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LFXP15E-5TN100I

Field Programmable Gate Array, 1920 CLBs, CMOS, PQFP100, 20 X 20 MM, LEAD FREE, PLASTIC , TQFP-100

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Lattice(莱迪斯)

厂商官网:http://www.latticesemi.com

器件标准:  

下载文档
器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Lattice(莱迪斯)
零件包装代码
QFP
包装说明
QFP,
针数
100
Reach Compliance Code
compliant
ECCN代码
EAR99
JESD-30 代码
S-PQFP-G100
JESD-609代码
e3
长度
14 mm
湿度敏感等级
3
可配置逻辑块数量
1920
端子数量
100
最高工作温度
85 °C
最低工作温度
组织
1920 CLBS
封装主体材料
PLASTIC/EPOXY
封装代码
QFP
封装形状
SQUARE
封装形式
FLATPACK
峰值回流温度(摄氏度)
260
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
最大供电电压
3.3 V
最小供电电压
1.8 V
标称供电电压
2.5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL EXTENDED
端子面层
MATTE TIN
端子形式
GULL WING
端子位置
QUAD
处于峰值回流温度下的最长时间
40
宽度
14 mm
文档预览
LatticeXP Family Handbook
HB1001 Version 02.9, April 2007
LatticeXP Family Handbook
Table of Contents
April 2007
Section I. LatticeXP Family Data Sheet
Introduction
Features ............................................................................................................................................................. 1-1
Introduction ........................................................................................................................................................ 1-2
Architecture
Architecture Overview ........................................................................................................................................ 2-1
PFU and PFF Blocks................................................................................................................................. 2-2
Slice .......................................................................................................................................................... 2-3
Routing...................................................................................................................................................... 2-6
Clock Distribution Network ................................................................................................................................. 2-6
Primary Clock Sources.............................................................................................................................. 2-6
Secondary Clock Sources......................................................................................................................... 2-7
Clock Routing............................................................................................................................................ 2-8
sysCLOCK Phase Locked Loops (PLLs) .................................................................................................. 2-9
Dynamic Clock Select (DCS) ........................................................................................................................... 2-11
sysMEM Memory ............................................................................................................................................. 2-11
sysMEM Memory Block........................................................................................................................... 2-11
Bus Size Matching .................................................................................................................................. 2-12
RAM Initialization and ROM Operation ................................................................................................... 2-12
Memory Cascading ................................................................................................................................. 2-12
Single, Dual and Pseudo-Dual Port Modes............................................................................................. 2-12
Memory Core Reset ................................................................................................................................ 2-14
Programmable I/O Cells (PICs)........................................................................................................................ 2-15
PIO .......................................................................................................................................................... 2-16
DDR Memory Support...................................................................................................................................... 2-20
DLL Calibrated DQS Delay Block ........................................................................................................... 2-20
Polarity Control Logic .............................................................................................................................. 2-22
sysIO Buffer ..................................................................................................................................................... 2-22
Hot Socketing.......................................................................................................................................... 2-25
Sleep Mode ...................................................................................................................................................... 2-25
SLEEPN Pin Characteristics ................................................................................................................... 2-26
Configuration and Testing ................................................................................................................................ 2-26
IEEE 1149.1-Compliant Boundary Scan Testability................................................................................ 2-26
Device Configuration............................................................................................................................... 2-26
Internal Logic Analyzer Capability (ispTRACY)....................................................................................... 2-27
Oscillator ................................................................................................................................................. 2-27
Density Shifting ................................................................................................................................................ 2-28
DC and Switching Characteristics
Absolute Maximum Ratings ............................................................................................................................... 3-1
Recommended Operating Conditions ................................................................................................................ 3-1
Hot Socketing Specifications.............................................................................................................................. 3-2
DC Electrical Characteristics.............................................................................................................................. 3-3
Supply Current (Sleep Mode)............................................................................................................................. 3-3
Supply Current (Standby)................................................................................................................................... 3-4
Initialization Supply Current ............................................................................................................................... 3-5
Programming and Erase Flash Supply Current ................................................................................................. 3-6
sysIO Recommended Operating Conditions...................................................................................................... 3-7
sysIO Single-Ended DC Electrical Characteristics............................................................................................. 3-8
© 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1
Lattice Semiconductor
Table of Contents
LatticeXP Family Handbook
sysIO Differential Electrical Characteristics ....................................................................................................... 3-9
LVDS......................................................................................................................................................... 3-9
Differential HSTL and SSTL............................................................................................................................. 3-10
LVDS25E ................................................................................................................................................ 3-10
BLVDS .................................................................................................................................................... 3-10
LVPECL .................................................................................................................................................. 3-12
RSDS ...................................................................................................................................................... 3-12
Typical Building Block Function Performance.................................................................................................. 3-14
Pin-to-Pin Performance (LVCMOS25 12 mA Drive) ............................................................................... 3-14
Register to Register Performance........................................................................................................... 3-14
Derating Logic Timing ...................................................................................................................................... 3-15
LatticeXP External Switching Characteristics .................................................................................................. 3-16
LatticeXP Internal Timing Parameters ............................................................................................................. 3-18
Timing Diagrams .............................................................................................................................................. 3-20
PFU Timing Diagrams............................................................................................................................. 3-20
EBR Memory Timing Diagrams........................................................................................................................ 3-21
LatticeXP Family Timing Adders ...................................................................................................................... 3-23
