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LC4128B-5TN128C

CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Lattice(莱迪斯)

厂商官网:http://www.latticesemi.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Lattice(莱迪斯)
零件包装代码
QFP
包装说明
LFQFP, QFP128,.64SQ,16
针数
128
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
YES
最大时钟频率
156 MHz
系统内可编程
YES
JESD-30 代码
S-PQFP-G128
JESD-609代码
e3
JTAG BST
YES
长度
14 mm
湿度敏感等级
3
专用输入次数
4
I/O 线路数量
92
宏单元数
128
端子数量
128
组织
4 DEDICATED INPUTS, 92 I/O
输出函数
MACROCELL
封装主体材料
PLASTIC/EPOXY
封装代码
LFQFP
封装等效代码
QFP128,.64SQ,16
封装形状
SQUARE
封装形式
FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度)
260
电源
2.5 V
可编程逻辑类型
EE PLD
传播延迟
5 ns
认证状态
Not Qualified
座面最大高度
1.6 mm
最大供电电压
2.7 V
最小供电电压
2.3 V
标称供电电压
2.5 V
表面贴装
YES
技术
CMOS
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.4 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
40
宽度
14 mm
文档预览
ispMACH 4000V/B/C/Z Family
®
3.3 V/2.5 V/1.8 V In-System Programmable
SuperFAST
TM
High Density PLDs
April 2016
Data Sheet DS1020
Features
High Performance
f
MAX
= 400 MHz maximum operating frequency
t
PD
= 2.5 ns propagation delay
Up to four global clock pins with programmable
clock polarity control
• Up to 80 PTs per output
Broad Device Offering
• Multiple temperature range support
– Commercial: 0 to 90 °C junction (T
j
)
– Industrial: –40 to 105 °C junction (T
j
)
– Extended: –40 to 130 °C junction (T
j
)
• For AEC-Q100 compliant devices, refer to
LA-ispMACH 4000V/Z Automotive Data Sheet
Ease of Design
• Enhanced macrocells with individual clock,
reset, preset and clock enable controls
• Up to four global OE controls
• Individual local OE control per I/O pin
• Excellent First-Time-Fit
TM
and refit
• Fast path, SpeedLocking
TM
Path, and wide-PT
path
• Wide input gating (36 input logic blocks) for fast
counters, state machines and address decoders
Easy System Integration
• Superior solution for power sensitive consumer
applications
• Operation with 3.3 V, 2.5 V or 1.8 V LVCMOS I/O
• Operation with 3.3 V (4000V), 2.5 V (4000B) or
1.8 V (4000C/Z) supplies
• 5 V tolerant I/O for LVCMOS 3.3, LVTTL, and
PCI interfaces
• Hot-socketing
• Open-drain capability
• Input pull-up, pull-down or bus-keeper
• Programmable output slew rate
• 3.3 V PCI compatible
• IEEE 1149.1 boundary scan testable
• 3.3 V/2.5 V/1.8 V In-System Programmable
(ISP™) using IEEE 1532 compliant interface
• I/O pins with fast setup path
• Lead-free package options
Zero Power (ispMACH 4000Z) and Low
Power (ispMACH 4000V/B/C)
Typical static current 10 µA (4032Z)
Typical static current 1.3 mA (4000C)
1.8 V core low dynamic power
ispMACH 4000Z operational down to 1.6 V V
CC
Table 1. ispMACH 4000V/B/C Family Selection Guide
ispMACH
4032V/B/C
Macrocells
I/O + Dedicated Inputs
t
PD
(ns)
t
S
(ns)
t
CO
(ns)
f
MAX
(MHz)
Supply Voltages (V)
Pins/Package
32
30+2/32+4
2.5
1.8
2.2
400
3.3/2.5/1.8V
44
48 TQFP
TQFP
4
4
ispMACH
4064V/B/C
64
30+2/32+4/
64+10
2.5
1.8
2.2
400
3.3/2.5/1.8V
44
48 TQFP
100 TQFP
TQFP
4
4
ispMACH
4128V/B/C
128
64+10/92+4/
96+4
2.7
1.8
2.7
333
3.3/2.5/1.8V
ispMACH
4256V/B/C
256
64+10/96+14/
128+4/160+4
3.0
2.0
2.7
322
3.3/2.5/1.8V
ispMACH
4384V/B/C
384
128+4/192+4
3.5
2.0
2.7
322
3.3/2.5/1.8V
ispMACH
4512V/B/C
512
128+4/208+4
3.5
2.0
2.7
322
3.3/2.5/1.8V
100 TQFP
128 TQFP
144 TQFP
1
100 TQFP
144 TQFP
1
176 TQFP
256 ftBGA
2
/
fpBGA
2, 3
176 TQFP
256 ftBGA/
fpBGA
3
176 TQFP
256 ftBGA/
fpBGA
3
1.
