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LFXP10E-5TN144I

Field Programmable Gate Array, 1216 CLBs, CMOS, PQFP144, 20 X 20 MM, LEAD FREE, PLASTIC , TQFP-100

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Lattice(莱迪斯)

厂商官网:http://www.latticesemi.com

器件标准:  

下载文档
器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Lattice(莱迪斯)
零件包装代码
QFP
包装说明
QFP,
针数
144
Reach Compliance Code
compliant
ECCN代码
EAR99
JESD-30 代码
S-PQFP-G144
JESD-609代码
e3
长度
20 mm
湿度敏感等级
3
可配置逻辑块数量
1216
端子数量
144
最高工作温度
85 °C
最低工作温度
组织
1216 CLBS
封装主体材料
PLASTIC/EPOXY
封装代码
QFP
封装形状
SQUARE
封装形式
FLATPACK
峰值回流温度(摄氏度)
260
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
最大供电电压
3.3 V
最小供电电压
1.8 V
标称供电电压
2.5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL EXTENDED
端子面层
MATTE TIN
端子形式
GULL WING
端子位置
QUAD
处于峰值回流温度下的最长时间
40
宽度
20 mm
Base Number Matches
1
文档预览
LatticeXP Family Handbook
HB1001 Version 02.9, April 2007
LatticeXP Family Handbook
Table of Contents
April 2007
Section I. LatticeXP Family Data Sheet
Introduction
Features ............................................................................................................................................................. 1-1
Introduction ........................................................................................................................................................ 1-2
Architecture
Architecture Overview ........................................................................................................................................ 2-1
PFU and PFF Blocks................................................................................................................................. 2-2
Slice .......................................................................................................................................................... 2-3
Routing...................................................................................................................................................... 2-6
Clock Distribution Network ................................................................................................................................. 2-6
Primary Clock Sources.............................................................................................................................. 2-6
Secondary Clock Sources......................................................................................................................... 2-7
Clock Routing............................................................................................................................................ 2-8
sysCLOCK Phase Locked Loops (PLLs) .................................................................................................. 2-9
Dynamic Clock Select (DCS) ........................................................................................................................... 2-11
sysMEM Memory ............................................................................................................................................. 2-11
sysMEM Memory Block........................................................................................................................... 2-11
Bus Size Matching .................................................................................................................................. 2-12
RAM Initialization and ROM Operation ................................................................................................... 2-12
Memory Cascading ................................................................................................................................. 2-12
Single, Dual and Pseudo-Dual Port Modes............................................................................................. 2-12
Memory Core Reset ................................................................................................................................ 2-14
Programmable I/O Cells (PICs)........................................................................................................................ 2-15
PIO .......................................................................................................................................................... 2-16
DDR Memory Support...................................................................................................................................... 2-20
DLL Calibrated DQS Delay Block ........................................................................................................... 2-20
Polarity Control Logic .............................................................................................................................. 2-22
sysIO Buffer ..................................................................................................................................................... 2-22
Hot Socketing.......................................................................................................................................... 2-25
Sleep Mode ...................................................................................................................................................... 2-25
SLEEPN Pin Characteristics ................................................................................................................... 2-26
Configuration and Testing ................................................................................................................................ 2-26
IEEE 1149.1-Compliant Boundary Scan Testability................................................................................ 2-26
Device Configuration............................................................................................................................... 2-26
Internal Logic Analyzer Capability (ispTRACY)....................................................................................... 2-27
Oscillator ................................................................................................................................................. 2-27
Density Shifting ................................................................................................................................................ 2-28
DC and Switching Characteristics
Absolute Maximum Ratings ............................................................................................................................... 3-1
Recommended Operating Conditions ................................................................................................................ 3-1
Hot Socketing Specifications.............................................................................................................................. 3-2
DC Electrical Characteristics.............................................................................................................................. 3-3
Supply Current (Sleep Mode)............................................................................................................................. 3-3
Supply Current (Standby)................................................................................................................................... 3-4
Initialization Supply Current ............................................................................................................................... 3-5
Programming and Erase Flash Supply Current ................................................................................................. 3-6
sysIO Recommended Operating Conditions...................................................................................................... 3-7
sysIO Single-Ended DC Electrical Characteristics............................................................................................. 3-8
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1
Lattice Semiconductor
Table of Contents
LatticeXP Family Handbook
sysIO Differential Electrical Characteristics ....................................................................................................... 3-9
LVDS......................................................................................................................................................... 3-9
Differential HSTL and SSTL............................................................................................................................. 3-10
LVDS25E ................................................................................................................................................ 3-10
BLVDS .................................................................................................................................................... 3-10
LVPECL .................................................................................................................................................. 3-12
RSDS ...................................................................................................................................................... 3-12
Typical Building Block Function Performance.................................................................................................. 3-14
Pin-to-Pin Performance (LVCMOS25 12 mA Drive) ............................................................................... 3-14
Register to Register Performance........................................................................................................... 3-14
Derating Logic Timing ...................................................................................................................................... 3-15
LatticeXP External Switching Characteristics .................................................................................................. 3-16
LatticeXP Internal Timing Parameters ............................................................................................................. 3-18
Timing Diagrams .............................................................................................................................................. 3-20
PFU Timing Diagrams............................................................................................................................. 3-20
EBR Memory Timing Diagrams........................................................................................................................ 3-21
LatticeXP Family Timing Adders ...................................................................................................................... 3-23
