Maxcap Series
Double Layer Capacitors
Maxcap® double layer capacitors are a new electric
energy storage device with extremely high volumet-
ric efficiency (over five farads/in3), virtually unlim-
ited service life, fast charge/discharge capability and
very low leakage current.
A Maxcap DLC the size of a thimble will support
microamp data retention currents of CMOS RAMs
for up to several weeks, Microprocessors, small
motors and activators having current requirements
from one to several hundred milliamps can be sup-
ported from several seconds to minutes.
Conventional energy storage devices such as
batteries and aluminum electrolytic capacitors
often must be replaced during the life of a product.
Maxcap DLCs never need replacing because, unlike
batteries, they do not undergo life-limiting, irrevers-
ible, chemical reactions, and, unlike aluminum elec-
trolytic capacitors, they do not experience dry-up
problems.
The high capacitance of Maxcap DLCs results
from an electric double layer formed at the inter-
face of high surface area activated carbon and a
stable electrolyte. Unit cells are formed by separat-
ing two carbon/electrolyte wafers with an ionically
conductive porous separator and sandwiching them
between two electrically conductive, ionically imper-
meable membranes. The unit cells are stacked in
series to achieve the desired capacitor voltage.
CAUTION: Due to their relatively high internal
resistance, Maxcap DLCs should not be subjected to
large ripple currents.
F e at u r e S
• High Energy Density Capacitors for Memory
Backup and Data Transmission Power
• New LM Surface Mount Product Series
• Very high capacity in small size: Up to 100 times
that of conventional capacitors.
• Useful voltage ratings: 3.5 and 5.5 volt – Ideal for
CMOS operating voltage range. 11 volt – LV Series,
backup for relays, actuators, small motors.
• Full range of sizes: From 0.01 to 5.6 farads @ 5.5
volts; 0.47, 1.0 and 5.0 farads @ 11 volts.
• Low profile with LP, LJ and LK Series
• Ultra long life: Unlike batteries, Maxcap DLCs have
no parasitic chemical reactions. They can be fully
charged and discharged indefinitely. There is no
“memory” effect.
• One Farad in a 0.65"x 0.75" Package
• Up to 5.6 Farads in a 5.5 Volt Package
• Up to 5.0 Farads in an 11.0 Volt Package
a p p l i c at i o n S
• CMOS; RAMS and microprocessors, Timers for
Integrated Cicuits: Home appliances such as TVs,
microwave ovens, dishwashers, and refrigerators;
utility meters, personal computers, energy manage-
ment controls, thermostats, point of sale terminals,
process controllers, routers.
• Relays, Solenoids: Starters, igniters, actuators
• Small Motors, Alarms: Disc drives, coin metering
devices, security systems, toys.
• Data Transmission: Vehicle tracking systems, utility
meters.
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1
Ceramic Resistor Division
Maxcap Series
Double Layer Capacitors
S p e c i F i c at i o n S
Max. Charge
Current after
Capacitance Max. ESR Typical ESR
30 min.
