If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Input Supply Voltage
ON/OFF Pin Voltage
Switch Voltage to Ground (Note 12)
Boost Pin Voltage
Feedback Pin Voltage
Power Dissipation
45V
−0.1V to 6V
−1V to V
IN
V
SW
+ 8V
−0.3V to 14V
Internally Limited
ESD (Note 2)
Storage Temperature Range
Soldering Temperature
Wave
Infrared
Vapor Phase
2 kV
−65°C to 150°C
4 sec, 260°C
10 sec, 240°C
75 sec, 219°C
Operating Ratings
Supply Voltage
Junction Temperature Range (T
J
)
8V to 40V
−40°C to 125°C
Electrical Characteristics
LM2676-3.3
Symbol
V
OUT
η
Parameter
Output Voltage
Efficiency
Limits appearing in
bold type face
apply over the entire junction temperature range
of operation, −40°C to 125°C. Specifications appearing in normal type apply for T
A
= T
J
= 25°C.
Conditions
V
IN
= 8V to 40V, 100mA
≤
I
OUT
≤
3A
V
IN
= 12V, I
LOAD
= 3A
Typical
(Note 3)
3.3
86
Min
(Note 4)
3.234/3.201
Max
(Note 4)
3.366/3.399
Units
V
%
LM2676-5.0
Symbol
V
OUT
η
Parameter
Output Voltage
Efficiency
Conditions
V
IN
= 8V to 40V, 100mA
≤
I
OUT
≤
3A
V
IN
= 12V, I
LOAD
= 3A
Typical
(Note 3)
5.0
88
Min
(Note 4)
4.900/4.850
Max
(Note 4)
5.100/5.150
Units
V
%
LM2676-12
Symbol
V
OUT
η
Parameter
Output Voltage
Efficiency
Conditions
V
IN
= 15V to 40V, 100mA
≤
I
OUT
≤
3A
V
IN
= 24V, I
LOAD
= 3A
Typical
(Note 3)
12
94
Min
(Note 4)
11.76/11.64
Max
(Note 4)
12.24/12.36
Units
V
%
LM2676-ADJ
Symbol
V
FB
η
Parameter
Conditions
Typ
(Note 3)
1.21
88
Min
(Note 4)
1.186/1.174
Max
(Note 4)
1.234/1.246
Units
Feedback Voltage V
IN
= 8V to 40V, 100mA
≤
I
OUT
≤
3A
V
OUT
Programmed for 5V
Efficiency
V
IN
= 12V, I
LOAD
= 3A
V
%
3
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LM2676
All Output Voltage Versions
Electrical Characteristics
Limits appearing in
bold type face
apply over the entire junction temperature range of operation, −40°C to 125°C.
Specifications appearing in normal type apply for T
A
= T
J
= 25°C. Unless otherwise specified V
IN
=12V for the 3.3V, 5V and Ad-
justable versions and V
IN
=24V for the 12V version.
Symbol
I
Q
Parameter
Quiescent Current V
FEEDBACK
= 8V
For 3.3V, 5.0V, and ADJ Versions
V
FEEDBACK
= 15V
For 12V Versions
I
STBY
I
CL
I
L
Standby Quiescent ON/OFF Pin = 0V
Current
Current Limit
Output Leakage
Current
Switch On-
Resistance
Oscillator
Frequency
Duty Cycle
Feedback Bias
Current
ON/OFF
Threshold Voltage
ON/OFF Input
Current
Thermal
Resistance
ON/OFF Input = 0V
T Package, Junction to Ambient
(Note 5)
T Package, Junction to Ambient
(Note 6)
T Package, Junction to Case
S Package, Junction to Ambient
(Note 7)
S Package, Junction to Ambient
(Note 8)
S Package, Junction to Ambient
(Note 9)
S Package, Junction to Case
SD Package, Junction to Ambient
(Note 10)
SD Package, Junction to Ambient
(Note 11)
V
IN
= 40V, ON/OFF Pin = 0V
V
SWITCH
= 0V
V
SWITCH
= −1V
I
SWITCH
= 3A
Measured at Switch Pin
Maximum Duty Cycle
Minimum Duty Cycle
V
FEEDBACK
= 1.3V
ADJ Version Only
50
4.5
3.8/3.6
100/150
5.25/5.4
200
15
0.17/0.29
225
280
μA
A
μA
mA
Ω
kHz
%
%
nA
Conditions
Typ
4.2
Min
Max
6
Units
mA
DEVICE PARAMETERS
16
0.15
260
91
0
85
R
DS(ON)
f
O
D
I
BIAS
V
ON/OFF
I
ON/OFF
θ
JA
θ
JA
θ
JC
θ
JA
θ
JA
θ
JA
θ
JC
θ
JA
θ
JA
1.4
20
65
45
2
56
35
26
2
55
29
0.8
2.0
45
V
μA
°C/W
++
°C/W
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4
LM2676
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings indicate conditions under which of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test condition, see the electrical
Characteristics tables.
Note 2:
ESD was applied using the human-body model, a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Note 3:
Typical values are determined with T
A
= T
J
= 25°C and represent the most likely norm.
Note 4:
All limits are guaranteed at room temperature (standard type face) and at
temperature extremes (bold type face).
All room temperature limits are 100%
tested during production with T
A
= T
J
= 25°C. All limits at temperature extremes are guaranteed via correlation using standard standard Quality Control (SQC)
methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 5:
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a
PC board with minimum copper area.
Note 6:
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC
board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
Note 7:
Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as
the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 8:
Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area
of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 9:
Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times
the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers
Made Simple
®
software.
Note 10:
Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area equal to the die attach paddle.
Note 11:
Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area using 12 vias to a second layer of copper equal to die
attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to Application Note AN-1187.
Note 12:
The absolute maximum specification of the 'Switch Voltage to Ground' applies to DC voltage. An extended negative voltage limit of -8V applies to a
pulse of up to 20 ns, -6V of 60 ns and -3V of up to 100 ns.
据外媒报道，尽管今天微软正式对外宣布停止销售Lumia系列手机，不过微软却并没有放弃移动业务。近日，微软公司CEO纳德拉在Make Me Smart播客中与粉丝交流时再次重申，公司并不会放弃智能手机相关业务，并且会推出更多形态的手机。 纳德拉再次重申：微软会推出更多形态手机（图片来自于thurrott） 纳德拉承认在未来将会推出更多种类的移动设备，而他们接下来挑战的就是形态和功能。...[详细]
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