LESHAN RADIO COMPANY, LTD.
Switching diode
•
Applications
High speed switching
•
Features
1) Extremely small surface mounting type.
2) High Speed.
3) High reliability.
•
Construction
Silicon epitaxial planar
•
We declare that the material of product
compliance with RoHS requirements.
•
S- Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change
Requirements; AEC-Q101 Qualified and PPAP
Capable.
L1SS400GT1G
S-L1SS400GT1G
1
2
SOD -
723
1
CATHODE
2
ANODE
ORDRING INFORMATION
Device
L1SS400GT1G
Marking
3
Shipping
4000/Tape&Reel
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
Parameter
Peak reverse voltage
DC reverse voltage
Peak forward current
Mean rectifying current
Surge current (1s)
Junction temperature
Storage temperature
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance
Junction-to-Ambient
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
Parameter
Symbol
Min.
Forward voltage
Reverse current
Diode capacitance
Reverse recovery time
V
F
I
R
C
D
t
rr
–
–
–
–
R
θ
JA
Symbol
V
RM
V
R
I
FM
I
O
I
surge
Tj
T
stg
P
D
Limits
90
80
225
100
500
150
– 55 ~ +150
150
1.2
833
Unit
V
V
mA
mA
mA
°C
°C
mW
mW/°C
°C/W
Typ.
–
–
0.72
–
Max.
1.2
0.1
3.0
4
Unit
V
µA
pF
ns
Conditions
I
F
=100mA
V
R
=80V
V
R
=0.5V , f=1MHz
VR
=6V , I
F
=10mA , R
L
=100
Rev.A 1/3
LESHAN RADIO COMPANY, LTD.
L1SS400GT1G,S-L1SS400GT1G
ELECTRICAL CHARACTERISTIC CURVES
(Ta = 25°C)
1000
10
FORWARD CURRENT:IF(mA)
100
REVERSE CURRENT :IR(uA)
1
10
0.1
1
0.01
0.1
0.1
0.001
0.3
0.5
0.7
0.9
1.1
0
20
40
60
80
100
120
FORWARD VOLTAGE:VF(V)
-55℃
25℃
75℃
100℃
125℃
-55℃
REVERSE VOLTAGE:VR(V)
25℃
75℃
100℃
125℃
Fig.1 FORWARD CHARACTERISTICS
Fig.2 REVERSE CHARACTERISTICS
0.9
f=1MHz
0.8
DIODE CAPACITANCE : CD (pF)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
2
4
6
8
10
12
14
REVERSE VOLTAGE:VR(V)
Fig.3 VR-CD CHARACTERISTICS
Rev.A 2/3
LESHAN RADIO COMPANY, LTD.
L1SS400GT1G,S-L1SS400GT1G
SOD−723
D
−X−
−Y−
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM
A
b
c
D
E
H
E
L
MILLIMETERS
INCHES
MIN
NOM MAX MIN
NOM MAX
0.49
0.52
0.55
0.019 0.020 0.022
0.25
0.28
0.32 0.0098 0.011 0.013
0.08
0.12
0.15 0.0032 0.0047 0.0059
0.95
1.00
1.05
0.037 0.039 0.041
0.55
0.60
0.65
0.022 0.024 0.026
1.35
1.40
1.45
0.053 0.055 0.057
0.15
0.20
0.25
0.006 0.0079 0.010
b
2X
0.08 (0.0032) X Y
A
c
L
H
E
SOLDERING FOOTPRINT*
1.1
0.043
0.45
0.0177
0.50
0.0197
SCALE 10:1
mm
inches
Rev.A 3/3