sysCLOCK PLL Timing .................................................................................................................................... 3-25
LatticeXP sysCONFIG Port Timing Specifications........................................................................................... 3-26
Flash Download Time ...................................................................................................................................... 3-27
JTAG Port Timing Specifications ..................................................................................................................... 3-27
Switching Test Conditions................................................................................................................................ 3-28
Pinout Information
Signal Descriptions ............................................................................................................................................ 4-1
PICs and DDR Data (DQ) Pins Associated with the DDR Strobe (DQS) Pin .................................................... 4-3
Pin Information Summary................................................................................................................................... 4-4
Power Supply and NC Connections................................................................................................................... 4-6
LFXP3 Logic Signal Connections: 100 TQFP .................................................................................................... 4-7
LFXP3 & LFXP6 Logic Signal Connections: 144 TQFP................................................................................... 4-10
LFXP3 & LFXP6 Logic Signal Connections: 208 PQFP .................................................................................. 4-14
LFXP6 & LFXP10 Logic Signal Connections: 256 fpBGA................................................................................ 4-19
LFXP15 & LFXP20 Logic Signal Connections: 256 fpBGA.............................................................................. 4-26
LFXP10, LFXP15 & LFXP20 Logic Signal Connections: 388 fpBGA............................................................... 4-34
LFXP15 & LFXP20 Logic Signal Connections: 484 fpBGA.............................................................................. 4-43
Ordering Information
Part Number Description.................................................................................................................................... 5-1
Ordering Information .......................................................................................................................................... 5-1
Conventional Packaging ........................................................................................................................... 5-2
Lead-free Packaging ................................................................................................................................. 5-8
Supplemental Information
For Further Information ...................................................................................................................................... 6-1
Revision History
Revision History ................................................................................................................................................. 7-1
Section II. LatticeXP Family Technical Notes
LatticeECP/EC and LatticeXP sysIO Usage Guide
Introduction ........................................................................................................................................................ 8-1
sysIO Buffer Overview ....................................................................................................................................... 8-1
Supported sysIO Standards ............................................................................................................................... 8-1
sysIO Banking Scheme...................................................................................................................................... 8-2
V
CCIO
(1.2V/1.5V/1.8V/2.5V/3.3V) ............................................................................................................ 8-3
V
CCAUX
(3.3V) ........................................................................................................................................... 8-3
V
CCJ
(1.2V/1.5V/1.8V/2.5V/3.3V).............................................................................................................. 8-3
Input Reference Voltage (V
REF1,
V
REF2
)................................................................................................... 8-3
V
REF1
for DDR Memory Interface ............................................................................................................. 8-3
2
Lattice Semiconductor
Table of Contents
LatticeXP Family Handbook
Mixed Voltage Support in a Bank.............................................................................................................. 8-4
sysIO Standards Supported in Each Bank......................................................................................................... 8-5
LVCMOS Buffer Configurations ......................................................................................................................... 8-5
Programmable Pull-up/Pull-Down/Buskeeper........................................................................................... 8-5
Programmable Drive ................................................................................................................................. 8-5
Programmable Slew Rate ......................................................................................................................... 8-7
Open Drain Control ................................................................................................................................... 8-7
Differential SSTL and HSTL Support ................................................................................................................. 8-7
PCI Support with Programmable PCICLAMP .................................................................................................... 8-7
5V Interface with PCI Clamp Diode.................................................................................................................... 8-8
Programmable Input Delay ................................................................................................................................ 8-9
Software sysIO Attributes................................................................................................................................... 8-9
IO_TYPE ................................................................................................................................................... 8-9
OPENDRAIN........................................................................................................................................... 8-10
DRIVE ..................................................................................................................................................... 8-10
PULLMODE ............................................................................................................................................ 8-11
PCICLAMP.............................................................................................................................................. 8-11
SLEWRATE ............................................................................................................................................ 8-11
FIXEDDELAY.......................................................................................................................................... 8-11
DIN/DOUT............................................................................................................................................... 8-11
LOC......................................................................................................................................................... 8-12
Design Considerations and Usage................................................................................................................... 8-12
Banking Rules ......................................................................................................................................... 8-12
Differential I/O Rules ............................................................................................................................... 8-12
Assigning V
REF
/ V
REF
Groups for Referenced Inputs............................................................................. 8-12
Differential I/O Implementation......................................................................................................................... 8-13
LVDS....................................................................................................................................................... 8-13
BLVDS .................................................................................................................................................... 8-13
RSDS ...................................................................................................................................................... 8-13
LVPECL .................................................................................................................................................. 8-13
Differential SSTL and HSTL.................................................................................................................... 8-13
Technical Support Assistance.......................................................................................................................... 8-13
Appendix A. HDL Attributes for Synplify
®
and Precision
®
RTL Synthesis ........................................................ 8-14
VHDL Synplify/Precision RTL Synthesis.......................................................................................................... 8-14
Syntax ..................................................................................................................................................... 8-14
Examples ................................................................................................................................................ 8-14
