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LIA101PTR

Isolation Amplifier, 1 Func, 3750V Isolation-Min, 40MHz Band Width, PDSO16, SOIC-16

器件类别:模拟混合信号IC    放大器电路   

厂商名称:IXYS

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
IXYS
零件包装代码
SOIC
包装说明
SOP, SOP16,.4
针数
16
Reach Compliance Code
unknown
ECCN代码
EAR99
放大器类型
ISOLATION AMPLIFIER
标称带宽 (3dB)
40 MHz
最大共模电压
3750 V
最小绝缘电压
3750 V
JESD-30 代码
R-PDSO-G16
JESD-609代码
e3
长度
10.16 mm
负供电电压上限
-18 V
标称负供电电压 (Vsup)
-15 V
功能数量
1
端子数量
16
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP16,.4
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
电源
+-15 V
认证状态
Not Qualified
座面最大高度
2.108 mm
供电电压上限
18 V
标称供电电压 (Vsup)
15 V
表面贴装
YES
温度等级
INDUSTRIAL
端子面层
MATTE TIN
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
7.5 mm
文档预览
LIA101
Linear Isolation Amplifier
Features
Small Size Standard 16 Pin SOIC or DIP Package
0.01% Servo Linearity
5300 VAC Peak Input/Output Isolation Available
Bandwidth
≥40kHz
Machine Insertable, Wave Solderable
Wide Power Supply Range ±18V
Low Supply Current
Description
The LIA100 and LIA101 are linear isolation amplifiers that
integrate a linear optocoupler with two op amps in a sin-
gle package. They are available in a 16 Pin SOIC or DIP
package.
Applications
Isolated 4-20mA Converter
Medical Sensor Isolation
Switching Power Supply Feedback Circuits
Isolated Temperature/Pressure Sensors
Data Acquisition Equipment
Isolated Motor Controls
Approvals
UL Recognized: File Number E76270
CSA Certified: File Number LR 43639-10
BSI Certified to:
BS EN 60950:1992 (BS7002:1992)
Certificate #: 7344
BS EN 41003:1993
Certificate #: 7344
Ordering Information
Part #
LIA101
LIA101P
LIA101PTR
Description
16 Pin DIP (50/Tube)
16 Pin Flatpack (50/Tube)
16 Pin Flatpack (1000/Reel)
Pin Configuration
LIA100/LIA101 Pinout
1
A1 INPUT
16
A2 INPUT
15
+
14
V
EE2
+
2
V
EE1
V
CC1
3
4
13
V
CC2
12
11
10
9
Output (I
2
)
Output
N.C.
Comp. (to C
F
)
5
LED
6
7
Servo (I
1
)
8
DS-LIA101-RX
www.clare.com
1
LIA101
Absolute Maximum Ratings (@ 25˚ C)
Parameter
Supply Voltages
Differential Input Voltage
Output Short Circuit Duration
Total Package Dissipation
Isolation Voltage
Input to Output
Operational Temperature
Storage Temperature
Soldering Temperature
DIP Package
Surface Mount Package
(10 Seconds Max.)
1
Min
±5
-
-
3750
-40
-40
-
-
Typ Max Units
-
-
-
-
-
-
-
-
±18
± 30
11
-
+85
+125
+260
+220
V
V
-
W
V
RMS
°C
°C
°C
°C
Continuous
Absolute Maximum Ratings are stress ratings. Stresses
in excess of these ratings can cause permanent damage
to the device. Functional operation of the device at these
or any other conditions beyond those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to the absolute maximum ratings
for an extended period may degrade the device and effect
its reliability.
