HIGH CURRENT MOLDED POWER INDUCTORS
L825HW SERIES
1. PART NO. EXPRESSION :
L825HW-1R0MF
(a)
(b)
(c)
(d)(e)
(a) Series code
(b) Type code
(c) Inductance code : 1R0 = 1.0uH
(d) Tolerance code : M = ±20%
(e) F : Lead Free
2. CONFIGURATION & DIMENSIONS :
A'
A
C'
C
D
L
G
SWORLD
1R5
B
B'
E
PCB Pattern
Unit:m/m
A'
7.8 Max.
A
6.86±0.5
B'
7.0 Max.
B
6.47±0.5
C'
5.2 Max.
C
5.0 Max.
D
1.6±0.5
E
2.1±0.5
G
3.7 Ref.
H
3.5 Ref.
L
8.7 Ref.
3. SCHEMATIC :
4. MATERIALS :
a
b
(a) Core
(b) Wire
(c) Terminal
c
5. FEATURES :
a) Shielded Construction
b) Frequency up to 5MHz
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT MOLDED POWER INDUCTORS
L825HW SERIES
6. GENERAL SPECIFICATION :
a) Test Freq. : 100KHz/0.25VDC
b) Ambient Temp. : 20°C
c) Operating Temp. : -55°C to +125°C
d) Storage Temp. : -55°C to +125°C
e) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately T=40°C without core loss.
f) Saturation Current (Isat) : Will cause L
0
to drop approximately 20% typ.
g) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions.
7. ELECTRICAL CHARACTERISTICS :
Inductance L
0
( µH )
±20% @ 0 Adc
0.56
0.68
0.82
1.0
1.5
2.2
3.3
4.7
5.6
6.8
8.2
10
Irms
(A)
Typ.
20
18
16.5
13
12
10
8
6.5
6
5.8
5.5
4.5
Isat
(A)
Typ.
21
19
18
15
14
10
9
8
7
6.5
6
5
DCR
(m )
Max.
3.6
4.5
4.9
6.5
9.0
13.6
20.9
30.3
34.4
44.6
45.6
71.3
Part No.
L825HW-R56MF
L825HW-R68MF
L825HW-R82MF
L825HW-1R0MF
L825HW-1R5MF
L825HW-2R2MF
L825HW-3R3MF
L825HW-4R7MF
L825HW-5R6MF
L825HW-6R8MF
L825HW-8R2MF
L825HW-100MF
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
HIGH CURRENT MOLDED POWER INDUCTORS
L825HW SERIES
8. CORE LOSS :
100KHz and 500KHz
40000
material
30000
gauss loss
100
200
100KHz
500KHz
-
-
351.7
665.9
1,039
1,471
1,923
2,537
3,148
3,902
266
1,234
2,932
5,195
8,336
12,025
15,715
20,444
25,429
31,002
KW
3
3
K /m
m
W
/
20000
300
400
500KHZ
500
600
700
100KHZ
10000
800
800
1000
0
0
200
400
600
900
1000
gauss
gauss
100KHz
4000
material
3000
gauss loss
300
400
500
600
100KHz
K W
/
/
3
3
K m
W
m
351.7
665.9
1,039
1,471
1,923
2,537
3,148
3,902
2000
1000
700
800
900
400
600
800
1000
0
200
gau ss
gauss
1000
500KHz
40000
30000
K
/
/
K
W
3
m
W
m
3
20000
10000
0
0
200
400
g au ss
gauss
600
800
1000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
HIGH CURRENT MOLDED POWER INDUCTORS
L825HW SERIES
9. RELIABILITY AND TEST CONDITION :
ITEM
Electrical Characteristics Test
Inductance
DCR
Heat Rated Current (Irms)
Saturation Current (Isat)
Mechanical Performance Test
Solderability Test
PERFORMANCE
Refer to standard electrical characteristics list
TEST CONDITION
HP4284A, CH11025, CH3302, CH1320, CH1320S
LCR meter.
CH16502, Agilent33420A Micro-Ohm Meter.
Irms(A) will cause the coil temperature rise
approximately T=40°C without core loss
Isat(A) will cause Lo to drop approximately 20%.
More than 90% of the terminal electrode
should be covered with solder.
230°C
Preheating
Dipping
Natural
cooling
150°C
60
seconds
4±1
seconds
After fluxing components shall be dipped in a melted
solder bath at 230±5°C for 4 seconds.
Solder Heat Resistance
1. Components should have no evidence of
electrical & mechanical damage.
2. Inductance : Within ±20% of initial value.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Preheating
260°C
Dipping
Natural
cooling
150°C
60
seconds
10±0.5
seconds
Reliability Test
High Temperature
Life Test
Temperature : 125±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Temperature : -40±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Conditions of 1 cycle.
Step
1
2
3
4
Temperature (°C)
-55±3
Room Temperature
125±3
Room Temperature
Times (min.)
30±3
Within 3
30±3
Within 3
Low Temperature
Life Test
Thermal Shock
Total : 5 cycles
Measure at room temperature after placing for 2 to 3 hrs.
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Curent
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH CURRENT MOLDED POWER INDUCTORS
L825HW SERIES
10. SOLDERIND AND MOUNTING :
10-1. Recommended PC Board Pattern
2.5
3.7
2.5
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
10-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
10-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
10-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating
TEMPERATURE °C
250~260
230
180
150
60~120s
Soldering
3.5
TEMPERATURE °C
10s max.
Natural
cooling
Preheating
280
260
150
Soldering
Natural
cooling
30~60s
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
