PRODUC T SELEC TOR GUIDE
M AY 2 0 1 8
FPGAs • ASSPs • CPLDs • REFERENCE DESIGNS • IP • DEVELOPMENT KITS • DESIGN TOOLS
The Lattice Advantage
Customizable Solutions
Lattice Semiconductor leads the industry in ultra-low power, small form factor, customizable solutions for today’s quickly
changing connected world. From heterogeneous networks and micro servers, to smartphones, tablets and wearables,
Lattice FPGAs and CPLDs are at the heart of solutions that give designers the ability to quickly innovate, or build and add
features to their systems that uniquely differentiate their products.
CrossLink Portfolio: Video Interface Bridges –
CrossLink is the industry’s first programmable bridging device that resolves
interface mismatches between application processors, image sensors, and displays. This makes it the optimal solution for VR
headsets, drones, smartphones, tablets, cameras, wearables, human machine interfaces (HMIs), and automotive.
iCE40 Portfolio: World’s Smallest FPGAs –
Lattice’s iCE40 family offers the world’s smallest FPGAs at very low power
enabling flexible and fast customization on standard platforms – perfect for implementing killer features on smartphones,
tablets, wearables, iOT edge, and other mobile devices.
MachXO Portfolio: Control PLD and Bridging –
The award-winning MachXO2 FPGA family and new MachXO3 family – the
world’s smallest, lowest-cost-per I/O, instant-on programmable platform – can be used to quickly implement system control
functions, I/O expansion and bridging in applications such as routers, base stations, servers, storage, industrial, medical and
consumer.
ECP Portfolio: Connectivity and Acceleration FPGAs –
The Lattice ECP3, ECP5 and ECP5-5G families are optimized for
data and control path bridge and interfacing, architected with high-performance SERDES, full-featured DSP blocks, and for
state-of-the-art memory interfaces for supporting a wide range of applications including wireless and wireline communication,
video processing, security and surveillance, industrial automation, and automotive.
Power and Thermal Management Products
Lattice’s Platform Manager 2 devices implement circuit board hardware management functions (Power Management,
Control Plane Functions and Thermal Management). The Platform Manager 2 device family is comprised of a Platform
Manager 2 device (Programmable Analog + FPGA) and a Programmable Analog Sense and Control device (L-ASC10).
In simpler boards, the Power Management functions can be integrated into Lattice Power Manager II products.
Standards-Based Products
Lattice enables high-performance digital connectivity for some of the world’s biggest brands in mobile, consumer electronic
(CE), and PC markets. As the driving force behind global standards including HDMI
®
, DVI, MHL
®
, and WirelessHD
®
, Lattice’s
understanding of these technologies is second to none.
As a Founder of both the HDMI
®
and MHL
®
Specifications, and through extensive experience with compliance and interoperability
testing, Lattice is in a unique position to offer tested, field-proven solutions that can be rapidly and reliably integrated into TVs,
projectors, A/V receivers, Blu-ray players, set-top boxes, and other digital display and home theater products.
Lattice’s mobile semiconductor products are designed for smartphones, tablets, digital cameras, streaming sticks, mobile
docks, and other devices where a small form factor and lower power consumption are essential. Lattice offers support for
proprietary connectors along with standard micro-USB, USB Type-C, superMHL™, and HDMI connectors.
SiBEAM
SiBEAM, a Lattice Semiconductor Company, is a pioneer in developing intelligent millimeter-wave technologies for wireless
communications. The company was the first to build 60GHz chipsets using standard CMOS technology. SiBEAM is a global
leader in driving next-generation architecture and semiconductor implementation of wireless connectivity solutions in the
consumer electronics, mobile, enterprise and infrastructure markets.
SiBEAM’s WirelessHD transmitter and receiver modules are completely self-contained, autonomous WirelessHD
subsystems that connect to a host board and enables. These WirelessHD modules enable a robust high-definition wireless
video connectivity between an HDMI
®
source and a display, delivering a cable-quality connection without wires.
For more information go to
LATTICESEMI.COM
3
CONTENTS
Programmable Products
■
FPGA and CPLD Products .................................................5-11
■
IP Cores and Reference Designs .....................................12-17
■
Development Kits .............................................................18-29
■
Programming Hardware ........................................................30
■
FPGA and CPLD Design Software........................................31
Standards-based Products
■
Connectivity ASSPs .........................................................32-35
■
SiBEAM Technology .........................................................36-38
4
FPGA Products
CrossLink™
Device
LUTs
Embedded Memory
Distrib. RAM
GPLL
D-PHY PLL
Embedded I
2
C Blocks
Embedded RX/TX MIPI D-PHY
48MHz Oscillator
10kHz Oscillator
NVCM
Dual Boot
Power Management Unit
Low Power Sleep Mode
Typical Operational Power
Footprint
Package Pitch
GPIO
I/O
1) Automotive grade.
