Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14
厂商名称:AMD(超微)
厂商官网:http://www.amd.com
下载文档型号 | LM112D | LM212D | LD112 | LM112F | LM312D | LD312 |
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描述 | Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, 0.062 X 0.072 INCH, DIE-8 | Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDFP10, HERMETIC SEALED, CERPACK-10 | Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, 0.062 X 0.072 INCH, DIE-8 |
零件包装代码 | DIP | DIP | DIE | DFP | DIP | DIE |
包装说明 | DIP, DIP14,.3 | HERMETIC SEALED, DIP-14 | DIE, DIE OR CHIP | DFP, FL10,.3 | DIP, DIP14,.3 | DIE, DIE OR CHIP |
针数 | 14 | 14 | 8 | 10 | 14 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 0.003 µA | 0.003 µA | 0.003 µA | 0.003 µA | 0.01 µA | 0.01 µA |
标称共模抑制比 | 85 dB | 85 dB | 85 dB | 85 dB | 80 dB | 80 dB |
频率补偿 | YES | YES | YES | YES | YES | YES |
最大输入失调电压 | 3000 µV | 3000 µV | 3000 µV | 3000 µV | 10000 µV | 10000 µV |
JESD-30 代码 | R-CDIP-T14 | R-CDIP-T14 | R-XUUC-N8 | R-CDFP-F10 | R-CDIP-T14 | R-XUUC-N8 |
低-失调 | NO | NO | NO | NO | NO | NO |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 14 | 14 | 8 | 10 | 14 | 8 |
最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 70 °C | 70 °C |
最低工作温度 | -55 °C | -25 °C | -55 °C | -55 °C | - | - |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
封装代码 | DIP | DIP | DIE | DFP | DIP | DIE |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIE OR CHIP | FL10,.3 | DIP14,.3 | DIE OR CHIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | UNCASED CHIP | FLATPACK | IN-LINE | UNCASED CHIP |
电源 | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | +-5/+-15 V | +-5/+-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA | 0.8 mA | 0.8 mA |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | NO | YES | YES | NO | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | OTHER | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD |
端子位置 | DUAL | DUAL | UPPER | DUAL | DUAL | UPPER |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | - |
厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
25C 时的最大偏置电流 (IIB) | 0.002 µA | 0.002 µA | - | 0.002 µA | 0.007 µA | - |
JESD-609代码 | e0 | e0 | - | e0 | e0 | - |
长度 | 19.431 mm | 19.431 mm | - | 6.1595 mm | 19.431 mm | - |
座面最大高度 | 5.08 mm | 5.08 mm | - | 2.032 mm | 5.08 mm | - |
供电电压上限 | 20 V | 20 V | - | 20 V | 20 V | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子节距 | 2.54 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | - |
最小电压增益 | 25000 | 25000 | - | 25000 | 15000 | - |
宽度 | 7.62 mm | 7.62 mm | - | 6.35 mm | 7.62 mm | - |