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Introduction_01.4
Introduction
LatticeECP/EC Family Data Sheet
Introduction
The LatticeECP/EC family of FPGA devices is optimized to deliver mainstream FPGA features at low cost. For
maximum performance and value, the LatticeECP™ (EConomy Plus) FPGA concept combines an efficient FPGA
fabric with high-speed dedicated functions. Lattice’s first family to implement this approach is the LatticeECP-
DSP™ (EConomy Plus DSP) family, providing dedicated high-performance DSP blocks on-chip. The LatticeEC™
(EConomy) family supports all the general purpose features of LatticeECP devices without dedicated function
blocks to achieve lower cost solutions.
The LatticeECP/EC FPGA fabric, which was designed from the outset with low cost in mind, contains all the critical
FPGA elements: LUT-based logic, distributed and embedded memory, PLLs and support for mainstream I/Os.
Dedicated DDR memory interface logic is also included to support this memory that is becoming increasingly prev-
alent in cost-sensitive applications.
The ispLEVER
®
design tool suite from Lattice allows large complex designs to be efficiently implemented using the
LatticeECP/EC FPGA family. Synthesis library support for LatticeECP/EC is available for popular logic synthesis
tools. The ispLEVER tool uses the synthesis tool output along with the constraints from its floor planning tools to
place and route the design in the LatticeECP/EC device. The ispLEVER tool extracts the timing from the routing
and back-annotates it into the design for timing verification.
Lattice provides many pre-designed IP (Intellectual Property) ispLeverCORE™ modules for the LatticeECP/EC
family. By using these IPs as standardized blocks, designers are free to concentrate on the unique aspects of their
design, increasing their productivity.
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LatticeECP/EC Family Data Sheet
Architecture
September 2012
Data Sheet
Architecture Overview
The LatticeECP-DSP and LatticeEC architectures contain an array of logic blocks surrounded by Programmable I/
O Cells (PIC). Interspersed between the rows of logic blocks are rows of sysMEM Embedded Block RAM (EBR), as
shown in Figures 2-1 and 2-2. In addition, LatticeECP-DSP supports an additional row of DSP blocks, as shown in
Figure 2-2.
There are two kinds of logic blocks, the Programmable Functional Unit (PFU) and Programmable Functional unit
without RAM/ROM (PFF). The PFU contains the building blocks for logic, arithmetic, RAM, ROM and register func-
tions. The PFF block contains building blocks for logic, arithmetic and ROM functions. Both PFU and PFF blocks
are optimized for flexibility, allowing complex designs to be implemented quickly and efficiently. Logic Blocks are
arranged in a two-dimensional array. Only one type of block is used per row. The PFU blocks are used on the out-
side rows. The rest of the core consists of rows of PFF blocks interspersed with rows of PFU blocks. For every
three rows of PFF blocks there is a row of PFU blocks.
Each PIC block encompasses two PIOs (PIO pairs) with their respective sysI/O interfaces. PIO pairs on the left and
right edges of the device can be configured as LVDS transmit/receive pairs. sysMEM EBRs are large dedicated fast
memory blocks. They can be configured as RAM or ROM.
The PFU, PFF, PIC and EBR Blocks are arranged in a two-dimensional grid with rows and columns as shown in
Figure 2-1. The blocks are connected with many vertical and horizontal routing channel resources. The place and
route software tool automatically allocates these routing resources.
At the end of the rows containing the sysMEM Blocks are the sysCLOCK Phase Locked Loop (PLL) Blocks. These
PLLs have multiply, divide and phase shifting capability; they are used to manage the phase relationship of the
clocks. The LatticeECP/EC architecture provides up to four PLLs per device.
Every device in the family has a JTAG Port with internal Logic Analyzer (ispTRACY) capability. The sysCONFIG™
port which allows for serial or parallel device configuration. The LatticeECP/EC devices use 1.2V as their core volt-
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
