SIP Sockets
Table of Models
SIP Sockets
Molded and Peel-A-Way
Description:
Peel-A-Way
®
(KSS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
®
.005 Typ.
(.127)
Description:
Molded Snap Strips (RSS, RLSS)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.030 Typ.
(.76)
.095 Typ.
(2.41)
.095 Typ.
(2.41)
Head Above
Plastic
Head Flush
with Plastic
.095 Typ.
(2.41)
Features:
• Available in three body types:
Peel-A-Way
®
Removable Terminal
Carriers, molded Solid Strips, and
molded Snap Strips [breakable at
.100/(2.54mm)].
• Tapered entry for ease of
insertion.
• Multiple finger contacts for
reliability.
• Closed bottom sleeve for 100%
anti-wicking of solder.
Description:
Molded Solid Strips (RNB, RLNB)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.030 Typ.
(.76)
.095 Typ.
(2.41)
Head Above
Plastic
Head Flush
with Plastic
RSS/RLSS replaces HSS/HLSS and SS/LSS
RNB/RLNB replaces HNB/HLNB and NB/LNB
Options
Tape Sealant - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
KSS
Body Type
RoHS Compliant:
032
-85
M
G
Contact Plating
RoHS Compliant:
KSS - Peel-A-Way
RSS - Molded Snap (head above)
RLSS - Molded Snap (head flush)
RNB - Molded Solid (head above)
RLNB - Molded Solid (head flush)
Number of Pins
KSS: 2-100 pos.
RSS/RLSS: 20, 30 or 32 pos.
RNB/RLNB: 3-20, 30 or 32 pos.
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
22
inch/(mm)
SIP Sockets
Molded and Peel-A-Way
Type -51
.072 Dia.
(1.83)
®
SIP Sockets
Additional standard and custom terminals available.
See Terminals section online or consult factory.
Type -49
Not for use with head above
Standard Quick-Turn Terminals
.072 Dia.
(1.83)
Type -04
Type -01
Molded only
.072 Dia.
(1.83)
.072 Dia.
(1.83)
.120
(3.05)
.130
(3.30)
.095
(2.41)
.021 Hole
(.53) Dia.
.145
(3.68)
.165
(4.19)
.110
(2.79)
.020 Dia.
(.51)
.028 Dia.
(.71)
.110
(2.79)
.095
(2.41)
.028 Dia.
(.71)
.125
(3.18)
.020 Dia.
(.51)
Type -33
Peel-A-Way
®
only
.072 Dia.
(1.83)
Type -85
Peel-A-Way
®
only
.058 Dia.
(1.47)
Type -176
Peel-A-Way
®
only
.058 Dia.
(1.47)
Type -210
Peel-A-Way
®
only
.058 Dia.
(1.47)
.165
(4.19)
.031
(.79)
.155
(3.94)
.031
(.79)
.155
(3.95)
.015
(.38)
Surface Mount Applications:
.155
(3.94)
.125
(3.18)
.020 Dia.
(.51)
.038 Dia.
(.97)
.034 Dia.
(.86)
.034 Dia.
(.86)
PC Board
Peel-A-Way
®
Surface Mount Sockets
Solder Preform Terminals
Tin/Lead: Type -150
Lead-free: Type -811
.072 Dia.
(1.83)
PC Board
Tin/Lead: Type -111
Lead-free: Type -810
Peel-A-Way
®
only
.072 Dia.
(1.83)
.130
(3.30)
.058 Dia.
(1.47)
Tin/Lead: Type -151
Lead-free: Type -812
Surface Mount Top/Bottom
.165
(4.19)
Solder
Preform
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
Solder
Preform
.031
(.79)
.155
(3.94)
Features:
• Sockets surface mount to PCB.
• Suppplied in high temperature
Peel-A-Way
®
socket terminal
carrier.
• Peel-A-Way
®
carrier can be left in
place for added stability.
.110
(2.79)
.020 Dia.
(.51)
.038 Dia.
(.97)
Intrusive Reflow Application
• Combines the labor of socket loading and solder
application into one operation.
• Eliminates the use of solder paste and screening
operation.
• Eliminates solder bridges and/or solder shorts
due to excess solder.
• Ensures a reliable solder joint with controlled
solder volume.
Solder Preform
• High reliability screw-machined
terminals with multiple finger
beryllium copper contacts.
• Available with solder preforms.
Available Online:
• RoHS Qualification Test Report
• Ideal for surface mount and mixed technology
applications.
• For custom solder preform terminal applications
consult factory.
PC Board
Preform After
Solder Flow
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
23
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
嵌入式系统