sysCLOCK PLL Timing .................................................................................................................................... 3-25
LatticeXP sysCONFIG Port Timing Specifications........................................................................................... 3-26
Flash Download Time ...................................................................................................................................... 3-27
JTAG Port Timing Specifications ..................................................................................................................... 3-27
Switching Test Conditions................................................................................................................................ 3-28
Pinout Information
Signal Descriptions ............................................................................................................................................ 4-1
PICs and DDR Data (DQ) Pins Associated with the DDR Strobe (DQS) Pin .................................................... 4-3
Pin Information Summary................................................................................................................................... 4-4
Power Supply and NC Connections................................................................................................................... 4-6
LFXP3 Logic Signal Connections: 100 TQFP .................................................................................................... 4-7
LFXP3 & LFXP6 Logic Signal Connections: 144 TQFP................................................................................... 4-10
LFXP3 & LFXP6 Logic Signal Connections: 208 PQFP .................................................................................. 4-14
LFXP6 & LFXP10 Logic Signal Connections: 256 fpBGA................................................................................ 4-19
LFXP15 & LFXP20 Logic Signal Connections: 256 fpBGA.............................................................................. 4-26
LFXP10, LFXP15 & LFXP20 Logic Signal Connections: 388 fpBGA............................................................... 4-34
LFXP15 & LFXP20 Logic Signal Connections: 484 fpBGA.............................................................................. 4-43
Ordering Information
Part Number Description.................................................................................................................................... 5-1
Ordering Information .......................................................................................................................................... 5-1
Conventional Packaging ........................................................................................................................... 5-2
Lead-free Packaging ................................................................................................................................. 5-8
Supplemental Information
For Further Information ...................................................................................................................................... 6-1
Revision History
Revision History ................................................................................................................................................. 7-1
Section II. LatticeXP Family Technical Notes
LatticeECP/EC and LatticeXP sysIO Usage Guide
Introduction ........................................................................................................................................................ 8-1
sysIO Buffer Overview ....................................................................................................................................... 8-1
Supported sysIO Standards ............................................................................................................................... 8-1
sysIO Banking Scheme...................................................................................................................................... 8-2
V
CCIO
(1.2V/1.5V/1.8V/2.5V/3.3V) ............................................................................................................ 8-3
V
CCAUX
(3.3V) ........................................................................................................................................... 8-3
V
CCJ
(1.2V/1.5V/1.8V/2.5V/3.3V).............................................................................................................. 8-3
Input Reference Voltage (V
REF1,
V
REF2
)................................................................................................... 8-3
V
REF1
for DDR Memory Interface ............................................................................................................. 8-3
2
Lattice Semiconductor
Table of Contents
LatticeXP Family Handbook
Mixed Voltage Support in a Bank.............................................................................................................. 8-4
sysIO Standards Supported in Each Bank......................................................................................................... 8-5
LVCMOS Buffer Configurations ......................................................................................................................... 8-5
Programmable Pull-up/Pull-Down/Buskeeper........................................................................................... 8-5
Programmable Drive ................................................................................................................................. 8-5
Programmable Slew Rate ......................................................................................................................... 8-7
Open Drain Control ................................................................................................................................... 8-7
Differential SSTL and HSTL Support ................................................................................................................. 8-7
PCI Support with Programmable PCICLAMP .................................................................................................... 8-7
5V Interface with PCI Clamp Diode.................................................................................................................... 8-8
Programmable Input Delay ................................................................................................................................ 8-9
Software sysIO Attributes................................................................................................................................... 8-9
IO_TYPE ................................................................................................................................................... 8-9
OPENDRAIN........................................................................................................................................... 8-10
DRIVE ..................................................................................................................................................... 8-10
PULLMODE ............................................................................................................................................ 8-11
PCICLAMP.............................................................................................................................................. 8-11
SLEWRATE ............................................................................................................................................ 8-11
FIXEDDELAY.......................................................................................................................................... 8-11
DIN/DOUT............................................................................................................................................... 8-11
LOC......................................................................................................................................................... 8-12
Design Considerations and Usage................................................................................................................... 8-12
Banking Rules ......................................................................................................................................... 8-12
Differential I/O Rules ............................................................................................................................... 8-12
Assigning V
REF
/ V
REF
Groups for Referenced Inputs............................................................................. 8-12
Differential I/O Implementation......................................................................................................................... 8-13
LVDS....................................................................................................................................................... 8-13
BLVDS .................................................................................................................................................... 8-13
RSDS ...................................................................................................................................................... 8-13
LVPECL .................................................................................................................................................. 8-13
Differential SSTL and HSTL.................................................................................................................... 8-13
Technical Support Assistance.......................................................................................................................... 8-13
Appendix A. HDL Attributes for Synplify
®
and Precision
®
RTL Synthesis ........................................................ 8-14
VHDL Synplify/Precision RTL Synthesis.......................................................................................................... 8-14
Syntax ..................................................................................................................................................... 8-14
Examples ................................................................................................................................................ 8-14