2.
3.
4.
3.3 V (4000V) only.
128-I/O and 160-I/O configurations.
Use 256 ftBGA package for all new designs. Refer to PCN#14A-07 for 256 fpBGA package discontinuance.
1.0 mm thickness.
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1
DS1020_23.5
ispMACH 4000V/B/C/Z Family Data Sheet
Table 2. ispMACH 4000Z Family Selection Guide
ispMACH 4032ZC
Macrocells
I/O + Dedicated Inputs
t
PD
(ns)
t
S
(ns)
t
CO
(ns)
f
MAX
(MHz)
Supply Voltage (V)
Max. Standby Icc (µA)
Pins/Package
32
32+4/32+4
3.5
2.2
3.0
267
1.8
20
48 TQFP
56 csBGA
ispMACH 4064ZC
64
32+4/32+12/
64+10/64+10
3.7
2.5
3.2
250
1.8
25
48 TQFP
56 csBGA
100 TQFP
132 csBGA
ispMACH 4128ZC
128
64+10/96+4
4.2
2.7
3.5
220
1.8
35
ispMACH 4256ZC
256
64+10/96+6/
128+4
4.5
2.9
3.8
200
1.8
55
100 TQFP
132csBGA
100 TQFP
132 csBGA
176 TQFP
ispMACH 4000 Introduction
The high performance ispMACH 4000 family from Lattice offers a SuperFAST CPLD solution. The family is a blend
of Lattice’s two most popular architectures: the ispLSI
®
2000 and ispMACH 4A. Retaining the best of both families,
the ispMACH 4000 architecture focuses on significant innovations to combine the highest performance with low
power in a flexible CPLD family.
The ispMACH 4000 combines high speed and low power with the flexibility needed for ease of design. With its
robust Global Routing Pool and Output Routing Pool, this family delivers excellent First-Time-Fit, timing predictabil-
ity, routing, pin-out retention and density migration.
The ispMACH 4000 family offers densities ranging from 32 to 512 macrocells. There are multiple density-I/O com-
binations in Thin Quad Flat Pack (TQFP), Chip Scale BGA (csBGA) and Fine Pitch Thin BGA (ftBGA) packages
ranging from 44 to 256 pins/balls. Table 1 shows the macrocell, package and I/O options, along with other key
parameters.
The ispMACH 4000 family has enhanced system integration capabilities. It supports 3.3 V (4000V), 2.5 V (4000B)
and 1.8 V (4000C/Z) supply voltages and 3.3 V, 2.5 V and 1.8 V interface voltages. Additionally, inputs can be
safely driven up to 5.5 V when an I/O bank is configured for 3.3 V operation, making this family 5 V tolerant. The
ispMACH 4000 also offers enhanced I/O features such as slew rate control, PCI compatibility, bus-keeper latches,
pull-up resistors, pull-down resistors, open drain outputs and hot socketing. The ispMACH 4000 family members
are 3.3 V/2.5 V/1.8 V in-system programmable through the IEEE Standard 1532 interface. IEEE Standard 1149.1
boundary scan testing capability also allows product testing on automated test equipment. The 1532 interface sig-
nals TCK, TMS, TDI and TDO are referenced to V
CC
(logic core).
Overview
The ispMACH 4000 devices consist of multiple 36-input, 16-macrocell Generic Logic Blocks (GLBs) interconnected
by a Global Routing Pool (GRP). Output Routing Pools (ORPs) connect the GLBs to the I/O Blocks (IOBs), which
contain multiple I/O cells. This architecture is shown in Figure 1.
