加工封装描述
LEAD FREE, FPBGA-256
in_system_programmable
YES
moisture_sensitivity_level
3
组织
0 DEDICATED INPUTS, 193 I/O
ckage_equivalence_code
BGA256,16X16,40
eak_reflow_temperature__cel_
250
qualification_status
COMMERCIAL
sub_category
Programmable Logic Devices
ime_peak_reflow_temperature_max__s_
40