Features ............................................................................................................................................................. 1-1
PFU and PFF Blocks................................................................................................................................. 2-2
Clock Distribution Network ................................................................................................................................. 2-6
Bus Size Matching .................................................................................................................................. 2-12
RAM Initialization and ROM Operation ................................................................................................... 2-12
PIO .......................................................................................................................................................... 2-16
Polarity Control Logic .............................................................................................................................. 2-22
Hot Socketing.......................................................................................................................................... 2-25
Configuration and Testing ................................................................................................................................ 2-26
Density Shifting ................................................................................................................................................ 2-28
DC and Switching Characteristics
Absolute Maximum Ratings ............................................................................................................................... 3-1
Hot Socketing Specifications.............................................................................................................................. 3-2
DC Electrical Characteristics.............................................................................................................................. 3-3
Supply Current (Sleep Mode)............................................................................................................................. 3-3
Supply Current (Standby)................................................................................................................................... 3-4
Initialization Supply Current ............................................................................................................................... 3-5
Programming and Erase Flash Supply Current ................................................................................................. 3-6
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
Differential HSTL and SSTL............................................................................................................................. 3-10
LatticeXP sysCONFIG Port Timing Specifications........................................................................................... 3-26
Flash Download Time ...................................................................................................................................... 3-27
JTAG Port Timing Specifications ..................................................................................................................... 3-27
Switching Test Conditions................................................................................................................................ 3-28
Pinout Information
Signal Descriptions ............................................................................................................................................ 4-1
PICs and DDR Data (DQ) Pins Associated with the DDR Strobe (DQS) Pin .................................................... 4-3
Pin Information Summary................................................................................................................................... 4-4
Power Supply and NC Connections................................................................................................................... 4-6
LFXP3 Logic Signal Connections: 100 TQFP .................................................................................................... 4-7
LFXP3 & LFXP6 Logic Signal Connections: 144 TQFP................................................................................... 4-10
LFXP3 & LFXP6 Logic Signal Connections: 208 PQFP .................................................................................. 4-14
LFXP6 & LFXP10 Logic Signal Connections: 256 fpBGA................................................................................ 4-19
LFXP15 & LFXP20 Logic Signal Connections: 256 fpBGA.............................................................................. 4-26
LFXP10, LFXP15 & LFXP20 Logic Signal Connections: 388 fpBGA............................................................... 4-34
LFXP15 & LFXP20 Logic Signal Connections: 484 fpBGA.............................................................................. 4-43
Ordering Information
Part Number Description.................................................................................................................................... 5-1
Ordering Information .......................................................................................................................................... 5-1
For Further Information ...................................................................................................................................... 6-1
Revision History
Revision History ................................................................................................................................................. 7-1
Open Drain Control ................................................................................................................................... 8-7
Differential SSTL and HSTL Support ................................................................................................................. 8-7
PCI Support with Programmable PCICLAMP .................................................................................................... 8-7
5V Interface with PCI Clamp Diode.................................................................................................................... 8-8
Design Considerations and Usage................................................................................................................... 8-12
Differential SSTL and HSTL.................................................................................................................... 8-13
Technical Support Assistance.......................................................................................................................... 8-13
Verilog for Synplify ........................................................................................................................................... 8-17
Example .................................................................................................................................................. 8-19
Appendix B. sysIO Attributes Using Preference Editor User Interface............................................................. 8-21
Appendix C. sysIO Attributes Using Preference File (ASCII File) .................................................................... 8-22
USE DIN CELL........................................................................................................................................ 8-23
USE DOUT CELL.................................................................................................................................... 8-23
Initialization File Format .......................................................................................................................... 9-39
Technical Support Assistance.......................................................................................................................... 9-41
Appendix A. Attribute Definitions...................................................................................................................... 9-42
QDR II Interface .................................................................................................................................... 10-17
FCRAM (Fast Cycle Random Access Memory) Interface..................................................................... 10-17
Generic High Speed DDR Implementation .................................................................................................... 10-17
Technical Support Assistance........................................................................................................................ 10-18
Appendix A. Using IPexpress™ to Generate DDR Modules.......................................................................... 10-19
Verilog Example .................................................................................................................................... 10-30
Features ........................................................................................................................................................... 11-1
集邦咨询半导体研究中心( DRAM eXchange)表示,2017年第一季度的 DRAM 产业营收表现再度创下新高。从价格方面来看,由于去年第四季严重供不应求,多数PC-OEM厂商选择提早在去年12月洽谈第一季的合约价以确保供货稳定,使得第一季合约价再度上涨超过三成,亦带动其他内存类别同步上扬,如服务器内存在第一季的价格上扬也相当可观,移动式内存价格也有近一成的涨幅。下面就随网络通信小编一...[详细]