Part
(farads) (Ω @1kHz) (Ω @1kHz)
(mA)
LP055223A 0.022
60
10–20
0.033
LP055473A 0.047
40
7–14
0.071
LP055104A 0.1
25
4–10
0.15
LP055224A 0.22
25
5–10
0.33
LP055474A 0.47
13
2–5
0.71
LP055105A 1.0
7
1–3
1.50
LC055223A
LC055473A
LC055104A
LC055224A
LC055474A
LC055105A
LC055145A
LC055225A
LK055223A
LK055473A
LK055104A
LK055224A
LK055474A
LK055105A
0.022
0.047
0.10
0.22
0.47
1.0
1.4
2.2
0.022
0.047
0.1
0.22
0.47
1.0
220
220
100
120
65
35
45
35
200
100
50
60
35
20
40–80
40–80
20–40
20–50
10–25
5–15
5–20
5–15
80-120
20-40
10-25
10-25
5-15
2-7
0.033
0.071
0.15
0.33
0.71
1.5
2.1
3.3
0.033
0.071
0.15
0.33
0.71
1.50
LT055223A
LT055473A
LT055104A
LT055224A
LT055474A
LT055105A
LF055473A
LF055104A
LF055224A
LF055474A
LF055105A
LF055155A
0.022
0.047
0.1
0.22
0.47
1.0
0.047
0.1
0.22
0.47
1.0
1.5
220
110
150
180
100
60
14
6.50
3.5
1.8
1.0
0.6
80–120
20–50
20–50
25–60
10–25
5–15
4-7
2-4
1-3
0.5-1.0
0.3-0.6
0.2-0.4
0.033
0.071
0.15
0.33
0.71
1.50
0.071
0.15
0.33
0.71
1.50
2.3
Weight,
typ. (g)
1.6 • Very low ESR: As low as 0.3, typical
2.6 • As low as 0.3, typical For short time, high current
(up to amps)
4.1
5.3 • High energy density: One farad in 1.44" x 0.73"
package
10
• Up to 1.5 farads in single package
18
• Typ.** Long Charge Leakage Current: 1–25μa
• Operating temp.: -25˚C to +70˚C
• Storage temp: -40˚C to +85˚C
1.6 • Reduced diameter, high energy density, low
leakage current
1.7
2.4 • Several weeks (microamps)
4.3 • Small diameter
6.0 • Very high energy density One farad in 0.85" x
0.63" Up to 2.2 farads in single package
11.0
12.1 • Low self discharge rate
23.1 • Typ.** Long Charge Leakage Current: 0.1–6μa
• Operating temp.: -25°C to +70°C
• Storage temp.: -40°C to +85°C
1.5 • Reduced height, high energy density, low
leakage current
2.1
3.3 • Several weeks (microamps)
3.7 • Low profile
7.1 • Very high energy density One farad in 1.12" x
0.44" package
13.7
• Low self discharge rate
• Typ.** Long Charge Leakage Current: 0.1–4μa
• Operating temp.: -25°C to +70°C
• Storage temp.: -40°C to +85°C
2.3 • Expanded temperature range, low leakage
current
3.9
4.3 • Several weeks (microamps)
5.3 • Expanded temperature range (Oper.: -40°C to
+85°C; Storage: -40°C to +85°C)
7.5
13.3 • High energy density One farad in 0.85" x 0.87"
package
• Typ.** Long Charge Leakage Current: 0.1–4μa
3.8
4.8
9.7
16
38
72
• Very low ESR
• For short time, high current (up to amps)
• Very low ESR As low as 0.3, typical
• High energy density One farad in 1.44" x 0.73"
package Up to 1.5 farads in single package
• Typical** Long Charge Leakage Current: 1–25μa
• Operating temp.: -25°C to +70°C
• Storage temp.: -40°C to +85°C
(continued)
2
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Maxcap Series
Double Layer Capacitors
S p e c i F i c at i o n S
Max. Charge
Current after
Capacitance Max. ESR Typical ESR
30 min.