LIF-MD6000-36
5936
kbits
kbits
180
47
1
1
2
1 (4 Data + 1 Clock)
1
1
Yes
Yes
Yes
Yes
5mW – 135mW
2.5 mm x 2.5 mm
0.4 mm
7
17
LIF-MD6000-64
5936
180
47
1
2
2
2 (8 Data + 2 Clock)
1
1
Yes
Yes
Yes
Yes
5mW – 135mW
3.5 mm x 3.5 mm
0.4 mm
8
29
LIF-MD6000-81
5936
180
47
1
2
2
2 (8 Data + 2 Clock)
1
1
Yes
Yes
Yes
Yes
5mW – 135mW
4.5 mm x 4.5 mm
0.5 mm
9
37
LIF-MD6000-80
5936
180
47
1
2
2
2 (8 Data + 2 Clock)
1
1
Yes
Yes
Yes
Yes
5mW – 135mW
6.5 mm x 6.5 mm
0.65 mm
8
36
LIA-MD6000-80
1
5936
180
47
1
2
2
2 (8 Data + 2 Clock)
1
1
Yes
Yes
Yes
Yes
5mW – 135mW
6.5 mm x 6.5 mm
0.65 mm
8
36
5
FPGA Products
ECP Series - Connectivity and Acceleration FPGAs
Features
ECP5
TM
-5G
LFE5UM5G-25
LFE5UM5G-45
LFE5UM5G-85
ECP5 Automotive
ECP5
TM
LatticeECP3
TM
LFE3-150EA
149 k
372
303
320
16
380/8
LAE5UM-25
LAE5UM-45
LFE5UM-25
LFE5UM-45
LFE5UM-85
LFE3-17EA
LFE3-35EA
LFE3-70EA
67 k
240
145
128
12
3.2 Gbps
External
P
P
1.2 V
P
P
295/4
380/8
Device
LUTs
EBR SRAM
Distrib RAM
sysDSP™
Blocks
SERDES
# of Blocks
kbits
kbits
Multipliers
Max. Chan.
Max. Rate
24 k
56
194
28
1/2
2+2
44 k
108
351
72
84 k
208
669
156
24 k
56
194
28
1/2
2+2
44 k
108
351
72
12 k
32
576
97
28
24 k
56
194
28
1/2
2+2
44 k
108
351
72
84 k
208
669
156
12 k
32
576
97
28
0
3.2 Gbps
2+2
24 k
56
194
28
44 k
108
351
72
0
84 k
208
669
156
17 k
38
700
36
24
4
33 k
72
68
64
92 k
240
188
128
1008 1944 3744 1008 1944
1008 1944 3744
1008 1944 3744
1,327 4,420 4,420 6,850
2/4
5 Gbps
4+4
2/4
0
3.2 Gbps
4+4
2+2
2/4
4+4
PLL + DLL
DDR Support
Boot Flash
Dual Boot
Multiple Boot
Bit-stream Encryption
Core Vcc
C
Temp.
I
AEC-Q100
0.5 mm Spacing
csfBGA
csBGA
285
328
10 x 10 mm
10 x 10 mm
2+2
4+4
2+2
4+2
10+2
DDR3 800,
LPDDR3 800,
DDR3L 800
External
P
P
P
1.2 V
P
P
DDR3 800,
LPDDR3 800,
DDR3L 800
External
P
P
P
1.1 V
DDR3 800, LPDDR3 800, DDR3L 800
External
P
P
P
1.1 V
P
P
DDR3 800, DDR2 533, DDR 400
P
I/O Count /
SERDES
118/2 118/2 118/2
I/O Count /
SERDES
I/O Count /
SERDES
I/O Count /
SERDES
I/O Count / SERDES
118/2 118/2 118/2 118/0 118/0 118/0 118/0
116/2
I/O Count / SERDES
197/0 197/0 197/0
P
0.8 mm Spacing
256
caBGA
381
554
756
14 x 14 mm
23 x 23 mm
27 x 27 mm
17 x 17 mm
197/2 203/4 205/4 197/2 203/4 197/0 197/2 203/4 205/4 197/0 197/0 203/0 205/0
245/4 259/4
365/4
I/O Count /
SERDES
I/O Count /
SERDES
245/4 259/4
365/4
245/0 259/0
365/0
I/O Count / SERDES
133/4
222/4
133/4
295/4
310/4
295/4
380/8
1.0 mm Spacing
ftBGA
fpBGA
256
484
672
1156
17 x 17 mm
23 x 23 mm
27 x 27 mm
35 x 35 mm
490/12 490/12 586/16
6
LFE3-95EA
LAE5U-12
LFE5U-12
LFE5U-25
LFE5U-45
LFE5U-85
微控制器 MCU
