型号
- 型号
- 关键词
IC DUAL COMPARATOR, 7000 uV OFFSET-MAX, 80 ns RESPONSE TIME, CDIP14, DIP-14, Comparator
厂商名称：National Semiconductor（TI ）
厂商官网：http://www.ti.com
器件标准：
| 型号 | LM119J/NOPB | LM119H-MLS | LM219J/NOPB | LM119W-MLS |
|---|---|---|---|---|
| 描述 | IC DUAL COMPARATOR, 7000 uV OFFSET-MAX, 80 ns RESPONSE TIME, CDIP14, DIP-14, Comparator | IC DUAL COMPARATOR, 7000 uV OFFSET-MAX, 80 ns RESPONSE TIME, MBCY10, METAL CAN-10, Comparator | IC DUAL COMPARATOR, 7000 uV OFFSET-MAX, 80 ns RESPONSE TIME, CDIP14, DIP-14, Comparator | IC DUAL COMPARATOR, 7000 uV OFFSET-MAX, 80 ns RESPONSE TIME, CDFP10, W10A, Comparator |
| 零件包装代码 | DIP | BCY | DIP | DFP |
| 包装说明 | DIP, | METAL CAN-10 | DIP, | DFP, |
| 针数 | 14 | 10 | 14 | 10 |
| Reach Compliance Code | compliant | unknown | compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| 最大平均偏置电流 (IIB) | 1 µA | 1 µA | 1 µA | 1 µA |
| 最大输入失调电压 | 7000 µV | 7000 µV | 7000 µV | 7000 µV |
| JESD-30 代码 | R-GDIP-T14 | O-MBCY-W10 | R-GDIP-T14 | R-GDFP-F10 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 10 | 14 | 10 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -25 °C | -55 °C |
| 输出类型 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 封装主体材料 | CERAMIC, GLASS-SEALED | METAL | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CYLINDRICAL | IN-LINE | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称响应时间 | 80 ns | 80 ns | 80 ns | 80 ns |
| 供电电压上限 | 18 V | 36 V | 18 V | 36 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | OTHER | MILITARY |
| 端子形式 | THROUGH-HOLE | WIRE | THROUGH-HOLE | FLAT |
| 端子位置 | DUAL | BOTTOM | DUAL | DUAL |
| 厂商名称 | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 封装代码 | DIP | - | DIP | DFP |
| 座面最大高度 | 5.08 mm | - | 5.08 mm | 2.032 mm |
| 端子节距 | 2.54 mm | - | 2.54 mm | 1.27 mm |
| 宽度 | 7.62 mm | - | 7.62 mm | 6.3246 mm |