Above 25°C Derate Linearly 1.67mW/°C
Electrical Characteristics @ TA = +25°C and
±VCC = 15VDC (unless otherwise specified)
PARAMETERS
Isolation
Continuous Voltage, AC
Input to Output Leakage Current
Offset Voltage
Output Offset Voltage (VOS)
Amplifier Input Impedance
∆VOS/∆T
Average TC of Input
Offset Voltage
(Input and Output Stage)
Common Mode Rejection Ratio, CMRR
Input Offset Voltage
Common Mode Range
Frequency Response
Bandwidth
Slew Rate
Non-Linearity
Power Supplies
Input Stage Supply Voltage VCC1, VEE1
Output Stage Supply Voltage VCC2, VEE2
Input (A1) & Output Stage (A2) Supply Current
Power Supply Rejection Ratio, PSRR
-
0-10V Step Input
F
O
=300Hz, -10dBm
-
-
-
-
-
-
-
±5
±5
-
-
40
0.3
-
-
-
5
80
-
-
0.01
±18
±18
10
100
kHz
V/µs
%
V
V
mA
dB
60Hz, R
F
=1MΩ
R
IN
=10KΩ, Gain=100
R
S
=50Ω, T
A
=25°C
-
±12
3
-
10
-
mV
V
-
100
-
dB
R
F
=R
IN
=51KΩ, K3=1.000
Input Grounded T
A
=25°C
-
R
S
=50Ω
-
-
10
12
|| 3
5
-
-
|| pF
µV/°C
-
50
-
mV
-
1000V
RMS
, 60Hz
-
-
-
0.2
3750
-
V
RMS
µA
RMS
CONDITIONS
MIN
TYP
MAX
UNITS
2
www.clare.com
Rev. X
LIA101
Electrical Characteristics @ TA = +25°C and
±VCC = 15VDC (unless otherwise specified) (Continued)
PARAMETERS
LED Parameters
Forward LED Current (IF)
LED Forward Voltage Drop (VF)
Reverse LED Current
Reverse LED Voltage
Coupled Characteristics
K1, Servo Gain (I1/IF)
K2, Forward Gain (I2/IF)
K3, Transfer Gain (K2/K1)
K3, Temperature Coefficient
Temperature Range
Operating
Storage
-
-
-40
-40
-
-
+85
+125
°C
°C
I
F
=2-10mA, V
CC
=15V
I
F
=2-10mA, V
CC
=15V
I
F
=2-10mA, V
CC
=15V
Over Temperature Range
0.004
0.004
0.733
-
0.008
0.008
1.000
0.005
0.030
0.030
1.072
-
%/°C
-
I
F
=10mA
V
R
=5V
-
-
0.9
-
-
-
1.2
-
-
20
1.4
10
5
mA
V
µA
V
CONDITIONS
MIN
TYP
MAX
UNITS
K3 Sorted Bins
Bin A = 0.550-0.605
Bin B = 0.606-0.667
Bin C = 0.668-0.732
Bin D = 0.733-0.805
Bin E = 0.806-0.886
Bin F = 0.887-0.974
Bin G = 0.975-1.072
Bin H = 1.073-1.179
Bin I
= 1.180-1.297
Bin J = 1.298-1.426
s
The LIA101 Series (through hole) is shipped in anti-static tubes of 25 pieces. The LIA100P Series
(flatpack) is shipped in anti-static tubes of 50 pieces. Each tube will contain one K3 sorted bin.
s
Bin designation marked on each device (A-J).
s
Orders for the LIA100/LIA100P product will be shipped using bins available at the date of the order.
Any bin (A-J) can be shipped.
s
For customers requiring selected bins D E F G we offer part numbers LIA101/LIA101P.
Rev. X
www.clare.com
3
LIA101
PERFORMANCE DATA*
LED Forward Voltage Drop (V)
LIA100/LIA101
LED Peak Wavelength vs.
Ambient Temperature
900
LIA100/LIA101
Typical LED Forward Voltage Drop
vs. LED Temperature
1.7
1.6
LED Power (%)
1.5
1.4
1.3
1.2
1.1
1.0
80
-40
-20
0
20
40
60
Temperature (°C)
80
100
0
20mA
LIA100/LIA101
LED Power vs. Time @
Die Temperature of 70°C
100
95
Shift in Wavelength - nm
890
880
870
860
850
-50
875nm @ 25°C
90
10mA
5mA
85
-25
0
25
50
75
100
125
20000
40000
60000
80000
100000
Temperature (°C)
Time (Hours)
LIA100/LIA101
LED Power vs. Time @
Die Temperature of 150°C
100
Peak to Peak Output
Swing (V)
LED Power (%)
80
60
40
20
0
0
20000
40000
60000
80000
100000
Time (Hours)
28
24
20
16
12
8
4
0.1
LIA100/LIA101
Op-Amp Output Voltage
Swing vs. R
L
V
S
=
±15V
T
A
= 25°C
LIA100/LIA101
Op-amp Output Voltage Swing
vs. Supply Voltage
40
35
Peak to Peak Output
Swing (V)
30
25
20
15
10
5
0
0
5
10
Supply Voltage (±V)
15
20
R
L
= 2KΩ
T
A
= 25°C
1
Output Load R
L
(KΩ)
10
LIA100/LIA101
Input / Output Leakage Current vs.