Verilog for Synplify ........................................................................................................................................... 8-17
Syntax ..................................................................................................................................................... 8-17
Examples ................................................................................................................................................ 8-17
Verilog for Precision RTL Synthesis................................................................................................................. 8-19
Syntax ..................................................................................................................................................... 8-19
Example .................................................................................................................................................. 8-19
Appendix B. sysIO Attributes Using Preference Editor User Interface............................................................. 8-21
Appendix C. sysIO Attributes Using Preference File (ASCII File) .................................................................... 8-22
IOBUF ..................................................................................................................................................... 8-22
LOCATE.................................................................................................................................................. 8-22
USE DIN CELL........................................................................................................................................ 8-23
USE DOUT CELL.................................................................................................................................... 8-23
PGROUP VREF ...................................................................................................................................... 8-23
Memory Usage Guide for LatticeECP/EC and LatticeXP Devices
Introduction ........................................................................................................................................................ 9-1
Memories in LatticeECP/EC and LatticeXP Devices ......................................................................................... 9-1
Utilizing IPexpress.............................................................................................................................................. 9-3
IPexpress Flow.......................................................................................................................................... 9-3
3
Lattice Semiconductor
Table of Contents
LatticeXP Family Handbook
Memory Modules................................................................................................................................................ 9-7
Single Port RAM (RAM_DQ) – EBR Based .............................................................................................. 9-7
True Dual Port RAM (RAM_DP_TRUE) – EBR Based ........................................................................... 9-13
Pseudo Dual Port RAM (RAM_DP) – EBR-Based.................................................................................. 9-22
Read Only Memory (ROM) – EBR Based............................................................................................... 9-25
First In First Out (FIFO, FIFO_DC) – EBR Based................................................................................... 9-28
Distributed Single Port RAM (Distributed_SPRAM) – PFU Based.......................................................... 9-32
Distributed Dual Port RAM (Distributed_DPRAM) – PFU Based ............................................................ 9-35
Distributed ROM (Distributed_ROM) – PFU Based ................................................................................ 9-37
Initializing Memory ........................................................................................................................................... 9-39
Initialization File Format .......................................................................................................................... 9-39
Technical Support Assistance.......................................................................................................................... 9-41
Appendix A. Attribute Definitions...................................................................................................................... 9-42
DATA_WIDTH......................................................................................................................................... 9-42
REGMODE.............................................................................................................................................. 9-42
RESETMODE ......................................................................................................................................... 9-42
CSDECODE............................................................................................................................................ 9-42
WRITEMODE.......................................................................................................................................... 9-42
GSR ........................................................................................................................................................ 9-42
LatticeECP/EC and LatticeXP DDR Usage Guide
Introduction ...................................................................................................................................................... 10-1
DDR SDRAM Interfaces Overview................................................................................................................... 10-1
Implementing DDR Memory Interfaces with the LatticeECP/EC Devices........................................................ 10-2
DQS Grouping......................................................................................................................................... 10-2
DDR Software Primitives......................................................................................................................... 10-5
Memory Read Implementation ................................................................................................................ 10-9
Data Read Critical Path......................................................................................................................... 10-12
DQS Postamble .................................................................................................................................... 10-13
Memory Write Implementation .............................................................................................................. 10-14
Design Rules/Guidelines....................................................................................................................... 10-16
QDR II Interface .................................................................................................................................... 10-17
FCRAM (Fast Cycle Random Access Memory) Interface..................................................................... 10-17
Generic High Speed DDR Implementation .................................................................................................... 10-17
Board Design Guidelines ............................................................................................................................... 10-17
Technical Support Assistance........................................................................................................................ 10-18
Appendix A. Using IPexpress™ to Generate DDR Modules.......................................................................... 10-19
DDR Generic......................................................................................................................................... 10-19
DDR Memory Interface ......................................................................................................................... 10-20
Appendix B. Verilog Example for DDR Input and Output Modules ................................................................ 10-21
Appendix C. VHDL Example for DDR Input and Output Modules.................................................................. 10-23
Appendix D. Generic (Non-Memory) High-Speed DDR Interface .................................................................. 10-28
VHDL Implementation ........................................................................................................................... 10-28
Verilog Example .................................................................................................................................... 10-30
Preference File...................................................................................................................................... 10-31
Appendix E. List of Compatible DDR SDRAM ............................................................................................... 10-32
Appendix F. DDR400 Interface using the LatticeEC Evaluation Board.......................................................... 10-35
References..................................................................................................................................................... 10-36
LatticeECP/EC and LatticeXP sysCLOCK PLL Design and Usage Guide
Introduction ...................................................................................................................................................... 11-1
Features ........................................................................................................................................................... 11-1
Functional Description...................................................................................................................................... 11-1
PLL Divider and Delay Blocks................................................................................................................. 11-1
PLL Inputs and Outputs .......................................................................................................................... 11-2
PLL Attributes.......................................................................................................................................... 11-3
4
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