包装说明
LBGA, BGA480,29X29,50
针数
480
Reach Compliance Code
not_compliant
ECCN代码
5A991
地址总线宽度
32
位大小
32
边界扫描
YES
最大时钟频率
66.66 MHz
外部数据总线宽度
64
格式
FLOATING POINT
集成缓存
YES
JESD-30 代码
S-PBGA-B480
JESD-609代码
e0
长度
37.5 mm
低功率模式
NO
湿度敏感等级
3
端子数量
480
最高工作温度
70 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
LBGA
封装等效代码
BGA480,29X29,50
封装形状
SQUARE
封装形式
GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)
220
电源
2.5,3.3 V
认证状态
Not Qualified
座面最大高度
1.65 mm
速度
300 MHz
最大供电电压
2.2 V
最小供电电压
1.9 V
标称供电电压
2 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
1.27 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
37.5 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR, RISC
文档预览
Freescale Semiconductor
Technical Data
Document Number: MPC8260AEC
Rev. 2.0, 06/2009
MPC8260A
PowerQUICC™ II Integrated
Communications Processor
Hardware Specifications
This document contains detailed information on power
considerations, DC/AC electrical characteristics, and AC
timing specifications for .25μm (HiP4) devices in the
PowerQUICC II™ MPC8260 communications processor
family. These devices include the MPC8260, the MPC8255,
the MPC8264, the MPC8265, and the MPC8266.
Throughout this document, these devices are collectively
referred to as the MPC826xA.
1.
2.
3.
4.
5.
6.
7.
Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical and Thermal Characteristics . . . . . . . . . . . . 7
Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 23
Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 46
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 48
Document Revision History . . . . . . . . . . . . . . . . . . . 48
© Freescale Semiconductor, Inc., 2005–2009. All rights reserved.
Features
Figure 1
shows the block diagram for the MPC8266, the HiP4 superset device. Shaded portions indicate
functionality that is not available on all devices; refer to the notes.
16 Kbytes
I-Cache
I-MMU
G2 Core
System Interface Unit
(SIU)
16 Kbytes
D-Cache
D-MMU
Bus Interface Unit
60x-to-PCI
Bridge
2,3
60x-to-Local
Bridge
Memory Controller
Timers
Parallel I/O
Baud Rate
Generators
32-bit RISC Microcontroller
and Program ROM
IMA
1,3
60x Bus
PCI Bus
2,3
32 bits, up to 66 MHz
or
Local Bus
32 bits, up to 83 MHz
Communication Processor Module (CPM)
Interrupt
Controller
32 Kbytes
Dual-Port RAM
Serial
DMAs
4 Virtual
IDMAs
Clock Counter
System Functions
Microcode
4
4
MCC1
MCC2
FCC1
FCC2
FCC3
SCC1
SCC2
SCC3
SCC4
SMC1
SMC2
SPI
I
2
C
TC Layer Hardware
1,3
Time Slot Assigner
Serial Interface
8 TDM Ports
5
3 MII
Ports
6
2 UTOPIA
Ports
Non-Multiplexed
I/O
Notes:
1
MPC8264
2
MPC8265
3
MPC8266
4
5
Not on MPC8255
4 TDM ports on the MPC8255
6
2 MII ports on the MPC8255
Figure 1. MPC8266 Block Diagram
1
Features
The major features of the MPC826xA family are as follows:
• Dual-issue integer core
— A core version of the EC603e microprocessor
— System core microprocessor supporting frequencies of 150–300 MHz
— Separate 16-Kbyte data and instruction caches:
– Four-way set associative
– Physically addressed
– LRU replacement algorithm
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
2
Freescale Semiconductor
Features
— PowerPC architecture-compliant memory management unit (MMU)
— Common on-chip processor (COP) test interface
— High-performance (6.6–7.65 SPEC95 benchmark at 300 MHz; 1.68 MIPs/MHz without
inlining and 1.90 Dhrystones MIPS/MHz with
— Supports bus snooping for data cache coherency
— Floating-point unit (FPU)
Separate power supply for internal logic and for I/O
Separate PLLs for G2 core and for the CPM
— G2 core and CPM can run at different frequencies for power/performance optimization
— Internal core/bus clock multiplier that provides 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
— Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
64-bit data and 32-bit address 60x bus
— Bus supports multiple master designs
— Supports single- and four-beat burst transfers
— 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
— Supports data parity or ECC and address parity
32-bit data and 18-bit address local bus
— Single-master bus, supports external slaves
— Eight-beat burst transfers
— 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
60x-to-PCI bridge (MPC8265 and MPC8266 only)
— Programmable host bridge and agent
— 32-bit data bus, 66 MHz, 3.3 V
— Synchronous and asynchronous 60x and PCI clock modes
— All internal address space available to external PCI host
— DMA for memory block transfers
— PCI-to-60x address remapping
System interface unit (SIU)
— Clock synthesizer
— Reset controller
— Real-time clock (RTC) register