RMS Voltage
800
LIA100/LIA101
Individual Op-Amp Supply Current vs.
Supply Voltage
7
LIA100/LIA101
Frequency Response
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
1
(R
F
= R
IN
= 20kΩ, C
F
= 20pF) TA = 25°C
Input/Output
Leakage Current (nA)
Supply Current (mA)
600
500
400
300
200
1
1.5
2
2.5
3
3.5
4
RMS Voltage (kV)
5
4
3
2
1
0
0
5
10
15
20
25
Supply Voltage (V)
T
C
= 25°C
Amplitude (dB)
700
6
10
100
Frequency (kHz)
1000
LIA100/LIA101
Phase Response
0
-10
20
0
LIA100/LIA101
Linearity
LIA100/LIA101
Deviation from Perfect Linearity
5
4
3
2
1
0
-1
-2
-3
-4
-5
-100 -90 -80 -70 -60 -50 -40 -30 -20 -10
Output (dB)
Phase (Degrees)
-20
-30
-40
-50
-60
-70
-80
100
1000
10000
100000
Frequency (Hz)
-40
-60
-80
-100
-120
-120
-100
-80
-60
-40
-20
0
20
Deviation (dB)
Output (dB)
-20
0
10
Input (dB)
LIA100/LIA101
Wideband Noise
0
-20
Noise (dBV)
1
LIA100/LIA101
THD + Noise
-40
-60
-80
-100
-120
10
100
1000
10000
100000
Frequency (Hz)
Percent (%)
0.1
0.01
0.001
0.0001
0.1
1
10
Frequency (kHz)
100
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact
our application department.
4
www.clare.com
Rev. X
LIA101
Mechanical Dimensions
16 Pin DIP Through Hole (Standard)
7.620
±
.254
(.300
±
.010)
3.429 TYP.
(.135)
7.620 TYP.
(.300)
9.144 TYP.
(.360)
6.350
±
.127
(.250
±
.005)
19.202
±
.381
(.756
±
.015)
2.540
±
.127
(.100
±
.005)
PC Board Pattern
(Top View)
2.540
±
.127
16-.800 DIA. (.100
±
.005)
(16-.031 DIA.)
9.144 TYP.
(.360)
6.350
±
.127
(.250
±
.005)
17.780
±
.127
(.700
±
.005)
7.620
±
.127
(.300
±
.005)
.457
±
.076
(.018
±
.003)
17.780
±
.127
(.700
±
.005)
16 Pin SOIC (“P” Suffix)
7.493
±
.051
(.295
±
.002)
7.493
±
.127
(.295
±
.005)
.254
(.010)
10.160
±
.051
(.400
±
.002)
1.270 TYP.
(.050)
PC Board Pattern
(Top View)
1.270
(.050)
10.363
±
.127
(.408
±
.005)
1.981 TYP.
(.078)
2.108 MAX.
(.083)
1.016
(.040)
9.728
±
.051
(.383
±
.002)
1.193
(.047)
.787
(.031)
.406 TYP.
(.016)
8.890 TYP.
(.350)
Tape and Reel Packaging for 16 Pin SOIC Package
330.2 DIA.
(13.00)
Top Cover
Tape Thickness
.102 MAX.
(.004)
12.090
(.476)
3.175
(.125)
6.731 MAX.
(.265)
2.007
±
.102 1.498
±
.102 3.987
±
.102
(.079
±
.004) (.059
±
.004) (.157
±
.004)
1.753
±
.102
(.069
±
.004)
.406 MAX.
(.016)
7.493
±
.102
(.295
±
.004)
1
16
16.002
±
.305
(.630
±
.012)
10.693
±
.025
(.421
±
.001)
Embossed Carrier
Top Cover
Tape
.050R TYP.
11.989
±
.102
(.472
±
.004)
User Direction of Feed
10.897
±
.025
(.429
±
.001)
1.549
±
.102
(.061
±
.004)
Embossment
Dimensions
mm
(inches)
Rev. X
www.clare.com
5
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