Weight,
Part
(farads) (Ω @1kHz) (Ω @1kHz)
(mA)
typ. (g)
LV110474A
0.47
7
2–5
1.41
23
• Increased voltage capability, low ESR
LV110105A
1.0
7
1–3
3.0
33
• For short time, high current, high voltage (up to
milliamps)
LV110505A
5.0
4.0
0.8–2
18.0
160
• 11 volts rating Up to 5 farads in single package
• Low ESR
• Typ.** Long Charge Leakage Current: 1–4μa
• Operating temp.: -25°C to +70°C
• Storage temp.: -40°C to -85°C
LX055103A
LX055223A
LX055473A
LX055104A
LX055224A
LX055474A
LX055105A
LX055225A
LX055475A
LJ055104A
LJ055224A
LJ055474A
LJ055105A
LJ055225A
LJ055335A
LJ055565A
0.01
0.022
0.047
0.1
0.22
0.47
1
2.2
4.7
0.1
0.22
0.47
1.0
2.2
3.3
5.6
300
200
200
100
100
120
65
35
35
16
10
6.5
3.5
1.8
1.0
0.6
20-60
10-50
10-50
5-40
4-30
10-50
3-20
1-10
0.5-8
5-10
4-8
2-5
1-3
0.5-1
0.3-0.7
0.2-0.4
0.015
0.033
0.071
0.15
0.33
0.71
1.5
3.3
7.1
0.15
0.33
0.71
1.5
3.3
5.0
8.4
0.9
1.0
1.0
1.3
2.5
5.1
7.0
12.1
27.3
1.6
4.1
5.3
10.0
18.0
38.0
72.0
• Our highest energy density product, low self
discharge rate
• Several weeks (microamps)
• Our Highest Energy Density Product One farad
in 0.65" x 0.75" package Up to 4.7 farads in a
single package
• Small Diameter
• Low self discharge rate
• Typical** Long Charge Leakage Current:
• Operating temp.: -25°C to +70°C
• Storage temp.: -40°C to +85°C
• Expanded temperature range
• Low ESR
• Several weeks (microamps); For short time
(milliamps)
• Expanded temperature range (Oper.: -40°C to
+85°C; Storage: -40°C to +85°C)
• Very high energy density with low ESR One
farad in 0.85" D x 0.51" H package Up to 5.6
farads in a single package
• Low profile
• Low self discharge rate
• Typ.** Long Charge Leakage Current: 0.7–15μa
• Surface mount design, low self discharge
• Several weeks (microamps)
• Surface Mount Design
• One Farad in 0.85" x 0.85" x 0.41" package
• Low self discharge rate
• 5.5V (LM055) or 3.5V (LM035)
• Typ.** Long Charge Leakage Current: 0.5–10μa
• Operating temp.: -25°C to +70°C
LM055473A
LM055104A
LM055224A
LM055474A
LM055105A
LM035104A
LM035224A
LM035474A
0.047
0.1
0.22
0.47
1.0
0.1
0.22
0.47
50
25
25
13
7
50
25
25
10-18
8-16
6-14
3-8
3-6
10-25
6-14
6-14
0.071
0.15
0.33
0.71
1.50
0.090
0.20
0.42
1.0
1.0
1.0
3.9
6.8
1.0
1.0
1.0
* For indication of long term charging current (typical leakage current), see pages XXX.
**Charging current after 72 hours with 1000Ω resistor in series with capacitor at 25°C, see pages XXX.
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3
Ceramic Resistor Division
Maxcap Series
Double Layer Capacitors
characteriSticS
Radial Lead Products
Item Test
1. Capacitance
See test method, page xxx.
2. Capacitance Tolerance
-
3. DC Maximum Working
-
Voltage
4. Surge Voltage
Capacitors cycled from 0 to rated surge volt-
age to 0 volts 1000 times at max. operating
temperature
5. Equivalent Series
See test method, page xxx.
Resistance (ESR)
6. Maximum Charging Current
See test method, page xxx.
7. Operating Temperature
See items 11, 12, and 13 below.
