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LC0408FC12C-T710-2

Trans Voltage Suppressor Diode, 200W, 12V V(RWM), Bidirectional, 7 Element, Silicon, DO-201, FLIP CHIP-8

器件类别：分立半导体    二极管   

厂商名称：ProTek Devices

厂商官网：http://www.protekdevices.com/

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参数 预览 参数对比
器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
ProTek Devices
零件包装代码
DO-201
包装说明
R-PBGA-B8
针数
2
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
LOW CAPACITANCE
最小击穿电压
13.3 V
外壳连接
ISOLATED
最大钳位电压
26.9 V
配置
COMMON BIPOLAR TERMINAL, 7 ELEMENTS
二极管元件材料
SILICON
二极管类型
TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码
DO-201
JESD-30 代码
R-PBGA-B8
JESD-609代码
e0
湿度敏感等级
1
最大非重复峰值反向功率耗散
200 W
元件数量
7
端子数量
8
最高工作温度
150 °C
最低工作温度
-55 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
GRID ARRAY
峰值回流温度（摄氏度）
245
极性
BIDIRECTIONAL
最大功率耗散
5 W
认证状态
Not Qualified
最大重复峰值反向电压
12 V
表面贴装
YES
技术
AVALANCHE
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
文档预览
05153
LC0408FC3.3C
thru
Only One Name Means ProT
ek’Tion™
LC0408FC24C
LOW CAPACIT
ANCE FLIP CHIP ARRA
Y
APPLICA
TIONS
✔
Cellular Phones
✔
Personal Digital Assistant (PDA)
✔
Notebook Computers
✔
SMART Cards
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
ESD Protection > 25 kilovolts
✔
Available in Six Voltage Types Ranging From 3.3V to 24V
✔
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔
Low Clamping Voltage
✔
Bidirectional Configuration & Monolithic Structure
✔
Protects 4 to 7 Lines
✔
LOW CAPACITANCE
✔
LOW LEAKAGE CURRENT
MECHANICAL CHARACTERISTICS
✔
Standard EIA Chip Size: 0408
✔
Weight 0.73 milligrams (Approximate)
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
✔
Top Contacts: Solder Bump 0.004” in Height (Nominal)
0408
(Single Chip Shown)
PIN CONFIGURA
TION
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LC0408FC3.3C
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LC0408FC24C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
J
T
STG
VALUE
200
-55°C to 150°C
-55°C to 150°C
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
11.0
13.2
19.8
25.4
37.2
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
µA
75*
10**
1
1
1
1
TYPICAL
CAPACITANCE
V
WM
VOLTS
LC0408FC3.3C
LC0408FC05C
LC0408FC08C
LC0408FC12C
LC0408FC15C
LC0408FC24C
3.3
5.9
8.0
12.0
15.0
24.0
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
@8/20µs
V
C
@ I
PP
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
@0V, 1 MHz
C
pF
70
35
32
30
25
20
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
200W, 8/20µs Waveform
100
e
-t
t
d
= t I /2
PP
10
0.01
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
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LC0408FC3.3C
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LC0408FC24C
GRAPHS
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
225°C
5-10 sec
60
200°C
Instantaneous
to 200°C
100
80
% Of Rated Power
FIGURE 4
REFLOW SOLDER PROFILE
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
Pre-Heat
Time
Soldering
Time
Cool Down
Time
100°C
1-2 Minutes
to 150°C
1-2 Minutes to 25°C
Note:
This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR LC0408FC05C
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0408FC05C
14
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
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15
20
V
C
- Clamping Voltage - Volts
LC0408FC3.3C
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LC0408FC24C
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
DIM
A
B
C
E
SIDE
MILLIMETERS
0.56 NOM
0.86 NOM
0.99 ± 0.0254
0.15 SQ
2.0 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
INCHES
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.079 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
TOP
F
G
H
A
B
C
G
I
E
F
H
0.406 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
