FERRITE CHIP INDUCTORS
1. PART NO. EXPRESSION :
L3 SERIES
(c) Tolerance code : K = ± 10%, M = ± 20%
(g) 10: Standard
11 ~ 99 : Internal control number
L 3 - 4 7 N K -
□□
(a)
(b)
(c)
(d)
(a) Series code
(b) Inductance code : 47N = 0.047uH
2. CONFIGURATION & DIMENSIONS :
A
D
B
L
C
G
Recommended PC Board Pattern
Unit:m/m
A
2.00± 0.20
B
C
D
G
1.00 Ref.
H
1.00 Ref.
L
3.00 Ref.
1.25± 0.20 0.85± 0.20 1.25± 0.20 0.50± 0.30
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
26.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP INDUCTORS
6. ELECTRICAL CHARACTERISTICS :
Dim. C
( mm )
± 0.2
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
1.25
1.25
1.25
1.25
0.85
0.85
0.85
0.85
0.85
1.25
1.25
1.25
1.25
1.25
Inductance
(
μH
)
0.047
0.068
0.082
0.100
0.120
0.150
0.180
0.220
0.270
0.330
0.390
0.470
0.560
0.680
0.820
1.000
1.200
1.500
1.800
2.200
2.700
3.300
3.900
4.700
10.000
Q
Min.
15
15
15
20
20
20
20
20
20
20
25
25
25
25
25
45
45
45
45
45
45
45
45
45
45
Test
Frequency
( MHz )
50
50
50
25
25
25
25
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
2
SRF
( MHz )
Min.
320
280
255
235
220
200
185
170
150
145
135
125
115
105
100
75
65
60
55
50
45
41
38
35
24
L3 SERIES
DC Resistance
(
Ω
)
Max.
0.20
0.20
0.20
0.30
0.30
0.40
0.40
0.50
0.50
0.55
0.65
0.65
0.75
0.80
1.00
0.40
0.50
0.50
0.60
0.65
0.75
0.80
0.90
1.00
1.15
Rated Current
( mA )
Max.
300
300
300
250
250
250
250
250
250
250
200
200
150
150
150
50
50
50
50
30
30
30
30
30
15
Part Number
L3-47N□-10
L3-68N□-10
L3-82N□-10
L3-R10□-10
L3-R12□-10
L3-R15□-10
L3-R18□-10
L3-R22□-10
L3-R27□-10
L3-R33□-10
L3-R39□-10
L3-R47□-10
L3-R56□-10
L3-R68□-10
L3-R82□-10
L3-1R0□-10
L3-1R2□-10
L3-1R5□-10
L3-1R8□-10
L3-2R2□-10
L3-2R7□-10
L3-3R3□-10
L3-3R9□-10
L3-4R7□-10
L3-100□-10
Inductance tolerance :
□
: K : ±10%
L : ± 15%
M : ± 20%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP INDUCTORS
7. IMPEDANCE VS. FREQUENCY CURVES :
L3 SERIES
L vs IDC
FCI2012F-Series L vs IDC.
1 00
Inductance(uH)
10
100
4R7
1R2
1
R12
0.1
1
10
100
1 000
DC Current(mA)
Q vs Freq.
FCI2012F-Series Q vs Freq.
120
100
80
100
4R7
R10
1R0
Q
60
40
20
0
1
10
100
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP INDUCTORS
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
3.00
1.00
L3 SERIES
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
1.00
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
8-2.2 Soldering Iron :
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150° C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350° C tip temperature for Ferrite chip bead (max)
c) Never contact the ceramic with the iron tip
f) Limit soldering time to 4-5 secs.
Preheating
Soldering
20~40s
TP(26 0° C/40 s max.)
217
200
150
60~180s
4 80s max.
25
TEMPERATURE ° C
TEMPERATURE ° C
Natural
cooling
Preheating
350
Soldering
Natural
cooling
150
60~150s
Time(sec.)
Figure 1. Re-flow Soldering:3 times max
O ve r 60s.
G rad ual
Cooling
Within4 ~5s
Figure 2. Wave Soldering:1 times max
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
FERRITE CHIP INDUCTORS
L3 SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
ReC0mmendable
t
Figure 3
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