8. Storage Temperature
See item 14 below
9. Lead Strength
Pull test, 1 kg for 60 seconds
10. Solderability
Soldering temperature 230°C ±5°C for 5 ±0.5
seconds
11. Thermal Stability
Temperature cycling:
LC, LF, LK, LP, LV, LX Series:
LC, LF, LK, LP, LV, LX Series: -25°C to +70°C
LJ & LT Series: –40°C to +85°C
–40°C to +85°C
No breaks
Shall cover more than 75% of lead surface
Cycle
Step 1 (+25°C)
Step 2 (–25°C)
Step 3 (+25°C)
Step 4 (+70°C)
Step 5 (+25°C)
Step 1 (+25°C)
Step 2 (–40°C)
Step 3 (+25°C)
Step 4 (+85°C)
Step 5 (+25°C)
Capacitance
ESR
+80%, –20%
5.5 VDC & 11.0 VDC
6.3 VDC & 12.6 VDC
Capacitance: ≥90%**
ESR: ≤120%**
Specification (see also product tables)
LJ & LT Series:
*
*
≥50%*** ≤+300%***
+20%***
*
≤+150%***
*
+20%***
*
*
*
≥50%*** ≤+800%***
+20***
*
≤+150%***
*
+20%***
*
12. Thermal Shock
Capacitors cycled 5 times with 30 minute exposure at each temperature with no voltage applied:
LC, LF, LK, LP, LV, LX Series: +25°C to –40°C to +25°C to +70°C to +25°C
LJ & LT Series: +25°C to 40°C to +25°C to +85°C to +25°C
13. Life
Capacitors at rated temperature and voltage for
1000 hours: LC, LF, LK, LP, LV, LX Series: Test
temperature 70°C; LJ & LT Series: Test tem-
perature 85°C
14. Storage Life
Capacitors at -40°C and +85°C for 500 hours
each with no voltage applied
Capacitance: ≥70%***
ESR: ≥+200%**
Capacitance: ≥70%***
ESR: ≥+200%**
15. Humidity
Capacitors at 90 to 95% relative humidity at 40°C for 500 hours with no voltage applied
16. Resistance to Soldering
Soldering temperature at 260°C ±10°C for 10 ±1 seconds
Heat
17. Vibration
Frequency 10–55 cycles/sec., 1.5 mm amplitude, 3 directions 2 hours each (total 6 hours)
**% of values in product tables ***% of initial measured value
4
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Maxcap Series
Double Layer Capacitors
characteriSticS
LM Surface Mount Products
Item Test
1. Capacitance
Discharge Test Method
2. Capacitance
–
Tolerance
3. DC Maximum
–
Working Voltage
4. Surge Voltage
Capacitors cycled from 0 to rated
surge voltage through charge resistor
to 0 volts 1000 times at max. operat-
ing temperature
5. Equivalent Series
See test method, page XXX
Resistance (ESR)
6. Maximum
See test method, page XXX.
Charging Current
7. Operating
See items 8, 9, and 10 below.
Temperature
–25°C to +70°C
+80%, –20%
5.5 VDC & 3.5 VDC
6.3 VDC & 4.0 VDC (3.5 V products)
Capacitance: ≥90%**
ESR: ≤120%**
Specification
(see also product tables)
8. Thermal Stability
Temperature cycling: +25°C to –25°C to +25°C to +70°C to +25°C
9. Thermal Shock
Capacitors cycled 5 times with 30 minute exposure at each temperature
with no voltage applied: +25°C to –40°C to +25°C to +70°C to +25°C
10. Life
Capacitors at rated temperature and
voltage for 1000 hours: Test tempera-
ture 70°C
Capacitance : ≥70%***
ESR: ≥+200%**
11. Humidity
Capacitors at 90 to 95% relative humidity at 40°C for 500 hours with no
voltage applied
12. Resistance to
Temperature at 260°C ±10°C for 10 ±1 seconds*
Soldering Heat
13. Vibration
Frequency 10–55 cycles/sec., 1.5 mm amplitude, 3 directions 2 hours each
(total 6 hours)
**% of values in product tables ***% of initial measured value
LM Surface Mount Solder Reflow Recommendations
The LM Series capacitor is designed for use in Infrared or
Vapor Phase Convection solder reflow processes. The chart
at right indicates typical time-temperature conditions for
these processes.
Recognizing that a wide range of time and temperature
conditions is possible depending on each manufacturer’s
circumstances, it is recommended that manufacturers
adhere to the following general process guideline:
MaxCap DLC peak temperature at the top surface of the
capacitor should be limited to 235°C for less than 10 sec-
onds.
Adherence to this guideline should enable success-
fulprocessing and allow for normal variation in time and
temperature for most customer processes. Please consult
the factory with questions regarding your specific process
conditions.
Typical Solder Reflow Time – Temperature Profile
Temp. (°C)
250°
200°
Peak Temperature
Ramp Up
Ramp Down
2 to 4°C/Sec.
2 to 4°C/Sec.
150°
100°
50°
Pre-Heat
Flux Activation/
Drying/ Thermal
Equalization
Reflow Cool Down
Time (sec.)
120 to 180 Seconds
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5
Ceramic Resistor Division