2
ispMACH 4000V/B/C/Z Family Data Sheet
Figure 1. Functional Block Diagram
CLK0/I
CLK1/I
CLK2/I
CLK3/I
V
CCO0
GND
V
CCO1
GND
I/O
Block
ORP
I/O Bank 1
16
36
Generic
16
Logic
Block
I/O
Block
ORP
GOE0
GOE1
V
CC
GND
TCK
TMS
TDI
TDO
I/O
Block
ORP
I/O Bank 0
16
Global Routing Pool
Generic
Logic
Block
16
36
16
36
Generic
16
Logic
Block
I/O
Block
ORP
16
Generic
Logic
Block
16
36
The I/Os in the ispMACH 4000 are split into two banks. Each bank has a separate I/O power supply. Inputs can
support a variety of standards independent of the chip or bank power supply. Outputs support the standards com-
patible with the power supply provided to the bank. Support for a variety of standards helps designers implement
designs in mixed voltage environments. In addition, 5 V tolerant inputs are specified within an I/O bank that is con-
nected to V
CCO
of 3.0 V to 3.6 V for LVCMOS 3.3, LVTTL and PCI interfaces.
ispMACH 4000 Architecture
There are a total of two GLBs in the ispMACH 4032, increasing to 32 GLBs in the ispMACH 4512. Each GLB has
36 inputs. All GLB inputs come from the GRP and all outputs from the GLB are brought back into the GRP to be
connected to the inputs of any other GLB on the device. Even if feedback signals return to the same GLB, they still
must go through the GRP. This mechanism ensures that GLBs communicate with each other with consistent and
predictable delays. The outputs from the GLB are also sent to the ORP. The ORP then sends them to the associ-
ated I/O cells in the I/O block.
Generic Logic Block
The ispMACH 4000 GLB consists of a programmable AND array, logic allocator, 16 macrocells and a GLB clock
generator. Macrocells are decoupled from the product terms through the logic allocator and the I/O pins are decou-
pled from macrocells through the ORP. Figure 2 illustrates the GLB.
3
ispMACH 4000V/B/C/Z Family Data Sheet
Figure 2. Generic Logic Block
CLK0
CLK1
CLK2
CLK3
To GRP
Clock
Generator
1+OE
16 MC Feedback Signals
1+OE
1+OE
1+OE
1+OE
1+OE
1+OE
1+OE
To ORP
To
Product Term
Output Enable
Sharing
Logic Allocator
36 Inputs
from GRP
AND Array
The programmable AND Array consists of 36 inputs and 83 output product terms. The 36 inputs from the GRP are
used to form 72 lines in the AND Array (true and complement of the inputs). Each line in the array can be con-
nected to any of the 83 output product terms via a wired-AND. Each of the 80 logic product terms feed the logic
allocator with the remaining three control product terms feeding the Shared PT Clock, Shared PT Initialization and
Shared PT OE. The Shared PT Clock and Shared PT Initialization signals can optionally be inverted before being
fed to the macrocells.
Every set of five product terms from the 80 logic product terms forms a product term cluster starting with PT0.
There is one product term cluster for every macrocell in the GLB. Figure 3 is a graphical representation of the AND
Array.
AND Array
36 Inputs,
83 Product Terms
4
16 Macrocells
ispMACH 4000V/B/C/Z Family Data Sheet
Figure 3. AND Array
In[0]
In[34]
In[35]
PT0
PT1
PT2
PT3
PT4
Cluster 0
PT75
PT76
PT77
Cluster 15
PT78
PT79
PT80 Shared PT Clock
PT81 Shared PT Initialization
PT82 Shared PTOE
Note:
Indicates programmable fuse.
Enhanced Logic Allocator
Within the logic allocator, product terms are allocated to macrocells in product term clusters. Each product term
cluster is associated with a macrocell. The cluster size for the ispMACH 4000 family is 4+1 (total 5) product terms.
The software automatically considers the availability and distribution of product term clusters as it fits the functions
within a GLB. The logic allocator is designed to provide three speed paths: 5-PT fast bypass path, 20-PT Speed
Locking path and an up to 80-PT path. The availability of these three paths lets designers trade timing variability for
increased performance.
The enhanced Logic Allocator of the ispMACH 4000 family consists of the following blocks:
• Product Term Allocator
• Cluster Allocator
• Wide Steering Logic
Figure 4 shows a macrocell slice of the Logic Allocator. There are 16 such slices in the GLB.
5
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