描述 |
Flash, 64KX8, 200ns, CQCC32 |
Flash, 64KX8, 250ns, CQCC32 |
Flash, 64KX8, 250ns, CQCC32 |
Flash, 64KX8, 300ns, CQCC32 |
Flash, 64KX8, 300ns, CQCC32 |
是否Rohs认证 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
厂商名称 |
LSC/CSI |
LSC/CSI |
LSC/CSI |
LSC/CSI |
LSC/CSI |
包装说明 |
QCCN, LCC32,.45X.55 |
QCCN, LCC32,.45X.55 |
QCCN, LCC32,.45X.55 |
QCCN, LCC32,.45X.55 |
QCCN, LCC32,.45X.55 |
Reach Compliance Code |
unknow |
unknown |
unknown |
unknown |
unknow |
ECCN代码 |
EAR99 |
3A001.A.2.C |
EAR99 |
3A001.A.2.C |
EAR99 |
最长访问时间 |
200 ns |
250 ns |
250 ns |
300 ns |
300 ns |
其他特性 |
100 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS |
100 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS |
100 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS |
100 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS |
100 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS |
命令用户界面 |
NO |
NO |
NO |
NO |
NO |
数据轮询 |
NO |
NO |
NO |
NO |
NO |
数据保留时间-最小值 |
10 |
10 |
10 |
10 |
10 |
JESD-30 代码 |
R-CQCC-N32 |
R-CQCC-N32 |
R-CQCC-N32 |
R-CQCC-N32 |
R-CQCC-N32 |
JESD-609代码 |
e0 |
e0 |
e0 |
e0 |
e0 |
内存密度 |
524288 bi |
524288 bit |
524288 bit |
524288 bit |
524288 bi |
内存集成电路类型 |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
内存宽度 |
8 |
8 |
8 |
8 |
8 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
32 |
32 |
32 |
32 |
32 |
字数 |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
字数代码 |
64000 |
64000 |
64000 |
64000 |
64000 |
工作模式 |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
最高工作温度 |
85 °C |
125 °C |
85 °C |
125 °C |
85 °C |
最低工作温度 |
-40 °C |
-55 °C |
-40 °C |
-55 °C |
-40 °C |
组织 |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
封装主体材料 |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
封装代码 |
QCCN |
QCCN |
QCCN |
QCCN |
QCCN |
封装等效代码 |
LCC32,.45X.55 |
LCC32,.45X.55 |
LCC32,.45X.55 |
LCC32,.45X.55 |
LCC32,.45X.55 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
并行/串行 |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
峰值回流温度(摄氏度) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
电源 |
5 V |
5 V |
5 V |
5 V |
5 V |
编程电压 |
12 V |
12 V |
12 V |
12 V |
12 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
最大待机电流 |
0.0004 A |
0.0004 A |
0.0004 A |
0.0004 A |
0.0004 A |
最大压摆率 |
0.04 mA |
0.04 mA |
0.04 mA |
0.04 mA |
0.04 mA |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
MILITARY |
INDUSTRIAL |
MILITARY |
INDUSTRIAL |
端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
端子形式 |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
端子节距 |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
端子位置 |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
切换位 |
NO |
NO |
NO |
NO |
NO |
类型 |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |