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LGM1052

Specification for Approval

厂商名称:Luxpia

厂商官网:http://www.luxpialed.com/en/

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Specification for Approval
(Tentative 1.0)
Part No : LGM1052
comments
LUXPIA Co., Ltd.
Designed by
Checked by
Approved by
NC LED
Approved by Approved by Approved by
/
/
/
/
/
/
Date :
.
.
.
Date :
.
.
.
948-1, Dunsan-Li Bongdong-Eup, Wanju-Gun, JeonBuk, Korea
Tel 82-70-8671-2500
Fax 82-70-8620-8081
LUXPIA CO.,LTD.
-
1. Features
CONTENTS
-
2. Package Outline Dimensions and Materials
3. Absolute Maximum Ratings
4. Electro-Optical Characteristics
5. CIE Chromaticity Diagram
6. Materials
7. Taping
8. Packing
9. Reliability
10. Cautions
11. Warranty
12. Characteristic Diagrams
(Tentative 1.0)
1/15
1. Features
Package : SMD Top View type (1 Chip, 1 Zener in 1 PKG )
5.4 × 5.0 × 1.2 mm
3
(L×W×H) size surface mount type
Viewing angle : extremely wide(120˚)
Soldering methods : IR reflow soldering
2. Package Outline Dimensions and Recommended Solder Patterns
(Tentative 1.0)
2/15
3. Absolute Maximum Ratings
1)
(T
a
=25℃)
item
forward current
pulse forward current
reverse voltage
power dissipation
operating temperature
storage temperature
1)
2)
symbol
I
F
2)
value
90
300
5
320
-30 to +85
-40 to +100
unit
mA
mA
V
mW
I
FP
V
R
P
D
T
opr
T
stg
These values are based on 3-die performance
I
FP
conditions : pulse width
10msec & duty ratio
1/10
4. Electro-Optical Characteristics
(T
a
=25℃)
item
rank
0
forward
voltage
3)
symbol
condition
min
2.80
typ
-
-
-
-
-
-
-
-
-
max
3.00
3.20
3.40
525
unit
1
2
V
F
I
F
= 65mA
3.00
3.20
520
V
Dominant
Wavelength
A
λ
D
B
3E30
I
F
= 65mA
nm
525
3000
3500
530
3500
4000
mcd
4000
4500
4500
5000
luminous
intensity
4)
3E35
I
V
3E40
3E45
I
F
= 65mA
3)
4)
Forward voltages are tested at a current pulse duration of 10 ms and an accuracy within ±0.1V.
The allowance of luminous intensity measurement is within ±11%.
* To avoid optical difference, please do not mix differently ranked product.
* All measurements were made under the standardized environment of LUXPIA.
(Tentative 1.0)
3/15
6. Materials
item
LED chip
wire
lead frame
encapsulation
heat-resistant polymer
material
InGaN
gold
copper alloy/Ni/Ag plating
silicone
PPA
7. Taping
7.1. Tape (material : PS conductive, 10
4
~10
5
Ω)
(unit: mm)
(Tentative 1.0)
4/15
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