— Periodic interrupt timer
— Hardware bus monitor and software watchdog timer
— IEEE Std. 1149.1™ standard JTAG test access port
Twelve-bank memory controller
— Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other user-
definable peripherals
— Byte write enables and selectable parity generation
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
Freescale Semiconductor
3
Features
— 32-bit address decodes with programmable bank size
— Three user programmable machines, general-purpose chip-select machine, and page-mode
pipeline SDRAM machine
— Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local)
— Dedicated interface logic for SDRAM
CPU core can be disabled and the device can be used in slave mode to an external core
Communications processor module (CPM)
— Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support
for communications protocols
— Interfaces to G2 core through on-chip 32-Kbyte dual-port RAM and DMA controller
— Serial DMA channels for receive and transmit on all serial channels
— Parallel I/O registers with open-drain and interrupt capability
— Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers
— Three fast communications controllers supporting the following protocols (only FCC1 and
FCC2 on the MPC8255):
– 10/100-Mbit Ethernet/IEEE Std. 802.3® CDMA/CS interface through media independent
interface (MII)
– ATM—Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5, AAL1,
AAL0 protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 16 K external
connections
– Transparent
– HDLC—Up to T3 rates (clear channel)
— Two multichannel controllers (MCCs) (only MCC2 on the MPC8255)
– Each MCC handles 128 serial, full-duplex, 64-Kbps data channels.Each MCC can be split
into four subgroups of 32 channels each.
– Almost any combination of subgroups can be multiplexed to single or multiple TDM
interfaces up to four TDM interfaces per MCC
— Four serial communications controllers (SCCs) identical to those on the MPC860, supporting
the digital portions of the following protocols:
– Ethernet/IEEE 802.3 CDMA/CS
– HDLC/SDLC and HDLC bus
– Universal asynchronous receiver transmitter (UART)
– Synchronous UART
– Binary synchronous (BISYNC) communications
– Transparent
— Two serial management controllers (SMCs), identical to those of the MPC860
– Provide management for BRI devices as general circuit interface (GCI) controllers in time-
division-multiplexed (TDM) channels
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
4
Freescale Semiconductor
Features
– Transparent
– UART (low-speed operation)
One serial peripheral interface identical to the MPC860 SPI
One inter-integrated circuit (I
2
C) controller (identical to the MPC860 I
2
C controller)
– Microwire compatible
– Multiple-master, single-master, and slave modes
Up to eight TDM interfaces (four on the MPC8255)
– Supports two groups of four TDM channels for a total of eight TDMs
– 2,048 bytes of SI RAM
– Bit or byte resolution
– Independent transmit and receive routing, frame synchronization
– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN
primary rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and
user-defined TDM serial interfaces
Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs,
SCCs, SMCs, and serial channels
Four independent 16-bit timers that can be interconnected as two 32-bit timers
Additional features of the MPC826xA family are as follows:
• CPM
— 32-Kbyte dual-port RAM
— Additional MCC host commands
— Eight transfer transmission convergence (TC) layers between the TDMs and FCC2 to support
inverse multiplexing for ATM capabilities (IMA) (MPC8264 and MPC8266 only)
• CPM multiplexing
— FCC2 can also be connected to the TC layer.
• TC layer (MPC8264 and MPC8266 only)
— Each of the 8 TDM channels is routed in hardware to a TC layer block
– Protocol-specific overhead bits may be discarded or routed to other controllers by the SI
– Performing ATM TC layer functions (according to ITU-T I.432)
– Transmit (Tx) updates
- Cell HEC generation
- Payload scrambling using self synchronizing scrambler (programmable by the user)
- Coset generation (programmable by the user)
- Cell rate by inserting idle/unassigned cells
– Receive (Rx) updates
- Cell delineation using bit by bit HEC checking and programmable ALPHA and DELTA
parameters for the delineation state machine
- Payload descrambling using self synchronizing scrambler (programmable by the user)
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
Freescale Semiconductor
5
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