型号
- 型号
- 关键词
MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
厂商名称：SHARP
厂商官网：http://sharp-world.com/products/device/
下载文档| 型号 | LH532100BD | LH532100BT | LH532100BN | LH532100BSR | LH532100BS | LH532100BU |
|---|---|---|---|---|---|---|
| 描述 | MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 | MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32 | MASK ROM, 256KX8, 150ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32 | MASK ROM, 256KX8, 150ns, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP |
| 包装说明 | 0.600 INCH, PLASTIC, DIP-32 | 8 X 20 MM, PLASTIC, TSOP1-32 | 0.525 INCH, PLASTIC, SOP-32 | 0.400 INCH, PLASTIC, REVERSE, TSOP2-32 | 0.400 INCH, PLASTIC, TSOP2-32 | 0.450 INCH, PLASTIC, LCC-32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns |
| JESD-30 代码 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | SOP | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | J BEND |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