END
I
MOUNTING PAD LA
YOUT - Option 1
DIM
D
C
A
DIE
SOLDER
BUMP
PAD DIMENSIONS
MILLIMETERS
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
A
C
D
E
F
G
H
I
NOTE:
E
H
G
1.
Preferred:
Using 0.1mm (0.004”) stencil.
I
SOLDER PADS
SOLDER PRINT 0.010” - 0.012” DIA.
SOLDER
MASK
F
Outline & Dimensions: Rev 4 - 2/04, 06021
05153.R4 2/04
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LC0408FC3.3C
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LC0408FC24C
PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LA
YOUT - Option 2
PACKAGE DIMENSIONS
DIM
A
F
MILLIMETERS
0.51
0.15 SQ
0.71
0.99
0.51
INCHES
0.020
0.006 SQ
0.028
0.039
0.020
COPPER CONTACT 0.009” [0.23] DIA.
A
DIE
SOLDER
BUMP
G
H
I
H
G
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3.
Preferred:
Using 0.1mm (0.004”) stencil.
I
Outline & Dimensions: Rev 4 - 2/04, 06021
T
APE & REEL ORIENT TION
A
SOLDER PRINT 0.014” [0.36] DIA.
SOLDER
MASK
F
Quad Die - 0408
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., LC0408FC05C-T75-1).
3.
8mm Paper Tape:
7 Inch Reels -5,000
pieces per reel. Ordering Suffix: -T710-2
(i.e., LC0408FC05C-T710-2).
COPYRIGHT © ProTek Devices 2004
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
05153.R4 2/04
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参数对比
与LC0408FC12C-T710-2相近的元器件有：LC0408FC08C-T710-2、LC0408FC24C-T710-2、LC0408FC05C-T710-2、LC0408FC15C-T710-2、LC0408FC3.3C-T710-2。描述及对比如下：
型号 LC0408FC12C-T710-2 LC0408FC08C-T710-2 LC0408FC24C-T710-2 LC0408FC05C-T710-2 LC0408FC15C-T710-2 LC0408FC3.3C-T710-2
描述 Trans Voltage Suppressor Diode, 200W, 12V V(RWM), Bidirectional, 7 Element, Silicon, DO-201, FLIP CHIP-8 Trans Voltage Suppressor Diode, 200W, 8V V(RWM), Bidirectional, 7 Element, Silicon, DO-201, FLIP CHIP-8 Trans Voltage Suppressor Diode, 200W, 24V V(RWM), Bidirectional, 7 Element, Silicon, DO-201, FLIP CHIP-8 Trans Voltage Suppressor Diode, 200W, 5.9V V(RWM), Bidirectional, 7 Element, Silicon, DO-201, FLIP CHIP-8 Trans Voltage Suppressor Diode, 200W, 15V V(RWM), Bidirectional, 7 Element, Silicon, DO-201, FLIP CHIP-8 Trans Voltage Suppressor Diode, 200W, 3.3V V(RWM), Bidirectional, 7 Element, Silicon, DO-201, FLIP CHIP-8
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 DO-201 DO-201 DO-201 DO-201 DO-201 DO-201
包装说明 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8
针数 2 2 2 2 2 2
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
其他特性 LOW CAPACITANCE LOW CAPACITANCE LOW CAPACITANCE LOW CAPACITANCE LOW CAPACITANCE LOW CAPACITANCE
最小击穿电压 13.3 V 8.5 V 26.7 V 6 V 16.7 V 4 V
外壳连接 ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED
最大钳位电压 26.9 V 18 V 37.2 V 13 V 34.5 V 12.5 V
配置 COMMON BIPOLAR TERMINAL, 7 ELEMENTS COMMON BIPOLAR TERMINAL, 7 ELEMENTS COMMON BIPOLAR TERMINAL, 7 ELEMENTS COMMON BIPOLAR TERMINAL, 7 ELEMENTS COMMON BIPOLAR TERMINAL, 7 ELEMENTS COMMON BIPOLAR TERMINAL, 7 ELEMENTS
二极管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON
二极管类型 TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码 DO-201 DO-201 DO-201 DO-201 DO-201 DO-201
JESD-30 代码 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8
JESD-609代码 e0 e0 e0 e0 e0 e0
湿度敏感等级 1 1 1 1 1 1
最大非重复峰值反向功率耗散 200 W 200 W 200 W 200 W 200 W 200 W
元件数量 7 7 7 7 7 7
端子数量 8 8 8 8 8 8
最高工作温度 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度（摄氏度） 245 245 245 245 245 245
极性 BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
最大功率耗散 5 W 5 W 5 W 5 W 5 W 5 W
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大重复峰值反向电压 12 V 8 V 24 V 5.9 V 15 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL BALL BALL BALL
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
厂商名称 ProTek Devices - ProTek Devices ProTek Devices ProTek Devices ProTek Devices
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器件捷径:
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