型号
- 型号
- 关键词
OP-AMP, 5000uV OFFSET-MAX, 20MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8
厂商名称：Motorola ( NXP )
厂商官网：https://www.nxp.com
下载文档| 型号 | LF357JB | LF356J | LF356BJ |
|---|---|---|---|
| 描述 | OP-AMP, 5000uV OFFSET-MAX, 20MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 | OP-AMP, 10000uV OFFSET-MAX, 5MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 | OP-AMP, 5000uV OFFSET-MAX, 5MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8 |
| 零件包装代码 | DIP | DIP | DIP |
| 包装说明 | DIP, | DIP, DIP8,.3 | DIP, DIP8,.3 |
| 针数 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.0001 µA | 0.0002 µA | 0.0001 µA |
| 最小共模抑制比 | 85 dB | 80 dB | 85 dB |
| 标称共模抑制比 | 100 dB | 100 dB | 100 dB |
| 最大输入失调电压 | 5000 µV | 10000 µV | 5000 µV |
| JESD-30 代码 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 |
| 负供电电压上限 | -22 V | -18 V | -22 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 最小摆率 | 30 V/us | 7.5 V/us | 7.5 V/us |
| 标称压摆率 | 50 V/us | 12 V/us | 12 V/us |
| 最大压摆率 | 7 mA | 10 mA | 7 mA |
| 供电电压上限 | 22 V | 18 V | 22 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL |
| 标称均一增益带宽 | 20000 kHz | 5000 kHz | 5000 kHz |
| 最小电压增益 | 50000 | 25000 | 50000 |
| 厂商名称 | Motorola ( NXP ) | - | Motorola ( NXP ) |
| 技术 | JFET | - | JFET |
| 是否Rohs认证 | - | 不符合 | 不符合 |
| 架构 | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 25C 时的最大偏置电流 (IIB) | - | 0.0002 µA | 0.0001 µA |
| 频率补偿 | - | YES | YES |
| 最大输入失调电流 (IIO) | - | 0.002 µA | 0.001 µA |
| JESD-609代码 | - | e0 | e0 |
| 长度 | - | 10.415 mm | 10.415 mm |
| 低-偏置 | - | YES | YES |
| 低-失调 | - | NO | NO |
| 封装等效代码 | - | DIP8,.3 | DIP8,.3 |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | +-15/+-20 V | +-15/+-20 V |
| 座面最大高度 | - | 5.08 mm | 5.08 mm |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | - | 2.54 mm | 2.54 mm |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 7.62 mm | 7.62 mm |