Verilog for Synplify ........................................................................................................................................... 8-17
Syntax ..................................................................................................................................................... 8-17
Examples ................................................................................................................................................ 8-17
Verilog for Precision RTL Synthesis................................................................................................................. 8-19
Syntax ..................................................................................................................................................... 8-19
Example .................................................................................................................................................. 8-19
Appendix B. sysIO Attributes Using Preference Editor User Interface............................................................. 8-21
Appendix C. sysIO Attributes Using Preference File (ASCII File) .................................................................... 8-22
IOBUF ..................................................................................................................................................... 8-22
LOCATE.................................................................................................................................................. 8-22
USE DIN CELL........................................................................................................................................ 8-23
USE DOUT CELL.................................................................................................................................... 8-23
PGROUP VREF ...................................................................................................................................... 8-23
Memory Usage Guide for LatticeECP/EC and LatticeXP Devices
Introduction ........................................................................................................................................................ 9-1
Memories in LatticeECP/EC and LatticeXP Devices ......................................................................................... 9-1
Utilizing IPexpress.............................................................................................................................................. 9-3
IPexpress Flow.......................................................................................................................................... 9-3
3
Lattice Semiconductor
Table of Contents
LatticeXP Family Handbook
Memory Modules................................................................................................................................................ 9-7
Single Port RAM (RAM_DQ) – EBR Based .............................................................................................. 9-7
True Dual Port RAM (RAM_DP_TRUE) – EBR Based ........................................................................... 9-13
Pseudo Dual Port RAM (RAM_DP) – EBR-Based.................................................................................. 9-22
Read Only Memory (ROM) – EBR Based............................................................................................... 9-25
First In First Out (FIFO, FIFO_DC) – EBR Based................................................................................... 9-28
Distributed Single Port RAM (Distributed_SPRAM) – PFU Based.......................................................... 9-32
Distributed Dual Port RAM (Distributed_DPRAM) – PFU Based ............................................................ 9-35
Distributed ROM (Distributed_ROM) – PFU Based ................................................................................ 9-37
Initializing Memory ........................................................................................................................................... 9-39
Initialization File Format .......................................................................................................................... 9-39
Technical Support Assistance.......................................................................................................................... 9-41
Appendix A. Attribute Definitions...................................................................................................................... 9-42
DATA_WIDTH......................................................................................................................................... 9-42
REGMODE.............................................................................................................................................. 9-42
RESETMODE ......................................................................................................................................... 9-42
CSDECODE............................................................................................................................................ 9-42
WRITEMODE.......................................................................................................................................... 9-42
GSR ........................................................................................................................................................ 9-42
LatticeECP/EC and LatticeXP DDR Usage Guide
Introduction ...................................................................................................................................................... 10-1
DDR SDRAM Interfaces Overview................................................................................................................... 10-1
Implementing DDR Memory Interfaces with the LatticeECP/EC Devices........................................................ 10-2
DQS Grouping......................................................................................................................................... 10-2
DDR Software Primitives......................................................................................................................... 10-5
Memory Read Implementation ................................................................................................................ 10-9
Data Read Critical Path......................................................................................................................... 10-12
DQS Postamble .................................................................................................................................... 10-13
Memory Write Implementation .............................................................................................................. 10-14
Design Rules/Guidelines....................................................................................................................... 10-16
QDR II Interface .................................................................................................................................... 10-17
FCRAM (Fast Cycle Random Access Memory) Interface..................................................................... 10-17
Generic High Speed DDR Implementation .................................................................................................... 10-17
Board Design Guidelines ............................................................................................................................... 10-17
Technical Support Assistance........................................................................................................................ 10-18
Appendix A. Using IPexpress™ to Generate DDR Modules.......................................................................... 10-19
DDR Generic......................................................................................................................................... 10-19
DDR Memory Interface ......................................................................................................................... 10-20
Appendix B. Verilog Example for DDR Input and Output Modules ................................................................ 10-21
Appendix C. VHDL Example for DDR Input and Output Modules.................................................................. 10-23
Appendix D. Generic (Non-Memory) High-Speed DDR Interface .................................................................. 10-28
VHDL Implementation ........................................................................................................................... 10-28
Verilog Example .................................................................................................................................... 10-30
Preference File...................................................................................................................................... 10-31
Appendix E. List of Compatible DDR SDRAM ............................................................................................... 10-32
Appendix F. DDR400 Interface using the LatticeEC Evaluation Board.......................................................... 10-35
References..................................................................................................................................................... 10-36
LatticeECP/EC and LatticeXP sysCLOCK PLL Design and Usage Guide
Introduction ...................................................................................................................................................... 11-1
Features ........................................................................................................................................................... 11-1
Functional Description...................................................................................................................................... 11-1
PLL Divider and Delay Blocks................................................................................................................. 11-1
PLL Inputs and Outputs .......................................................................................................................... 11-2
PLL Attributes.......................................................................................................................................... 11-3
4
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